Material property monitoring and detection using wireless devices

ABSTRACT

Embodiments of the present invention provide devices (tags with sensors), systems, and methods to determine states (such as, but not limited to, complex impedance) of materials-of-interest, such as tissue-of-interest, implants, and construction members, to name a few, in a non-invasive and contactless way; and using comparatively safe and/or low energy electromagnetic radiation, such as radio waves. Negligible-sized wireless-tags with sensors are implanted in such materials-of-interest. Using wireless communication and imaging technology, the states of the materials-of-interest may be monitored; which may allow non-invasive and contactless detection of problems such as cracking, bending, excessive pressure, improper temperature, and/or the like. Additionally, initially unknown locations of the implanted negligible-sized wireless-tags with sensors may be readily determined upon a given scanning (reading) session; and thus mapped to provide an effective image of the material-of-interest.

PRIORITY NOTICE

The present application claims priority under 35 U.S.C. § 119(e) to U.S.Provisional Patent Application Ser. No. 62/363,392 filed on Jul. 18,2016; and the present application claims priority under 35 U.S.C. §119(e) to U.S. Provisional Patent Application Ser. No. 62/363,413 filedon Jul. 18, 2016, the disclosures of which are both incorporated hereinby reference in their entirety.

The present application claims priority under 35 U.S.C. § 119(e) to U.S.Provisional Patent Application Ser. No. 62/363,481 filed on Jul. 18,2016; and the present application claims priority under 35 U.S.C. §119(e) to U.S. Provisional Patent Application Ser. No. 62/363,551 filedon Jul. 18, 2016, the disclosures of which are both incorporated hereinby reference in their entirety.

The present patent application is a continuation-in-part (CIP) of U.S.non-provisional patent application Ser. No. 15/418,414 filed on Jan. 27,2017; wherein this present patent application claims priority to saidU.S. non-provisional patent application under 35 U.S.C. § 120. Theabove-identified parent U.S. non-provisional patent application isincorporated herein by reference in their entirety as if fully set forthbelow.

The present patent application is a continuation-in-part (CIP) of U.S.non-provisional patent application Ser. No. 15/607,673 filed on May 29,2017; wherein this present patent application claims priority to saidU.S. non-provisional patent application under 35 U.S.C. § 120. Theabove-identified parent U.S. non-provisional patent application isincorporated herein by reference in their entirety as if fully set forthbelow.

TECHNICAL FIELD OF THE INVENTION

The present invention relates in general to monitoring states ofmaterials of interest and, more specifically, to monitoring states ofmaterials of interest using wireless sensor tags and where the materialsof interest may have uses in dental, medical, and/or constructionfields.

COPYRIGHT AND TRADEMARK NOTICE

A portion of the disclosure of this patent application may containmaterial that is subject to copyright protection. The owner has noobjection to the facsimile reproduction by anyone of the patent documentor the patent disclosure, as it appears in the Patent and TrademarkOffice patent file or records, but otherwise reserves all copyrightswhatsoever.

Certain marks referenced herein may be common law or registeredtrademarks of third parties affiliated or unaffiliated with theapplicant or the assignee. Use of these marks is by way of example andshould not be construed as descriptive or to limit the scope of thisinvention to material associated only with such marks.

BACKGROUND OF THE INVENTION

Prior art imaging techniques, such as, X-ray, CT-scan, MRI, ultrasound,radar, and/or the like generally involve expensive (expensive to buy,lease, use, train, maintain, etc.), specialized, complicated equipment,and/or equipment that may occupy a relatively large footprint. And inmany applications the electromagnetic energy emitted for imagingpurposes from some prior art imaging systems may be dangerous ordestructive to the object being imaged and thus such imaging must beminimized to prevent problems from overexposure. A prime example of thisis the use of X-rays to image hard (dense) structures in biologicsamples, such as teeth and bones in vertebrates; where overexposure toX-rays may lead to undesirable mutations and cancers. And even in thecase of inanimate objects, such objects may also still be prone todeterioration (e.g., becoming brittle) resulting from overexposure toemitted high energy imaging electromagnetic radiation, such as X-rays.In many instances, if overexposure was not a problem, practitionerswould then prefer to utilize such imaging techniques more frequentlythus significantly increasing probability of discovering issues earlierin time. In some instances, such as with cancer patients or withpregnant women, use of X-rays is necessarily restricted.

There is a need in the art for imaging techniques that in comparison topreexisting imaging techniques of X-ray, CT-scan, MRI, ultrasound,radar, and/or the like would be comparatively less expensive toimplement; and/or would require a smaller equipment footprint toutilize. Additionally, there is a need in the art for a non-invasive,contactless, imaging techniques that may utilize comparatively lessenergetic electromagnetic spectra, such as radio waves to communicateinformation that upon analysis may yield imaging results and other stateinformation of a given material-of-interest to be imaged.

It is to these ends that the present invention has been developed.Embodiments of the present invention may provide novel ways of analyzing(monitoring and/or tracking) current states, structural integrity, andvarious qualities of various materials-of-interest; with applications inmedical care, dentistry, and construction and engineering without use ofpreexisting imaging techniques that may use X-ray, CT-scan, MRI,ultrasound, and/or a reliance upon dangerous imaging techniquesutilizing ionizing radiation. Examples of materials-of-interest mayinclude, but may not be limited to: dental fillings, root canals, dentalcrowns, dental sealants and resins, dental and other medical implants,and other structures used in medicine, dentistry and/or constructionand/or engineering.

Using minimization advances in microelectronics and processmanufacturing techniques, negligibly-sized micro-sensors may beimplanted in the material-of-interest to be analyzed (monitored and/ortracked). In some applications, implantation of such negligibly-sizedmicro-sensors may be done prior to the given material-of-interest curingand/or hardening, e.g., a dental filling. Using the disclosed imagingtechnology, subsequent to the completion of such curing or hardening,the current state, e.g., the structural integrity, may be scanned(imaged) to determine possible problems in the material-of-interest suchas, but not limited to, possible fracturing, cracking, bending,twisting, excessive pressure, abnormal temperature, foreign materials orliquids penetration, and the like. And such analysis may be donenon-invasively, without use of ionizing radiation in some applications,and reading of the implanted negligibly-sized micro-sensors may beremotely measured. Thus, such scanning (i.e., reading or imaging) may bedone comparatively much more frequently that would be permitted if thepractitioner had to rely upon using X-ray imaging.

The present invention has also been developed in order to detectspecific problems, conditions, and/or substances, such as, but notlimited to, biological cells (e.g., foreign cells, abnormal cells,cancerous cells, etc.), infection, fever, inflammation, antigens,antibodies, foreign substances, tissue conditions, ailments, and/or thelike. Detection may be a subset of monitoring; wherein devices disclosedherein, as well, as in the accompanying drawings, are capable ofmonitoring and detection in materials of interest.

The disclosed imaging techniques may not require a power source in theimplanted negligibly-sized micro-sensors. Energy required for theoperation of the implanted negligibly-sized micro-sensors may beharvested from external electromagnetic energy sources during thereading (scanning) process.

Embodiments of the present invention may also establish locations (e.g.,positions or coordinates) of wireless-devices with the implantednegligibly-sized micro-sensors. Such location determination may utilizewell-known LPS (local positioning systems) techniques, that may involveuse of triangulation, trilateration, multilateration, combinationsthereof, and the like; as well as involve solving various nonlinearequations using various well-known techniques. Embodiments of thepresent invention may provide contactless ways of determining real-timelocations as well as real-time sensor readings of and from theseimplanted negligibly-sized wireless-devices with sensors, which overtime and over differently placed implanted negligibly-sizedwireless-devices with sensors may yield information as to the variouscurrent states and changes in state of the given material-of-interestthat is being monitored.

Embodiments of the present invention may also establish locations (e.g.,positions or coordinates) of wireless-devices with the implantednegligibly-sized micro-sensors without utilizing LPS (local positioningsystems) techniques.

These wireless-devices (with sensors or without sensors) may be referredto as RFID tags or Near-Field Communication (NFC) devices. Distances(ranges) between these wireless-devices (with sensors or withoutsensors) and various readers may readily be determined. The reader mayemit various electromagnetic (EM) signals and may receive back wireless(returned) electromagnetic signals (e.g., “backscattered”) from thewireless-devices (with sensors or without sensors). And from suchreturning wireless electromagnetic (EM) signals (such as, but notlimited to backscatter electromagnetic signals), distances (ranges) aswell as location determination and readings from sensors may then beutilized to analyze various states of the material-of-interest beingmonitored.

Localization (location determination) of wireless-devices usingwell-known LPS (local positioning systems) techniques, that may involveuse of triangulation, trilateration, multilateration, combinationsthereof, and/or the like is well understood in the relevant art. Forexample, range measurements between readers and wireless-devices may bebased on a number of prior art techniques, among them determining rangesbased on phase differences between transmitted and wireless (returned)signals (e.g., “backscattered”), Returned Signal Strength (RSSI), and/orother means. For example, trilateration may be a well-known technique ofdetermining three-dimensional (3D) coordinates of an object using themeasured ranges (distances) from that object to three or more otherobjects with known three-dimensional (3D) coordinates. Triangulation mayanother well-known technique in this context.

BRIEF SUMMARY OF THE INVENTION

To minimize the limitations in the prior art, and to minimize otherlimitations that will be apparent upon reading and understanding thepresent specification, embodiments of the present invention describedevices (tags), systems, and methods to determine structural integrityand other states of materials-of-interest, such as dental fillings,implants, and root canal posts, to name a few, in a non-invasive andcontactless way; and using comparatively safe and/or low energyelectromagnetic (EM) radiation, such as, but not limited to, radio wavesand/or magnetic fields for coupled magnetic induction communication.

For example, and without limiting the scope of the present invention, insome embodiments, such a system may comprise one or moremonitoring-sensor-tags and one or more readers. The one or moremonitoring-sensor-tags may be attached to the material-of-interest. Thematerial-of-interest may be selected from a dental-filling, aroot-canal-post, a dental-crown, an article implantable within a body ofan organism, the article attachable to the body of the organism,specific tissue of the organism, a construction member, and/or the like.The one or more monitoring-sensor-tags may comprise at least oneelectric circuit, at least one antenna (a first-antenna), and at leastone sensor. The at least one electric circuit may be in communicationwith the at least one antenna (the first-antenna) and the at least onesensor. The one or more readers may comprise one or moresecond-antennas. The one or more readers using the one or moresecond-antennas may transmit electromagnetic (EM) radiation of apredetermined characteristic. The first-antenna may receive thiselectromagnetic (EM) radiation of the predetermined characteristic as aninput. This input may cause the at least one electric circuit to takeone or more readings from the at least one sensor; and may then transmitthe one or more readings using the first-antenna back to the one or moresecond-antennas. At least one of the second-antennas selected from theone or more second-antennas may then receive the one or more readings.The one or more readers or a device (e.g., a computer) in communicationwith the one or more readers may then use the one or more readings todetermine the current state of the material-of-interest.

It is an objective of the present invention to provide an imaging systemand an imaging method that may be comparatively less expensive to useand implement as compared against traditional X-ray, CT-scan, MRI,ultrasound, radar, or the like imaging systems.

It is another objective of the present invention to provide an imagingsystem and an imaging method that may be comparatively easy and simpleto use and implement as compared against traditional X-ray, CT-scan,MRI, ultrasound, radar, or the like imaging systems.

It is another objective of the present invention to provide an imagingsystem and imaging method that comparatively utilizes as smallerequipment footprint as compared against traditional X-ray, CT-scan, MRI,ultrasound, radar, or the like imaging systems.

It is another objective of the present invention to provide devices(tags), systems, and methods to determine structural integrity and otherstates of a given materials-of-interest in a non-invasive andcontactless way.

It is another objective of the present invention to provide devices(tags), systems, and methods to determine structural integrity and otherstates of a given materials-of-interest using comparatively safe and/orlow energy electromagnetic (EM) radiation, such as radio waves, and/ormagnetic fields for magnetic induction communication.

It is another objective of the present invention to providewireless-tags with sensors (monitoring-sensor-tags) that may beimplantable into a given type of material-of-interest as discussedherein.

It is another objective of the present invention to providewireless-tags with sensors wherein the sensors may be of different typesfor measuring different qualities, properties, and/or characteristics.

It is yet another objective of the present invention to determinelocations of wireless-tags with sensors (monitoring-sensor-tags), thatmay be implantable into a given type of material-of-interest, over timein the same monitoring-sensor-tag and/or as compared against differentimplanted monitoring-sensor-tags.

These and other advantages and features of the present invention aredescribed herein with specificity so as to make the present inventionunderstandable to one of ordinary skill in the art, both with respect tohow to practice the present invention and how to make the presentinvention.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

Elements in the figures have not necessarily been drawn to scale inorder to enhance their clarity and improve understanding of thesevarious elements and embodiments of the invention. Furthermore, elementsthat are known to be common and well understood to those in the industryare not depicted in order to provide a clear view of the variousembodiments of the invention.

FIG. 1A may depict a schematic block diagram of a reader.

FIG. 1B may depict a schematic block diagram of a monitoring-sensor-tag.

FIG. 2A may depict a schematic block diagram of a monitoring-sensor-tagcomprising a capacitive-based sensor.

FIG. 2B may depict a schematic block diagram of a monitoring-sensor-tagcomprising a resistance-based sensor.

FIG. 2C may depict a schematic block diagram of a monitoring-sensor-tagcomprising an inductance-based sensor.

FIG. 2D may depict a schematic block diagram of a monitoring-sensor-tagcomprising a capacitive-based sensor and a resistance-based-sensor.

FIG. 2E may depict a schematic block diagram of a monitoring-sensor-tagcomprising a capacitive-based sensor and an inductance-based-sensor.

FIG. 2F may depict a schematic block diagram of a monitoring-sensor-tagcomprising a resistance-based sensor and an inductance-based-sensor.

FIG. 2G may depict a schematic block diagram of a monitoring-sensor-tagcomprising a capacitive-based sensor, a resistance-based sensor, and aninductance-based-sensor.

FIG. 3 may be a circuit diagram of a ring oscillator implementing acapacitance measurement circuit.

FIG. 4A may be a perspective view of a basic capacitor.

FIG. 4B may be a perspective view of a capacitor with substantiallyparallel regions of a conductive surface of type “A.”

FIG. 4C may be a top view of a capacitor; with substantially parallelregions of a conductive surface of type “B”; and with substantiallyparallel regions of a conductive surface of type “C.”

FIG. 4D may be a top view of a capacitor; with regions of a conductivesurface of type “D”; and with regions of a conductive surface of type“E.”

FIG. 4E may be a top view of a capacitor, with regions of a conductivesurface of type “F.”

FIG. 5A may be a circuit diagram of a ring oscillator implementing acapacitance measurement circuit.

FIG. 5B may be a circuit diagram of a C-MOS pair digital invertor.

FIG. 6 may be a circuit diagram of a ring oscillator implementing aresistance measurement circuit.

FIG. 7A may be a top view of an example of a stress sensor used in someembodiments of the present invention.

FIG. 7B may be a top view of an example of a stress sensor used in someembodiments of the present invention.

FIG. 7C may be a top view of an example of a stress sensor used in someembodiments of the present invention.

FIG. 8 may be a diagrammatical top view of a monitoring-sensor-tag'sstructure and components, as used in some embodiments of the presentinvention.

FIG. 9 may be a diagram of control and status signals, in accordancewith some embodiments of the present invention.

FIG. 10A may be a diagram of a patient's tooth with one or moremonitoring-sensor-tags placed in dental-filling as amaterial-of-interest, in accordance with some embodiments of the presentinvention.

FIG. 10B may be a diagram of a patient's tooth with one or moremonitoring-sensor-tags placed in: a root-canal-cavity, in aroot-canal-post, and/or in a dental-crown; in accordance with someembodiments of the present invention.

FIG. 10C may be a diagram of a patient's tooth dental-implant with oneor more monitoring-sensor-tags, in accordance with some embodiments ofthe present invention.

FIG. 10D may be a diagram of a first-sensor-tag and a second-sensor-tagarranged in a material-of-interest with an initial predetermined spacingbetween the first-sensor-tag and the second-sensor-tag in thismaterial-of-interest.

FIG. 11A may be a diagrammatical top view of areader-and-calibration-member, in accordance with some embodiments ofthe present invention.

FIG. 11B may be a diagrammatical top view of areader-and-calibration-member, in accordance with some embodiments ofthe present invention.

FIG. 11C may be a diagrammatical top view of areader-and-calibration-member with an antenna interface, in accordancewith some embodiments of the present invention.

FIG. 12 may be a diagrammatical side view (or a top view) of aposition-reference-member, in accordance with the present invention.

FIG. 13A may depict a system for non-invasive monitoring of amaterial-of-interest with one or more monitoring-sensor-tags that may bein and/or on a patient; wherein the system comprises atranslating-scan-member that may translate along a predetermined path ofmotion.

FIG. 13B may depict a system for non-invasive monitoring of amaterial-of-interest with one or more monitoring-sensor-tags that may bein and/or on a patient; wherein the system comprise areader-housing-member with one or more readers that may communicate withthe one or monitoring-sensor-tags.

FIG. 13C may depict a system for non-invasive monitoring of amaterial-of-interest with one or more monitoring-sensor-tags that may bein and/or on a patient; wherein the system comprises atranslating-scan-member that may translate along a predetermined path ofmotion.

FIG. 14A may be a schematic view of a single monitoring-sensor-tag and aplurality of readers that may communicate (wirelessly) with the singlemonitoring-sensor-tag.

FIG. 14B may be a schematic view of a single monitoring-sensor-tag and asingle reader; wherein the single reader may translate with respect tothe single monitoring-sensor-tag; and wherein the single reader and thesingle monitoring-sensor-tag may be in wireless communication.

FIG. 15 may depict a flow diagram illustrating steps in a method fornon-invasive monitoring of a material-of-interest with one or moremonitoring-sensor tag using one or more readers.

FIG. 16 may depict a flow diagram illustrating a method for calibratinga system (shown in FIG. 18) based on one or more reference-sensor-tags.

FIG. 17 may depict a flow diagram for determining location of one ormore monitoring-sensor-tags associated with a material-of-interest.

FIG. 18 may depict a block diagram of a device, a reader, a processor,memory, a display, a position-reference-member, and amaterial-of-interest with one or more monitoring-sensor-tags.

FIG. 19A may depict a graph showing a physical relationship betweencomplex permittivity and changes in frequency.

FIG. 19B may depict a perspective view of a capacitor connected to analternating current (AC) voltage source.

FIG. 19C may depict a schematic view of a capacitor representativecircuit.

FIG. 19D may depict a schematic view of a capacitor representativecircuit connected to an alternating current (AC) voltage source.

FIG. 19E may show how complex permittivity of a given material(including biologic materials) may vary according to changes inexcitation source(s), as well as changes in frequency.

FIG. 19F may be a view of a capacitor connected to an alternatingcurrent (AC) voltage source, wherein a dielectric material, disposedbetween opposing capacitor plates of the capacitor, may be exposed toone or more types of excitation sources, of predeterminedcharacteristics.

FIG. 20A may depict a schematic view of a complex-monitoring-sensor-tag.

FIG. 20B may depict a schematic block diagram of acomplex-monitoring-sensor-tag, similar to that as shown in FIG. 20A, butwherein in FIG. 20B, the complex-monitoring-sensor-tag may furthercomprise an array-of-excitation-sources, that may comprise one or moreexcitation sources.

FIG. 21A may depict a schematic view of an example of measuring compleximpedance using an alternating AC voltage source.

FIG. 21B may depict a schematic view of an example of measuring compleximpedance using an alternating AC current source.

FIG. 22A may depict a schematic view of an example of a two electrodeelectrochemical impedance spectroscopy (EIS) application.

FIG. 22B may depict a schematic view of an example of a four electrodeelectrochemical impedance spectroscopy (EIS) application.

FIG. 23A may depict a schematic view of an example of a four terminal(electrode) portion of a complex impedance sensor.

FIG. 23B may depict a schematic view of an example of a four terminal(electrode) portion of a complex impedance sensor.

FIG. 23C may depict a schematic view of an example of a four terminal(electrode) portion of a complex impedance sensor.

FIG. 23D may be a view of two different opposed terminal probes; ofregions of a conductive surface of type “K” mounted to a givenmaterial-of-interest, with different IR lights sources disposed betweenthe probes and capable of emitting different IR light to the givenmaterial-of-interest.

FIG. 24A may depict a system for monitoring and/or tracking,non-invasively, a state of skin or of tissue, using a cast-or-bandagewith lattice-of-sensors that may be in communication with areader-and-calibration-member and/or with a device (e.g., a mobilecomputer).

FIG. 24B may depict a schematic view of lattice-of-sensors.

FIG. 24C may depict a system for monitoring and/or tracking,non-invasively, a state of breast skin or of breast tissue, using anarticle-in-lattice-contact (e.g., a bra) with lattice-of-sensors thatmay be in communication with a reader-and-calibration-member and/or witha device (e.g., a mobile computer).

FIG. 24D may depict a portion of an article-in-lattice-contact (e.g., abra) or a portion of a cast-or-bandage (e.g., a cast or bandage),showing lattice-of-sensors on the interior-surface.

FIG. 24E may depict a diagram showing at least one lattice-of-sensorsthat may be imbedded within a given implant.

FIG. 24F may depict a diagram showing at least one lattice-of-sensorsthat may be mounted on (attached to) an external surface of a givenimplant.

FIG. 25A may depict a schematic view of a complex-monitoring-sensor-tag,showing details of a complex-impedance-measurement-circuit.

FIG. 25B may depict a schematic view of a complex-monitoring-sensor-tag,showing details of a complex-impedance-measurement-circuit.

FIG. 25C may depict a schematic view of a complex-monitoring-sensor-tag,showing details of a complex-impedance-measurement-circuit.

FIG. 25D may depict additional details of thecomplex-monitoring-sensor-tag of FIG. 20B, in a schematic block diagram.

FIG. 26 may depict may depict a perspective view of a portion of amaterial-of-interest with monitoring-sensor-tags.

FIG. 27A may depict a top view of an imaging-device rolling along anexterior surface of a material-of-interest.

FIG. 27B may depict a top view of a reader-assembly.

FIG. 27C may depict an orthogonal view (e.g., a side view) of thereader-assembly of FIG. 27B.

FIG. 28 may depict a perspective view of a portion of amaterial-of-interest with monitoring-sensor-tags; and may also depict animaging-device, a position-reference-member, and a predeterminedcoordinate system.

FIG. 29A may depict a schematic view of a position-reference-member witha transmitter.

FIG. 29B may depict a schematic view of the transmitter of FIG. 29Aconnected to a device, such as a computer.

FIG. 30 may depict a perspective view of a portion of amaterial-of-interest: with reader-and-calibration-members, aposition-reference-member, monitoring-sensor-tags, and a predeterminedcoordinate system.

FIG. 31 may depict possible wireless communication pathways for atransmitter.

FIG. 32 may depict a flow diagram illustrating steps in a method fornon-invasive monitoring of a material-of-interest with one or morecomplex-monitoring-sensor-tag(s) employing electrochemical impedancespectroscopy (EIS).

REFERENCE NUMERAL SCHEDULE

-   100 reader 100-   110 antenna 110 (second-antenna 110)-   120 monitoring-sensor-tag 120-   130 antenna 130 (first-antenna 130)-   140 electric circuit 140-   202 capacitive-based sensor 202-   203 resistance-based sensor 203-   204 processing circuitry 204-   205 capacitance measurement circuit 205-   206 resistance measurement circuit 206-   207 wireless-receiver-and-transmitter 207-   208 inductance-based-sensor 208-   209 inductance measurement circuit 209-   300 load capacitor 300-   310 digital inventor 310 (e.g., a C-MOS pair 310)-   340 capacitive-based sensor 340-   350 ring oscillator 350-   400 plate 400-   401 dielectric material 401-   402 conductive surface type “A” 402-   403 substrate 403-   404 conductive surface type “B” 404-   405 conductive surface type “C” 405-   406 conductive surface type “D” 406-   407 conductive surface type “E” 407-   408 conductive surface type “F” 408-   500 ring oscillator 500-   501 switch 501-   502 P-MOS transistor 502-   503 N-MOS transistor 503-   600 ring oscillator 600-   601 load resistor 601-   602 strain-influenced resistor 602-   700 strain-influenced resistor 700-   701 thin-film-coating 701-   702 substrate 702-   703 spiral-formed-electric-conductor 703-   801 sensor-portion 801-   802 processing-portion 802-   930 CLOCK 930-   931 RESTART_COUNT signal 931-   932 COUNTER 932-   933 COUNTER_OVERFLOW signal 933-   934 zero value 934-   935 0-to-1 transition of Pulse of Counter Overflow signal 935-   936 1-to-0 transition of Pulse of Counter Overflow signal 936-   937 maximal value 937-   938 Pulse of RESTART_COUNT signal 938-   1000 tooth 1000-   1001 dental-filling 1001-   1002 gum 1002-   1003 root-canal-cavity 1003-   1004 root-canal-post 1004-   1005 dental-crown 1005-   1006 standalone-strain-sensor 1006-   1007 dental-implant 1007-   1008 implant-post 1008-   1020 first-sensor-tag 1020-   1021 second-sensor-tag 1021-   1023 lattice-of-sensors 1023-   1025 initial predetermined spacing 1025-   1026 sensor-spacing 1026-   1028 material-of-interest 1028-   1102 reference-sensor-tags 1102-   1107 reference-housing-member 1107-   1108 reader-housing-member 1108-   1109 reader-and-calibration-member 1109-   1110 member-separation-distance 1110-   1111 reader-tag-separation-distance 1111-   1112 reader-antenna-tag-separation-distance 1112-   1113 reader-antenna-tag-separation-distance 1113-   1115 antenna-interface 1115-   1203 position-reference-tag 1203-   1204 position-reference-member 1204-   1320 Imaginary x-axis 1320-   1321 Imaginary y-axis 1321-   1322 Imaginary z-axis 1322-   1325 origin 1325-   1326 translating-scan-member 1326-   1327 patient-fixation-member 1327-   1328 patient 1328-   1329 support 1329-   1400 direction-of-motion 1400-   1500 method 1500-   1530 calibrate readers step 1530-   1531 determine location of readers step 1531-   1532 reader interrogation of monitoring-sensor-tags step 1532-   1533 authentication step 1533-   1534 determine location of monitoring-sensor-tags step 1534-   1535 reader instructs monitoring-sensor-tags step 1535-   1535 a reader instructs monitoring-sensor-tags step 1535 a-   1536 reader transmit “restart counting” command step 1536-   1537 determine if additional measurements to be taken step 1537-   1538 determine if reader location to be re-determined step 1538-   1539 determine if different measurement types to be taken step 1539-   1540 transmit received monitoring-sensor-tag transmission step 1540-   1600 method 1600-   1680 choose set of calibration reference-sensor-tags step 1680-   1681 select particular calibration method and settings step 1681-   1682 perform calibration reference-sensor-tags measurements step    1682-   1683 process calibration reference-sensor-tags measurements step    1683-   1700 method 1700-   1772 measuring ranges of monitoring-sensor tags step 1772-   1773 applying calibration-based corrections step 1773-   1777 process results step 1777-   1800 system 1800-   1801 processor 1801-   1803 memory 1803-   1805 display 1805-   1807 device 1807-   1828 material-of-interest 1828-   1901 real part of complex permittivity 1901-   1902 imaginary part of complex permittivity 1902-   1905 capacitor 1905-   1906 voltage source 1906-   1907 resistor 1907-   1908 capacitor 1908-   1909 representative circuit 1909-   1910 current 1910-   1911 graph of real part of complex permittivity 1911-   1912 graph of imaginary part of complex permittivity 1912-   1913 graph real part of complex permittivity 1913-   1914 graph of imaginary part of complex permittivity 1914-   1915 graph of real part of complex permittivity 1915-   1916 graph of imaginary part of complex permittivity 1916-   1917 infrared (IR) light source 1917-   1918 LED light source 1918-   1919 ultraviolet (UV) light source 1919-   1920 sonic or ultrasonic sound source 1920-   1921 array-of-excitation-sources 1921-   2010 complex-impedance-sensor 2010-   2011 complex-impedance-measurement-circuit 2011-   2020 complex-monitoring-sensor-tag 2020-   2101 load 2101-   2103 resistor 2103-   2104 point 2104-   2105 point 2105-   2106 current source 2106-   2201 material-of-interest 2201-   2203 electrode 2203-   2204 electrode 2204-   2205 voltage meter 2205-   2309 conductive surface type “G” 2309-   2310 conductive surface type “G” 2310-   2311 conductive surface of type “H” 2311-   2312 conductive surface of type “H” 2312-   2313 conductive surface of type “I” 2313-   2314 conductive surface of type “I” 2314-   2315 conductive surface of type “J” 2315-   2316 conductive surface of type “J” 2316-   2317 conductive surface of type “K” 2317-   2318 infrared (IR) light source of type “A” 2318-   2319 infrared (IR) light source of type “B” 2319-   2401 cast-or-bandage 2401-   2402 interior-surface 2402-   2406 first-sensor-type 2406-   2407 second-sensor-type 2407-   2420 first-sensor-tag 2420-   2421 second-sensor-tag 2421-   2423 lattice-of-sensors 2423-   2426 sensor-spacing 2426-   2430 article-in-lattice-contact 2430-   2431 implant 2431-   2511 analyzer 2511-   2512 variable-frequency-AC-source 2512-   2513 frequency-divider 2513-   2514 variable resistor 2514-   2687 material-of-interest 2687-   2688 section 2688-   2709 reader-assembly 2709-   2711 frame-member 2711-   2712 imaging-device 2712-   2720 wheel 2720-   2722 axle 2722-   2724 frame 2724-   2726 handle 2726-   2728 spring 2728-   2730 base 2730-   2820 x-axis 2820-   2821 y-axis 2821-   2822 z-axis 2822-   2825 origin 2825-   2904 position-reference-member 2904-   2926 transmitter 2926-   3101 internet-or-WAN-or-LAN 3101-   3103 server 3103-   3105 remote-computing-device 3105-   3201 step of selecting frequency point to measure complex impedance    3201-   3202 step of determining if one or more excitation-sources are to be    enabled 3202-   3203 step of choosing and enabling one or more excitation-sources    3203-   3204 step of obtaining measurement of complex impedance of    material-of-interest 3204-   3205 step of determining if more measurements of    material-of-interest to be taken 3205

DETAILED DESCRIPTION OF THE INVENTION

In the following discussion that addresses a number of embodiments andapplications of the present invention, reference is made to theaccompanying drawings that form a part thereof, where depictions aremade, by way of illustration, of specific embodiments in which theinvention may be practiced. It is to be understood that otherembodiments may be utilized and changes may be made without departingfrom the scope of the invention.

FIG. 1A may depict a schematic block diagram of a reader 100. In someembodiments, reader 100 may comprise antenna 110. In some embodiments,reader 100 may comprise at least one antenna 110. In some embodiments,reader 100 may comprise one or more antennas 110.

FIG. 1B may depict a schematic block diagram of a monitoring-sensor-tag120. In some embodiments, monitoring-sensor-tag 120 may comprise atleast one electric circuit 140. In some embodiments,monitoring-sensor-tag 120 may comprise at least one antenna 130 incommunication with the at least one electric circuit 140. In someembodiments, at least one electric circuit 140 may be in communicationwith at least one sensor. In some embodiments, monitoring-sensor-tag 120may comprise the at least one sensor. In some embodiments, at least oneelectric circuit 140 may comprise the at least one sensor.

In some embodiments, at least one electric circuit 140 may be anintegrated circuit. In some embodiments, the at least one sensor (e.g.,202, 203, and/or other sensors discussed herein) may be located insideof and integral with such an integrated circuit and in electricalcommunication with the integrated circuit. In some embodiments, the atleast one sensor (e.g., 202, 203, 1006, and/or other sensors discussedherein) may be located outside of such an integrated circuit and inelectrical communication with the integrated circuit.

In some embodiments, a given monitoring-sensor-tag 120 may be a wirelesssensor tag. In some embodiments, a given monitoring-sensor-tag 120 maybe one or more of: a RFID (radio frequency identification) sensor tag; aNFC (near field communication) sensor tag; a backscatter sensor tag;and/or magnetic inductive activated sensor tag.

In some embodiments, a given monitoring-sensor-tag 120 may communicatewith a given reader 100. In some embodiments, such communication may bewireless. In some embodiments, such wireless communication may be via apredetermined wavelength or via predetermined wavelengths ofelectromagnetic (EM) radiation. For example, and without limiting thescope of the present invention, such a wavelength may be wavelengthsassociated with radio waves. For example, and without limiting the scopeof the present invention, a given reader 100 may “interrogate”monitoring-sensor-tags 120 at a number of predetermined frequencies.

In some embodiments, upon at least one antenna 130 receivingelectromagnetic (EM) radiation of a predetermined characteristic as aninput from at least one antenna 110, this input may cause at least oneelectric circuit 140 to take one or more readings from the at least onesensor and to then transmit such one or more readings using at least oneantenna 130. Then, at least one antenna 110 may receive these one ormore readings being broadcast from at least one antenna 130. Hence,reader 100 may be “reading” from (i.e., scanning for) signals broadcastfrom a given monitoring-sensor-tag 120.

In some embodiments, when the at least one electric circuit 140 maycause the at least one antenna 130 to transmit the one or more readings,the at least one electric circuit 140 may also cause the at least oneantenna 130 to transmit “additional information.” In some embodiments,this “additional information” may comprise one or more of:identification information for a given monitoring-sensor-tag 120 that istransmitting (e.g., an ID for each monitoring-sensor-tag 120 that istransmitting); model number for the given monitoring-sensor-tag 120 thatis transmitting; serial number for the given monitoring-sensor-tag 120that is transmitting; manufacturer of the given monitoring-sensor-tag120 that is transmitting; year of manufacture of the givenmonitoring-sensor-tag 120 that is transmitting; or a request for asecurity code associated with that given monitoring-sensor-tag 120 thatis transmitting; a cyclic redundancy check code for the information thatthe given monitoring-sensor-tag 120 that is transmitting; a parity checkcode for information that the given monitoring-sensor-tag 120 that istransmitting; and receipt of a disable instruction for the givenmonitoring-sensor-tag 120 that is transmitting; wherein the givenmonitoring-sensor-tag 120 that is transmitting is selected from the oneor more monitoring-sensor-tags 120.

In some embodiments, monitoring-sensor-tag 120 may be passive andreceive power wirelessly transmitted from a given reader 100. That is,electrical power required to operate a given monitoring-sensor-tag 120may be provided wirelessly from at least one antenna 110 from a givenreader 100 that may be broadcasting and sufficiently close to at leastone antenna 130 of given monitoring-sensor-tag 120.

In some embodiments, at least one of the one or moremonitoring-sensor-tags 120 may be from substantially six inches tosubstantially 1.0 micrometer in a largest dimension of the at least oneof the one or more monitoring-sensor-tags 120. In some embodiments,“substantially” in this context may mean plus or minus 10% of the givenunit of measurement; i.e., plus or minus 10% of an inch and plus orminus 10% of a micrometer. In application, the size of a givenmonitoring-sensor-tag 120 may be negligible with respect to any impactthe given monitoring-sensor-tag 120 may have on the associatedmaterial-of-interest; i.e., the sizes of the utilizedmonitoring-sensor-tags 120 may not negatively affect the associatedmaterial-of-interest.

In some embodiments, each monitoring-sensor-tag 120 may be attached to agiven material-of-interest. Note, such materials-of-interest are notshown in FIG. 1A and in FIG. 1B. In some embodiments, a givenmaterial-of-interest may be selected from: a dental-filling 1001 (seee.g., FIG. 10A), a root-canal-post 1004 (see e.g., FIG. 10B), aroot-canal-cavity 1003 (see e.g., FIG. 10B), a dental-crown 1005 (seee.g., FIG. 10B), a dental-implant 1007 (see e.g., FIG. 10C), an articleimplantable within a body of an organism, the article attachable to thebody of the organism, specific tissue of the organism, a constructionmember, and/or the like. See also FIG. 10D for material-of-interest1028, which in some embodiments may be any of the above identified givenmaterials-of-interest. See also FIG. 13C showing monitoring-sensor-tag120 located within a leg of a patient 1328; wherein in that example aportion of the leg (e.g., tissue, bone, an implant, or the like) may begiven material-of-interest. See also FIG. 18 for material-of-interest1828, which in some embodiments may be any of the above identified givenmaterials-of-interest.

In some embodiments, the given material-of-interest may be an article.In some embodiments, the article may be selected from: a medical device;a tissue graft; a bone graft; an artificial tissue; a bolus withtime-release medication; a medication; and/or the like. In someembodiments, the medical device may be selected from one or more of: adental-implant 1007, an implantable device, an implantable organ (e.g.,may include from a cadaver), implantable tissue (e.g., may include froma cadaver), an artificial organ, artificial tissue, an artificial joint,an artificial limb, an artificial valve, a suture, and/or the like.

In some embodiments, the construction member (of the givenmaterial-of-interest) may be selected from one or more of: concrete;cement; plaster; mortar; resin; brick; block; drywall; particle board;plywood; wood framing member (e.g., a stud); posts; beams; girders;engineered structural members; and/or the like.

In some embodiments, one or more monitoring-sensor-tags 120 being“attached to” the given material-of-interest, at an initial time of“attachment,” may comprise one or more of the following locations: on asurface of the given material-of-interest; within the givenmaterial-of-interest; partially on the surface of the givenmaterial-of-interest and partially within the givenmaterial-of-interest; and/or the like. In some embodiments, the one ormore monitoring-sensor-tags 120 may be immersed entirely within thematerial-of-interest. In some embodiments, the one or moremonitoring-sensor-tags 120 may be immersed at least partially within thematerial-of-interest. That is, in some embodiments, “attached to” maycomprise “immersion.” In some embodiments, one or moremonitoring-sensor-tags 120 may associate with the givenmaterial-of-interest; such as, but not limited to, translating with thegiven material-of-interest.

In some embodiments, an importance of attaching one or moremonitoring-sensor-tags 120 with the given material-of-interest, may bethat the at least one sensor of a given monitoring-sensor-tag 120 maythen convey state information from readings of that at least one givensensor. That is, by using the monitoring-sensor-tags 120 attached to thegiven material-of-interest, information (e.g., various states) of thegiven material-of-interest may be monitored and/or tracked. In someembodiments, such monitoring and/or tracking may be accomplished withusing radio waves as opposed to ionizing imaging radiation like x-rays;which may provide for increased safety to patients 1328 when the givenmaterial-of-interest is associated with a given patient 1328.Additionally, because of this, more frequent monitoring and/or trackingof the given material-of-interest may be utilized, resulting inincreased efficacy and minimization of problems that may arise to due toinfrequent monitoring, as there may be minimal need to minimize patient1328 exposure to ionizing imaging radiation since embodiments of thepresent invention may communicate over radio waves betweenmonitoring-sensor-tags 120 and various readers 100.

For example, and without limiting the scope of the present invention, insome embodiments, such state information of the givenmaterial-of-interest that may be monitored and/or tracked by using oneor more monitoring-sensor-tags 120 attached to the givenmaterial-of-interest may be one or more of: structural integrity of acurrent state of the material-of-interest; structural integrity changesof the material-of-interest; pressure received at thematerial-of-interest; force received at the material-of-interest; stressreceived at the material-of-interest; torsion received at thematerial-of-interest; deformation received at the material-of-interest;temperature at some portion of the material-of-interest; positionalchanges of a given monitoring-sensor-tag 120 attached to thematerial-of-interest with respect to position of anothermonitoring-sensor-tag 120 attached to the material-of-interest, whereinthe given monitoring-sensor-tag 120 and the other monitoring-sensor-tagare 120 selected from the one or more monitoring-sensor-tags 120attached to the material-of-interest; or positional changes of at leastone monitoring-sensor-tag 120 attached to the material-of-interest withrespect to time, wherein the at least one monitoring-sensor-tag 120 isselected from the one or more monitoring-sensor-tags 120.

FIG. 2A may depict a schematic block diagram of monitoring-sensor-tag120 comprising a capacitive-based sensor 202. In some embodiments, agiven monitoring-sensor-tag 120 may comprisewireless-receiver-and-transmitter 207, processing circuitry 204,capacitance measurement circuit 205, and capacitive-based sensor 202. Insome embodiments, processing circuitry 204 may be in communication withcapacitance measurement circuit 205. In some embodiments, processingcircuitry 204 may be in communication withwireless-receiver-and-transmitter 207. In some embodiments, capacitancemeasurement circuit 205 may be in communication with capacitive-basedsensor 202.

In some embodiments, capacitance measurement circuit 205 may measure thecapacitance of capacitive-based sensor 202 to quantify a current statereading of material-of-interest that monitoring-sensor-tag 120 may beattached to. In some embodiments, processing circuitry 204 may controlcapacitance measurement circuit 205 and process the one or more readings(the obtained results) for radio-frequency transmission (or for otherelectromagnetic transmission). In some embodiments,wireless-receiver-and-transmitter 207 may transmit the one or morereadings (the obtained results) to reader 100. In some embodiments,wireless-receiver-and-transmitter 207 may receive instructions fromreader 100 using electromagnetic (EM) waves; such as, but not limited toradio wavelength electromagnetic (EM) waves. See e.g., FIG. 2A.

In some embodiments, at least one antenna 130 (of monitoring-sensor-tag120) may comprise wireless-receiver-and-transmitter 207. In someembodiments, at least one electric circuit 140 (of monitoring-sensor-tag120) may comprise processing circuitry 204. In some embodiments, atleast one electric circuit 140 (of monitoring-sensor-tag 120) maycomprise processing circuitry 204 and capacitance measurement circuit205. In some embodiments, at least one electric circuit 140 (ofmonitoring-sensor-tag 120) may comprise processing circuitry 204,capacitance measurement circuit 205, and capacitive-based sensor 202.

FIG. 2B may depict a schematic block diagram of monitoring-sensor-tag120 comprising a resistance-based sensor 203. In some embodiments, agiven monitoring-sensor-tag 120 may comprisewireless-receiver-and-transmitter 207, processing circuitry 204,resistance measurement circuit 206, and resistance-based sensor 203. Insome embodiments, processing circuitry 204 may be in communication withresistance measurement circuit 206. In some embodiments, processingcircuitry 204 may be in communication withwireless-receiver-and-transmitter 207. In some embodiments, resistancemeasurement circuit 206 may be in communication with resistance-basedsensor 203.

In some embodiments, resistance measurement circuit 206 may measure theresistance of resistance-based sensor 203 to quantify a current statereading of material-of-interest that monitoring-sensor-tag 120 may beattached to. In some embodiments, processing circuitry 204 may controlresistance measurement circuit 206 and process the one or more readings(the obtained results) for radio-frequency transmission (or for otherelectromagnetic transmission). In some embodiments,wireless-receiver-and-transmitter 207 may transmit the one or morereadings (the obtained results) to reader 100. In some embodiments,wireless-receiver-and-transmitter 207 may receive instructions fromreader 100 using electromagnetic (EM) waves; such as, but not limited toradio wavelength electromagnetic (EM) waves. See e.g., FIG. 2B.

In some embodiments, at least one antenna 130 (of monitoring-sensor-tag120) may comprise wireless-receiver-and-transmitter 207. In someembodiments, at least one electric circuit 140 (of monitoring-sensor-tag120) may comprise processing circuitry 204. In some embodiments, atleast one electric circuit 140 (of monitoring-sensor-tag 120) maycomprise processing circuitry 204 and resistance measurement circuit206. In some embodiments, at least one electric circuit 140 (ofmonitoring-sensor-tag 120) may comprise processing circuitry 204,resistance measurement circuit 206, and resistance-based sensor 203.

FIG. 2C may depict a schematic block diagram of monitoring-sensor-tag120 comprising an inductance-based-sensor 208. In some embodiments, agiven monitoring-sensor-tag 120 may comprisewireless-receiver-and-transmitter 207, processing circuitry 204,inductance measurement circuit 209, and inductance-based-sensor 208. Insome embodiments, processing circuitry 204 may be in communication withinductance measurement circuit 209. In some embodiments, processingcircuitry 204 may be in communication withwireless-receiver-and-transmitter 207. In some embodiments, inductancemeasurement circuit 209 may be in communication withinductance-based-sensor 208.

In some embodiments, inductance measurement circuit 209 may measure theinductance of inductance-based-sensor 208 to quantify a current statereading of material-of-interest that monitoring-sensor-tag 120 may beattached to. In some embodiments, processing circuitry 204 may controlinductance measurement circuit 209 and process the one or more readings(the obtained results) for radio-frequency transmission (or for otherelectromagnetic transmission). In some embodiments,wireless-receiver-and-transmitter 207 may transmit the one or morereadings (the obtained results) to reader 100. In some embodiments,wireless-receiver-and-transmitter 207 may receive instructions fromreader 100 using electromagnetic (EM) waves; such as, but not limited toradio wavelength electromagnetic (EM) waves. See e.g., FIG. 2C.

In some embodiments, at least one antenna 130 (of monitoring-sensor-tag120) may comprise wireless-receiver-and-transmitter 207. In someembodiments, at least one electric circuit 140 (of monitoring-sensor-tag120) may comprise processing circuitry 204. In some embodiments, atleast one electric circuit 140 (of monitoring-sensor-tag 120) maycomprise processing circuitry 204 and inductance measurement circuit209. In some embodiments, at least one electric circuit 140 (ofmonitoring-sensor-tag 120) may comprise processing circuitry 204,inductance measurement circuit 209, and inductance-based-sensor 208.

FIG. 2D may depict a schematic block diagram of a monitoring-sensor-tagcomprising a capacitive-based sensor 202 and a resistance-based-sensor203. In some embodiments, a given monitoring-sensor-tag 120 may comprisewireless-receiver-and-transmitter 207, processing circuitry 204,capacitance measurement circuit 205, capacitive-based sensor 202,resistance measurement circuit 206, and resistance-based sensor 203. Insome embodiments, processing circuitry 204 may be in communication withcapacitance measurement circuit 205. In some embodiments, processingcircuitry 204 may be in communication with resistance measurementcircuit 206. In some embodiments, processing circuitry 204 may be incommunication with wireless-receiver-and-transmitter 207. In someembodiments, capacitance measurement circuit 205 may be in communicationwith capacitive-based sensor 202. In some embodiments, resistancemeasurement circuit 206 may be in communication with resistance-basedsensor 203.

In some embodiments, capacitance measurement circuit 205 may measure thecapacitance of capacitive-based sensor 202 to quantify a current statereading of material-of-interest that monitoring-sensor-tag 120 may beattached to. In some embodiments, resistance measurement circuit 206 maymeasure the resistance of resistance-based sensor 203 to quantifyanother current state reading of material-of-interest thatmonitoring-sensor-tag 120 may be attached to. In some embodiments,processing circuitry 204 may control capacitance measurement circuit 205and may control resistance measurement circuit 206 and process the oneor more readings (the obtained results) for radio-frequency transmission(or for other electromagnetic transmission). In some embodiments,wireless-receiver-and-transmitter 207 may transmit the one or morereadings (the obtained results) to reader 100. In some embodiments,wireless-receiver-and-transmitter 207 may receive instructions fromreader 100 using electromagnetic (EM) waves; such as, but not limited toradio wavelength electromagnetic (EM) waves. See e.g., FIG. 2D.

In some embodiments, at least one antenna 130 (of monitoring-sensor-tag120) may comprise wireless-receiver-and-transmitter 207. In someembodiments, at least one electric circuit 140 (of monitoring-sensor-tag120) may comprise processing circuitry 204. In some embodiments, atleast one electric circuit 140 (of monitoring-sensor-tag 120) maycomprise processing circuitry 204, capacitance measurement circuit 205,and resistance measurement circuit 206. In some embodiments, at leastone electric circuit 140 (of monitoring-sensor-tag 120) may compriseprocessing circuitry 204, capacitance measurement circuit 205,capacitive-based sensor 202, resistance measurement circuit 206, andresistance-based sensor 203.

FIG. 2E may depict a schematic block diagram of a monitoring-sensor-tagcomprising a capacitive-based sensor 202 and an inductance-based-sensor208. In some embodiments, a given monitoring-sensor-tag 120 may comprisewireless-receiver-and-transmitter 207, processing circuitry 204,capacitance measurement circuit 205, capacitive-based sensor 202,inductance measurement circuit 209, and inductance-based-sensor 208. Insome embodiments, processing circuitry 204 may be in communication withcapacitance measurement circuit 205. In some embodiments, processingcircuitry 204 may be in communication with inductance measurementcircuit 209. In some embodiments, processing circuitry 204 may be incommunication with wireless-receiver-and-transmitter 207. In someembodiments, capacitance measurement circuit 205 may be in communicationwith capacitive-based sensor 202. In some embodiments, inductancemeasurement circuit 209 may be in communication withinductance-based-sensor 208.

In some embodiments, capacitance measurement circuit 205 may measure thecapacitance of capacitive-based sensor 202 to quantify a current statereading of material-of-interest that monitoring-sensor-tag 120 may beattached to. In some embodiments, inductance measurement circuit 209 maymeasure the inductance of inductance-based-sensor 208 to quantifyanother current state reading of material-of-interest thatmonitoring-sensor-tag 120 may be attached to. In some embodiments,processing circuitry 204 may control capacitance measurement circuit 205and may control inductance measurement circuit 209 and process the oneor more readings (the obtained results) for radio-frequency transmission(or for other electromagnetic transmission). In some embodiments,wireless-receiver-and-transmitter 207 may transmit the one or morereadings (the obtained results) to reader 100. In some embodiments,wireless-receiver-and-transmitter 207 may receive instructions fromreader 100 using electromagnetic (EM) waves; such as, but not limited toradio wavelength electromagnetic (EM) waves. See e.g., FIG. 2E.

In some embodiments, at least one antenna 130 (of monitoring-sensor-tag120) may comprise wireless-receiver-and-transmitter 207. In someembodiments, at least one electric circuit 140 (of monitoring-sensor-tag120) may comprise processing circuitry 204. In some embodiments, atleast one electric circuit 140 (of monitoring-sensor-tag 120) maycomprise processing circuitry 204, capacitance measurement circuit 205,and inductance measurement circuit 209. In some embodiments, at leastone electric circuit 140 (of monitoring-sensor-tag 120) may compriseprocessing circuitry 204, capacitance measurement circuit 205,capacitive-based sensor 202, inductance measurement circuit 209, andinductance-based-sensor 208.

FIG. 2F may depict a schematic block diagram of a monitoring-sensor-tagcomprising a resistance-based sensor 203 and an inductance-based-sensor208.

In some embodiments, a given monitoring-sensor-tag 120 may comprisewireless-receiver-and-transmitter 207, processing circuitry 204,resistance measurement circuit 206, resistance-based sensor 203,inductance measurement circuit 209, and inductance-based-sensor 208. Insome embodiments, processing circuitry 204 may be in communication withresistance measurement circuit 206. In some embodiments, processingcircuitry 204 may be in communication with inductance measurementcircuit 209. In some embodiments, processing circuitry 204 may be incommunication with wireless-receiver-and-transmitter 207. In someembodiments, resistance measurement circuit 206 may be in communicationwith resistance-based sensor 203. In some embodiments, inductancemeasurement circuit 209 may be in communication withinductance-based-sensor 208.

In some embodiments, resistance measurement circuit 206 may measure theresistance of resistance-based sensor 203 to quantify a current statereading of material-of-interest that monitoring-sensor-tag 120 may beattached to. In some embodiments, inductance measurement circuit 209 maymeasure the inductance of inductance-based-sensor 208 to quantifyanother current state reading of material-of-interest thatmonitoring-sensor-tag 120 may be attached to. In some embodiments,processing circuitry 204 may control resistance measurement circuit 206and may control inductance measurement circuit 209 and may process theone or more readings (the obtained results) for radio-frequencytransmission (or for other electromagnetic transmission). In someembodiments, wireless-receiver-and-transmitter 207 may transmit the oneor more readings (the obtained results) to reader 100. In someembodiments, wireless-receiver-and-transmitter 207 may receiveinstructions from reader 100 using electromagnetic (EM) waves; such as,but not limited to radio wavelength electromagnetic (EM) waves. Seee.g., FIG. 2F.

In some embodiments, at least one antenna 130 (of monitoring-sensor-tag120) may comprise wireless-receiver-and-transmitter 207. In someembodiments, at least one electric circuit 140 (of monitoring-sensor-tag120) may comprise processing circuitry 204. In some embodiments, atleast one electric circuit 140 (of monitoring-sensor-tag 120) maycomprise processing circuitry 204, resistance measurement circuit 206,and inductance measurement circuit 209. In some embodiments, at leastone electric circuit 140 (of monitoring-sensor-tag 120) may compriseprocessing circuitry 204, resistance measurement circuit 206,resistance-based sensor 203, inductance measurement circuit 209, andinductance-based-sensor 208.

FIG. 2G may depict a schematic block diagram of a monitoring-sensor-tagcomprising a capacitive-based sensor 202, a resistance-based sensor 203,and an inductance-based-sensor 208.

In some embodiments, a given monitoring-sensor-tag 120 may comprisewireless-receiver-and-transmitter 207, processing circuitry 204,capacitance measurement circuit 205, capacitive-based sensor 202,resistance measurement circuit 206, resistance-based sensor 203,inductance measurement circuit 209, and inductance-based-sensor 208. Insome embodiments, processing circuitry 204 may be in communication withcapacitance measurement circuit 205. In some embodiments, processingcircuitry 204 may be in communication with resistance measurementcircuit 206. In some embodiments, processing circuitry 204 may be incommunication with inductance measurement circuit 209. In someembodiments, processing circuitry 204 may be in communication withwireless-receiver-and-transmitter 207. In some embodiments, capacitancemeasurement circuit 205 may be in communication with capacitive-basedsensor 202. In some embodiments, resistance measurement circuit 206 maybe in communication with resistance-based sensor 203. In someembodiments, inductance measurement circuit 209 may be in communicationwith inductance-based-sensor 208.

In some embodiments, capacitance measurement circuit 205 may measure thecapacitance of capacitive-based sensor 202 to quantify a current statereading of material-of-interest that monitoring-sensor-tag 120 may beattached to. In some embodiments, resistance measurement circuit 206 maymeasure the resistance of resistance-based sensor 203 to quantifyanother current state reading of material-of-interest thatmonitoring-sensor-tag 120 may be attached to. In some embodiments,inductance measurement circuit 209 may measure the inductance ofinductance-based-sensor 208 to quantify yet another current statereading of material-of-interest that monitoring-sensor-tag 120 may beattached to. In some embodiments, processing circuitry 204 may controlcapacitance measurement circuit 205, may control resistance measurementcircuit 206, and may control inductance measurement circuit 209. In someembodiments, processing circuitry 204 may process the one or morereadings (i.e., the obtained results) for radio-frequency transmission(or for other electromagnetic transmission). In some embodiments,wireless-receiver-and-transmitter 207 may transmit the one or morereadings (the obtained results) to reader 100. In some embodiments,wireless-receiver-and-transmitter 207 may receive instructions fromreader 100 using electromagnetic (EM) waves; such as, but not limited toradio wavelength electromagnetic (EM) waves. See e.g., FIG. 2G.

In some embodiments, at least one antenna 130 (of monitoring-sensor-tag120) may comprise wireless-receiver-and-transmitter 207. In someembodiments, at least one electric circuit 140 (of monitoring-sensor-tag120) may comprise processing circuitry 204. In some embodiments, atleast one electric circuit 140 (of monitoring-sensor-tag 120) maycomprise processing circuitry 204, capacitance measurement circuit 205,resistance measurement circuit 206, and inductance measurement circuit209. In some embodiments, at least one electric circuit 140 (ofmonitoring-sensor-tag 120) may comprise processing circuitry 204,capacitance measurement circuit 205, capacitive-based sensor 202,resistance measurement circuit 206, resistance-based sensor 203,inductance measurement circuit 209, and inductance-based-sensor 208.

As noted above in the FIG. 1B discussion of monitoring-sensor-tag 120,monitoring-sensor-tag 120 may comprise the at least one sensor. In someembodiments, the at least one sensor may be selected from one or moreof: capacitive-based sensor 202, resistance-based sensor 203, and/orinductance-based-sensor 208. See e.g., FIG. 2A through and includingFIG. 2G.

As noted above in the FIG. 1B discussion of monitoring-sensor-tag 120,at least one electric circuit 140 (of monitoring-sensor-tag 120) maycomprise the at least one sensor. In some embodiments, the at least onesensor may be selected from one or more of: capacitive-based sensor 202,resistance-based sensor 203, and/or inductance-based-sensor 208. Seee.g., FIG. 2A through and including FIG. 2G.

In some embodiments, at least one electric circuit 140 (ofmonitoring-sensor-tag 120) may be attached to and in communication withthe at least one sensor, such as, but not limited to:spiral-formed-electric-conductor 703 (see e.g., FIG. 7C);standalone-strain-sensor 1006 (see e.g., FIG. 10B, FIG. 10C, and FIG.18); and lattice-of-sensors 1023 (see e.g., FIG. 10D).

In some embodiments, the one or more readings taken from the at leastone sensor may be readings of one or more of: inductance from one ormore inductance-based-sensors 208; capacitance from one or morecapacitive-based sensors 202; and/or resistance from one or moreresistance-based sensors 203. See e.g., FIG. 2A through and includingFIG. 2G. In some embodiments, such one or more readings of currentvalues, over time, of one or more of inductance, capacitance, orresistance may determine changes in such properties. In someembodiments, initial current value readings may function as baselinereadings that future current value readings may be monitored against todetermine changes.

In some embodiments, these one or more readings may provide statusinformation to determine one or more of: structural integrity of acurrent state of the material-of-interest; structural integrity changesof the material-of-interest; pressure received at thematerial-of-interest; force received at the material-of-interest; stressreceived at the material-of-interest; torsion received at thematerial-of-interest; deformation received at the material-of-interest;temperature at some portion of the material-of-interest; positionalchanges of a given monitoring-sensor-tag 120 attached to thematerial-of-interest with respect to position of anothermonitoring-sensor-tag 120 attached to the material-of-interest, whereinthe given monitoring-sensor-tag 120 and the other monitoring-sensor-tagare 120 selected from the one or more monitoring-sensor-tags 120attached to the material-of-interest; or positional changes of at leastone monitoring-sensor-tag 120 attached to the material-of-interest withrespect to time, wherein the at least one monitoring-sensor-tag 120 isselected from the one or more monitoring-sensor-tags 120. In someembodiments, readings from one or more of capacitive-based sensor 202,resistance-based sensor 203, and/or inductance-based-sensor 208 mayyield such current status information as noted above.

In some embodiments, structural integrity changes of thematerial-of-interest may comprise monitoring for liquid penetration intothe given material-of-interest. In some embodiments, liquid as usedherein may comprise viscous fluids, slurries, and/or slow flow films. Insome embodiments, liquid as used herein may comprise viscous fluids,slurries, and/or slow flow films that may harden and/or become curedinto a hardened state (with no to minimal flow). In some embodiments,structural integrity changes of the material-of-interest may comprisemonitoring for liquid penetration to the at least one sensors (e.g., 202and/or 203) located within the given material-of-interest. For example,and without limiting the scope of the present invention, the at leastone sensors (e.g., 202, 203, and/or 1006) may monitor for liquidpenetration into filling 1001, see e.g., FIG. 10A; for liquidpenetration beneath dental-crowns 1005, see e.g., FIG. 10B; for liquidpenetration into root-canal-cavity 1003, see e.g., FIG. 10B; or monitorfor liquid penetration into other materials-of-interest. Such liquidpenetration may indicate an increased likelihood of infection and/or ofstructural integrity failures and/or detachment of the givenmaterial-of-interest (e.g., detachment of: dental-filling 1001,dental-crown 1005, root-canal-post 1004, and/or dental-implant 1007). Insome embodiments, such at least one sensors (e.g., 202, 203, and/or1006) may monitor for liquid penetration at the at least one sensors(e.g., 202, 203, and/or 1006), in at least some portion of the givenmaterial-of-interest, and/or within hollow space within the givenmaterial-of-interest. In some embodiments, such at least one sensors(e.g., 202, 203, and/or 1006) may monitor for liquid penetration withoutthe at least one sensors (e.g., 202, 203, and/or 1006) coming inphysical contact with the liquid.

It should be appreciated by those of ordinary skill in the relevant artthat capacitive-based sensor 202 and capacitance measurement circuits205 may be used to implement configurations depicted in FIG. 2A, FIG.2D, FIG. 2E, and/or FIG. 2G to quantify, measure, track, monitor, and/oranalyze various states and changes in states of materials-of-interestwith one or more monitoring-sensor-tag 120 processing the one or morereading originating from such capacitive-based sensor 202.

FIG. 3 may be a circuit diagram of a ring oscillator 350 implementing acapacitance measurement circuit 205 with capacitive-based sensor 202. Insome embodiments, capacitance measurement circuit 205 withcapacitive-based sensor 202 may be carried out via ring oscillator 350.In some embodiments, ring oscillator circuit 350 may measure values ofcapacitive-based sensor 202, transferring such values ofcapacitive-based sensor 202 into frequency of oscillations of said ringoscillator 350.

Continuing discussing FIG. 3, in some embodiments, ring oscillator 350may comprise an odd number of stages. In some embodiments, each suchstage may comprise a respective digital invertor 310 and load capacitor300. In some embodiments, digital invertor 310 may be C-MOS pair 310,which for example may be a combination of p-type and n-type field-effecttransistors depicted in FIG. 5B. In some embodiments, ring oscillator350 may also comprise capacitive-based sensor 340 (located in someembodiments, after a last stage). In some embodiments, an oscillationfrequency of ring oscillator circuit 350 man be found using expression(1):

$\begin{matrix}{F = \frac{1}{2N\;\tau}} & (1)\end{matrix}$where N may be a number of stages and τ may be a delay of each stage,and where τ can be expressed as:

$\begin{matrix}{\tau = \frac{{CV}_{T}}{I_{t}}} & (2)\end{matrix}$where C is a capacitance of each stage, V_(T) is a threshold voltage ofa C-MOS pair 310, and I_(t) is an average charging current of the loadcapacitor C of each stage. If the capacitance of the capacitive-basedsensor 340 changes, the oscillation frequency of ring oscillator circuit350 may change as well, according to the expressions above.

FIG. 4A through and including FIG. 4E may depict various capacitors,which may be used as capacitors in at least some of the circuit diagramsshown in the figures. FIG. 4A through and including FIG. 4E may depictvarious capacitors, which may be used as components in capacitive-basedsensors 202.

FIG. 4A may be a perspective view of a basic capacitor. In someembodiments, this basic capacitor may comprise two substantiallyparallel plates 400 that may be separated by dielectric material 401. Insome embodiments, such plates 400 may be separated from each by adistance of d. In some embodiments, plates 400 may be constructed fromsubstantially conductive materials. In some embodiments, the capacitanceof this basic capacitor may be found from the following expression (3):

$\begin{matrix}{C = \frac{ɛ_{0}ɛ_{r}A}{d}} & (3)\end{matrix}$where A is an area of each of the conductive plates 400, d is a width ofthe dielectric material 401 between the conductive plates 400, ε_(r) isthe relative permittivity of the dielectric material 401, andε₀≅8.85·10⁻¹² F/m is vacuum permittivity constant.

FIG. 4B may be a perspective view of a capacitor with substantiallyparallel regions of a conductive surface of type “A” 402 mounted tosubstrate 403. In some embodiments, substrate 403 may be a dielectricmaterial. In some embodiments, the capacitor of FIG. 4B may comprise twopairs of substantially parallel regions of conductive surface of type“A” 402 mounted to substrate 403. In some embodiments, conductivesurface of type “A” 402 may be constructed from electrically conductivematerials of construction.

FIG. 4C may be a top view of a capacitor; with substantially parallelregions of a conductive surface of type “B” 404; and with substantiallyparallel regions of a conductive surface of type “C” 405. In someembodiments, conductive surface of type “B” 404 and conductive surfaceof type “C” 405 may be mounted to a same substrate 403. In someembodiments, substrate 403 may be a dielectric material. In someembodiments, conductive surface of type “B” 404 and conductive surfaceof type “C” 405 may be constructed from electrically conductivematerials of construction. In some embodiments, conductive surface oftype “C” 405 may be arranged in a pair of substantially parallel rows ina spiral fashion with substrate 403 disposed between or/and under suchsubstantially parallel rows; for example, and without limiting the scopeof the present invention, arranged as conductive wires in concentriccircles on a dielectric substrate.

FIG. 4D may be a top view of a capacitor; with regions of a conductivesurface of type “D” 406; and with regions of a conductive surface oftype “E” 407. In some embodiments, conductive surface of type “D” 406and conductive surface of type “E” 407 may be mounted to a samesubstrate 403. In some embodiments, substrate 403 may be a dielectricmaterial. In some embodiments, conductive surface of type “D” 406 andconductive surface of type “E” 407 may be constructed from electricallyconductive materials of construction. In some embodiments, conductivesurface of type “D” 406 may be arranged in concentric circles (in abull's eye fashion) with substrate 403 disposed between such concentriccircles. In some embodiments, conductive surface of type “E” 407 may bearranged in concentric squares with substrate 403 disposed betweenor/and under such concentric squares.

FIG. 4E may be a top view of a capacitor, with regions of a conductivesurface of type “F” 408. In some embodiments, the capacitor of FIG. 4Emay have regions of conductive surface of type “F” 408 mounted tosubstrate 403. In some embodiments, substrate 403 may be a dielectricmaterial. In some embodiments, conductive surface of type “F” 408 may beconstructed from electrically conductive materials of construction.

FIG. 4B, FIG. 4C, FIG. 4D, and FIG. 4E may depict examples of variouscapacitors that may be used in some capacitive-based sensors 202embodiments. Such capacitors may form at least part of capacitive-basedsensors 202 that may be the at least one sensor of a givenmonitoring-sensor-tag 120. In some embodiments, capacitive-based sensors202 may comprise one or more of: plates 400, conductive surface type “A”402, conductive surface type “B” 404, conductive surface type “C” 405,conductive surface type “D” 406, conductive surface type “E” 407, and/orconductive surface type “F” 408; placed (e.g., mounted, installed,immersed, implanted, and/or the like) on a dielectric substrate 403(and/or onto dielectric material 401 in some embodiments).

Continuing discussing FIG. 4B, FIG. 4C, FIG. 4D, and FIG. 4E, in someembodiments, the given material-of-interest that may be the object ofanalysis, monitoring, and/or tracking may be the dielectric substrate403. Thus in use, material-of-interest, acting as dielectric substrate403, may substantially fill in and/or substantially cover one or moreof: plates 400, conductive surface type “A” 402, conductive surface type“B” 404, conductive surface type “C” 405, conductive surface type “D”406, conductive surface type “E” 407, and/or conductive surface type “F”408. Use of such capacitors in capacitive-based sensor 202 may permitmonitoring and/or detection of structural defects in thematerial-of-interest (such as, but not limited to, cracks or changes instructure of material-of-interest). Because changes in structure of thematerial-of-interest acting as the dielectric substrate 403 may changethe relative permittivity ε_(r) which, in turn, may change thecapacitance of capacitive-based sensor 202 in communication withcapacitance measurement circuit 205.

For example, and without limiting the scope of the present invention, achange in the relative permittivity ε_(r) of material-of-interest due toa structural change may be detected (registered) by capacitive-basedsensor 340 in ring oscillator 350, which may be one possibleimplementation of capacitance measurement circuit 205 withcapacitive-based sensor 202. That is, this change may register as achange in the frequency of ring oscillator 350. Such frequency changesmay be measured, monitored, tracked, and/or analyzed to provide strongindications of structural defects and/or of structural changes in thegiven material-of-interest. For example, and without limiting the scopeof the present invention, the relative permittivity of concrete isapproximately 4.5 times higher than the relative permittivity of air.Accordingly, any appearance of a crack in the concrete, that may permitair ingress, may then alter the capacitance of the implantedmonitoring-sensor-tag 120 into the given material-of-interest, which inthis example may be a section of concrete. A same concept may be appliedto liquid ingress into structural defects and/or structural changes ofother materials-of-interest, such as, but not limited to, dental-filling1001.

Capacitive-based, resistance-based, inductance-based or other types ofsensors as part of a given monitoring-sensor-tag 120, that may beimplanted to (i.e., attached to) the given material-of-interest, mayalso be used to measure temperature of the analyzed givenmaterial-of-interest, according to various embodiments of the presentinvention.

FIG. 5A may be a circuit diagram of a ring oscillator 500 implementing acapacitance measurement circuit 205 with capacitive-based sensor 202. Insome embodiments, capacitance measurement circuit 205 withcapacitive-based sensor 202 may be carried out via ring oscillator 500.In some embodiments, ring oscillator circuit 500 may measure values ofcapacitive-based sensor 202, transferring such values ofcapacitive-based sensor 202 into frequency of oscillations of said ringoscillator 500. In some embodiments, ring oscillator 500 may be used tomonitor, track, and/or analyze temperature changes to the givenmaterial-of-interest where ring oscillator 500 may be implanted to(i.e., attached to).

Continuing discussing FIG. 5A, in some embodiments, ring oscillator 500may comprises an odd number of stages. In some embodiments, each suchstage may comprise a respective digital invertor 310 and load capacitor300. In some embodiments, digital invertor 310 may be C-MOS pair 310. Insome embodiments, ring oscillator 500 may also comprise capacitive-basedsensor 340 (located in some embodiments, after a last stage) and aswitch 501 in series with capacitive-based sensor 340.

FIG. 5B may be a circuit diagram of C-MOS pair 310 (digital invertor310). In some embodiments, C-MOS pair 310 (digital invertor 310) maycomprise P-MOS transistor 502 and N-MOS transistor 503.

Continuing discussing FIG. 5A and FIG. 5B, in some embodiments, ringoscillator 500 may comprise switch 501. In some embodiments, switch 501may connect or disconnect capacitive-based sensor 340 from ringoscillator 500. Accordingly, the oscillation frequency of ringoscillator 500 may depend on an ambient temperature of the surroundingmaterial-of-interest. Current I flowing through P-MOS transistor 502 andN-MOS transistor 503, forming digital invertor 310, may affect a delayof each stage, depending on the ambient temperature of the surroundingmaterial-of-interest. In this manner, the ring oscillator 500, with theswitchable capacitive-based sensor 340, may function as a temperaturesensor for the monitored given material-of-interest. With switch 501 ina disconnected state, capacitive-based sensor 340 may not influence theoscillation frequency of ring oscillator 500; therefore the oscillationfrequency of ring oscillator 500 may correlate with the ambienttemperature of the surrounding material-of-interest.

It should be appreciated by those of ordinary skill in the relevant artthat resistance-based sensors 203 and resistance measurement circuits206 may be used to implement configurations depicted in FIG. 2B, FIG.2D, FIG. 2F, and/or FIG. 2G to quantify, measure, track, monitor, and/oranalyze various states and changes in states of materials-of-interestwith one or more monitoring-sensor-tag 120 processing the one or morereading originating from such resistance-based sensors 203.

FIG. 6 may be a circuit diagram of a ring oscillator 600 implementing aresistance measurement circuit 206 with resistance-based sensor 203. Insome embodiments, ring oscillator 600 may be used to sense, measure,monitor, track, and/or analyze strains, force, torsion, and/or pressurein portions of material-of-interest with monitoring-sensor-tag 120;wherein the at least one sensor (of monitoring-sensor-tag 120) maycomprise ring oscillator 600. In the embodiment implemented and depictedin FIG. 6, ring oscillator 600 (e.g., implemented as resistancemeasurement circuit 206 with resistance-based sensor 203) may compriseresistance-based sensor 203, an example of a strain-influenced resistor602; wherein monitoring-sensor-tag 120 may comprise ring oscillator 600and the at least one sensor (of monitoring-sensor-tag 120) may comprisea strain-influenced resistor 602. Thus, ring oscillator 600 may be usedto sense, measure, monitor, track, and/or analyze deformations,structural defects, and/or structural changes in material-of-interest.

Continuing discussing FIG. 6, in some embodiments, ring oscillatorcircuit 600 may comprise an odd number of stages. In some embodiments,each such stage may comprise digital invertor 310 and an “RC pair.” Insome embodiments, each such RC pair (except a final stage) may comprisea load capacitor 300 and a load resistor 601. In some embodiments, afinal stage RC pair may comprise a load capacitor 300 and astrain-influenced resistor 602. In some embodiments, an oscillationfrequency F of ring oscillator 600 may be determined from the expression(4):

$\begin{matrix}{F = {\frac{1}{2N\;\tau} = \frac{1}{2{N \cdot {f\left( {{RC},V_{t}} \right)}}}}} & (4)\end{matrix}$where N may be a number of stages, τ may be a delay of each stage, f(RC,V_(t)) may be a function of the RC value of each stage, and of thethreshold voltage of CMOS invertor (digital inventor 310) V_(t). In someembodiments, strain-influenced resistor 602 (denoted as R_(S) in FIG. 6)may be a strain-influenced resistor. In some embodiments, ringoscillator 600 may be a component of the least one sensor ofmonitoring-sensor-tag 120 that may be attached to (i.e., implanted,immersed, and/or the like) to the given material-of-interest. Andchanges (e.g., strains, forces, torsion, pressure, structural changes,deformations, and/or the like) in the given material-of-interest maythen translate into changes in the oscillation frequency F that ringoscillator 600 may be sensing, measuring, monitoring, tracking, and/oranalyzing.

FIG. 7A may be a top view of an example of a stress sensor used in someembodiments of the present invention. In some embodiments, such a stresssensor may be the at least one sensor of monitoring-sensor-tag 120. Insome embodiments, the stress sensor depicted in FIG. 7A may bestrain-influenced resistor 700. In some embodiments, strain-influencedresistor 700 may be a part of an implementation of ring oscillator 600,strain-influenced resistor 602; thus strain-influenced resistor 700 maybe a type of resistance-based sensor 203 used to sense, measure,monitor, track, and/or analyze changes (e.g., strains, forces, torsion,pressure, structural changes, deformations, and/or the like) in thegiven material-of-interest by such changes to the material-of-interestmay translate into changes in the oscillation frequency F that ringoscillator 600 may be sensing, measuring, monitoring, tracking, and/oranalyzing.

FIG. 7B may be a top view of an example of a stress sensor used in someembodiments of the present invention. In some embodiments, such a stresssensor may be the at least one sensor of monitoring-sensor-tag 120. Insome embodiments, this stress sensor depicted in FIG. 7B may be anexample of a resistance-based sensor 203. In some embodiments, thisstress sensor depicted in FIG. 7B may comprise thin-film-coating 701 andsubstrate 702. In some embodiments, thin-film-coating 701 may be anelectrically resistive compound. When monitoring-sensor-tag 120 with thestress sensor shown in FIG. 7B may be attached to (e.g., implanted,immersed, touching, and/or the like) the given material-of-interest,changes (e.g., strains, forces, torsion, pressure, structural changes,deformations, and/or the like) in the given material-of-interest maytranslate into changes in the resistance of thin-film-coating 701 whichmay be registered, sensed, measured, monitored, tracked, and/or analyzedby resistance-based sensor 203. In some embodiments, substrate 702 maybe a flexible non-conductive material upon which the thin-film-coating701 may be attached or set upon. Physical forces acting on and causingvarious changes such as, but not limited to, possible fracturing,cracking, bending, twisting, excessive pressure, abnormal temperature,and/or the like, of substrate 702 may also change monitorable conductivequalities of thin-film coating 701.

FIG. 7C may be a top view of an example of a stress sensor used in someembodiments of the present invention. In some embodiments, such a stresssensor may be the at least one sensor of monitoring-sensor-tag 120. Insome embodiments, this stress sensor depicted in FIG. 7B may be anexample of a resistance-based sensor 203. In some embodiments, thestress sensor depicted in FIG. 7C may bespiral-formed-electric-conductor 703. In some embodiments,spiral-formed-electric-conductor 703 may be a type of resistance-basedsensor 203. In some embodiments, spiral-formed-electric-conductor 703may be substantially spiral shaped. When monitoring-sensor-tag 120 withthe stress sensor (e.g., spiral-formed-electric-conductor 703) shown inFIG. 7C may be attached to (e.g., implanted, immersed, touching, and/orthe like) the given material-of-interest, changes (e.g., strains,forces, torsion, pressure, structural changes, deformations, and/or thelike) in the given material-of-interest may translate into changes inthe resistance of spiral-formed-electric-conductor 703 which may beregistered, sensed, measured, monitored, tracked, and/or analyzed byresistance-based sensor 203.

FIG. 8 may be a diagrammatical top view of a monitoring-sensor-tag's 120structure and components, as used in some embodiments of the presentinvention. In some embodiments, a given monitoring-sensor-tag 120 may bedivided functionally and/or structurally into sensor-portion 801 andprocessing-portion 802. While sensor-portion 801 and processing-portion802 may be shown as distinct portions in FIG. 8, in some embodiments,sensor-portion 801 and processing-portion 802 may overlap. In someembodiments, sensor-portion 801 may comprise the at least one sensor. Insome embodiments, processing-portion 802 may comprise at least oneantenna 130 and at least one electric circuit 140; wherein at least oneelectric circuit 140 and at least one antenna 130 may be incommunication with each other. In some embodiments, at least oneelectric circuit 140 may be in communication with sensor-portion 801.

In some embodiments, at least one electric circuit 140 may be incommunication with sensor-portion with the at least one sensor. In someembodiments, at least one electric circuit 140 may comprise processingcircuitry 204. In some embodiments, at least one electric circuit 140may comprise processing circuitry 204 and may further comprise one ormore of capacitive measurement circuit 205, resistance measurementcircuit 206, and/or inductance measurement circuit 209.

Continuing discussing FIG. 8, as shown in FIG. 8 the at least one sensorof sensor-portion 801 may comprise three distinct sensors: conductivesurface type “B” 404, conductive surface type “C” 405, andstrain-influenced resistor 700 (which may be a part [component] of animplementation of ring oscillator 600). See e.g., FIG. 4C, FIG. 6, andFIG. 7A; as well as their respective discussions above. Continuingdiscussing FIG. 8, in some embodiments, strain-influenced resistor 700may be strain influenced sensor. In some embodiments, conductive surfacetype “B” 404 and conductive surface type “C” 405 may function ascompound integrity sensors that may allow for structural integrityanalysis of the given material-of-interest where the given sensor may beimplanted. In some embodiments, these three distinct sensors may be incommunication with at least one electric circuit 140. In someembodiments, at least one electric circuit 140 may provide control logicfor controlling these three distinct sensors. In some embodiments, atleast one electric circuit 140 may provide control logic for controllingthese three distinct sensors by taking one or more readings from thesethree distinct sensors and instructing at least one antenna 130 in thetransmission of such one or more readings for pickup by one or morereaders 100.

Continuing discussing FIG. 8, while three distinct sensors may be shownin FIG. 8, it is expressly contemplated the at least one sensor ofsensor-portion 801 may comprise one or more of the sensors discussed andshown in the accompanying figures.

Continuing discussing FIG. 8, in some embodiments, sensor-portion 801and processing-portion 802 may be manufactured as single and distinctarticles of manufacture, that once assembled may be in communicationwith each other. In some embodiments, sensor-portion 801 andprocessing-portion 802 may be manufactured by printing as single anddistinct articles of manufacture, that once assembled may be incommunication with each other.

Continuing discussing FIG. 8, in some embodiments, sensor-portion 801and processing-portion 802 may be manufactured as a single integratedarticle of manufacture. In some embodiments, sensor-portion 801 andprocessing-portion 802 may be printed as a single integrated article ofmanufacture.

As noted above, in some embodiments, upon at least one antenna 130receiving electromagnetic (EM) radiation of a predeterminedcharacteristic as an input from at least one antenna 110 of reader 100,this input may cause at least one electric circuit 140 to take one ormore readings from the at least one sensor and to then transmit such oneor more readings using at least one antenna 130. FIG. 9 may be a diagramof control and status signals, in accordance with some embodiments ofthe present invention. In some embodiments, electric circuit 140 (orprocessing circuitry 204 in some embodiments) may be executing thefunctions shown in FIG. 9.

Continuing discussing FIG. 9, in some embodiments, electric circuit 140and/or processing circuitry 204 may be event-driven (or input-driven)and digital CLOCK 930 may implement events which condition time andorchestrate the functionality of electric circuit 140 and/or processingcircuitry 204. In some embodiments, CLOCK 930 may be digital clock. Insome embodiments, CLOCK 930 may be a binary clock. In some embodiments,RESTART_COUNT signal 931 may change to binary value 1 for at least oneCLOCK 930 cycle by electric circuit 140 (or processing circuitry 204 insome embodiments) receiving respective instruction(s) from reader 100,as indicated at Pulse of RESTART_COUNT signal 938. That is, Pulse ofRESTART_COUNT signal 938 may be a response to at least one antenna 130receiving electromagnetic (EM) radiation of a predeterminedcharacteristic as an input from at least one antenna 110 of reader 100,where this input may then cause at least one electric circuit 140 totake the one or more readings from the at least one sensor. In someembodiments, a RESTART_COUNT signal 931 may trigger resetting of aCOUNTER 932. In some embodiments, COUNTER 932 may store values from theat least one sensor; such as, the one or more readings. In someembodiments, COUNTER 932 may store values of a number of ring oscillator(e.g., ring oscillator 350 or ring oscillator 600) oscillations. In someembodiments, COUNTER 932 may be a digital register. In some embodiments,COUNTER 932 may be a binary counter. In some embodiments, COUNTER 932may represent a state of a digital ripple counter, input of which may beconnected to the last stage of ring oscillator (e.g., ring oscillator350 or ring oscillator 600). In some embodiments, COUNTER 932 may haveits value set to a zero value, as indicated at zero value 934; which maybe triggered by Pulse of RESTART_COUNT signal 938 that may in turntrigger RESTART_COUNT signal 931, which may in turn result in zero value934 for COUNTER 932. In some embodiments, if COUNTER 932 may reach amaximal value 937, then a COUNTER_OVERFLOW signal 933 may be triggered;wherein this COUNTER_OVERFLOW signal 933 changes its binary value from 0to 1, as indicated at “0-to-1 transition of Pulse of Counter Overflowsignal 935.” In that case, COUNTER_OVERFLOW signal 933 may stay atbinary value 1 until a next change of RESTART_COUNT signal 931 frombinary value 0 to 1 for at least one CLOCK 930 cycle, as indicated at“1-to-0 transition of Pulse of Counter Overflow signal 936.”

Optionally, in some embodiments, a value Y, stored in a dividerregister, may advance COUNTER 932 to the next value every Y CLOCK 930cycles. That may prevent COUNTER 932 reaching its maximal value 937 toosoon.

FIG. 10A may be a diagram of a patient 1328 tooth 1000 with one or moremonitoring-sensor-tags 120 placed in a dental-filling 1001 as amaterial-of-interest, in accordance with some embodiments of the presentinvention. FIG. 10A may depict a schematic diagram of tooth 1000. Tooth1000 may comprise one or more dental-fillings 1001. FIG. 10A may alsodepict gum 1002, so as to schematically indicate a gum 1002 line inrelation to tooth 1000 (for demonstration purposes).

In FIG. 10A, dental-filling(s) 1001 may be the material-of-interest. Forexample, and without limiting the scope of the present invention,dental-fillings 1001 may be selected from filling materials used in thepractice of dentistry, such as, but not limited to “fill” cavitiesand/or to “seal” undesirable surface geometry on teeth 1000. Forexample, and without limiting the scope of the present invention,dental-fillings 1001 may be selected from one or more of: compositeresins; glass ionomer cements; resin-ionomer cements; porcelain (and/orceramics); porcelain fused to a metal; and/or the like.

Continuing discussing FIG. 10A, in some embodiments, one or moremonitoring-sensor-tags 120 may be attached to, located on, located in,immersed, implanted, and/or the like in the one or more dental-fillings1001 of tooth 1000. Note, characteristics (e.g., one or more readings)of such one or more monitoring-sensor-tags 120 placement with respect toone or more dental-fillings 1001 may change over time as the given oneor more dental-fillings 1001 may cure and/or harden. In someembodiments, placement of one or more monitoring-sensor-tags 120 withrespect to one or more dental-fillings 1001 may be random. In someembodiments, placement of one or more monitoring-sensor-tags 120 withrespect to one or more dental-fillings 1001 may be substantiallyuniform. In some embodiments, placement of one or moremonitoring-sensor-tags 120 with respect to one or more dental-fillings1001 may be approximately uniform. In some embodiments, placement of onegiven monitoring-sensor-tags 120 (e.g., a first-sensor-tag 1020) withrespect to another different monitoring-sensor-tags 120 (e.g., asecond-sensor-tag 1021) may be specified (e.g., at a fixed distance suchas at an initial predetermined spacing 1025) within the givenmaterial-of-interest, such as dental-filling 1001 (see e.g., FIG. 10Ddiscussed below). Thus, placement of such one or moremonitoring-sensor-tag 120 with respect to one or more dental-fillings1001 may be used to obtain various information about one or moredental-fillings 1001 and may do so in a non-invasive manner and in amanner that does not require use of ionizing imaging radiation.

FIG. 10B may be a diagram of a patient 1328 tooth 1000 with one or moremonitoring-sensor-tags 120 placed in: a root-canal-cavity 1003, in aroot-canal-post 1004, and/or in a dental-crown 1005; in accordance withsome embodiments of the present invention. In FIG. 10B thematerial-of-interest may be selected from one or more of:root-canal-cavity 1003, root-canal-post 1004, dental-crown 1005, and/orthe like. In some embodiments, one or more monitoring-sensor-tags 120may be attached to, located on, located in, immersed, implanted, and/orthe like in the root-canal-cavity 1003, the root-canal-post 1004, and/orthe dental-crown 1005. In some embodiments, one or moremonitoring-sensor-tags 120 may further comprise astandalone-strain-sensor 1006. In some embodiments,standalone-strain-sensor 1006 may be an external sensor structureattached to a given monitoring-sensor-tag 120. In some embodiments,standalone-strain-sensor 1006 may be a strain-influenced resistor 700 ora spiral-formed-electric-conductor 703. In some embodiments,standalone-strain-sensor 1006 may be capacitive-based sensor 202 or aresistance-based sensor 203. In some embodiments,standalone-strain-sensor 1006 may be in communication with one or moreof: electric circuit 140, processing circuitry 204, capacitancemeasurement circuit 205, and/or resistance measurement circuit 206.

FIG. 10C may be a diagram of a patient 1328 tooth dental-implant 1007with one or more monitoring-sensor-tags 120, in accordance with someembodiments of the present invention. In some embodiments,dental-implant 1007, which may be an artificial tooth, may compriseimplant-post 1008; wherein implant-post 1008 may be anchored to patient1328. In FIG. 10C, the material-of-interest may be dental-implant 1007and/or implant-post 1008. In some embodiments, one or moremonitoring-sensor-tags 120 may be attached to, located on, located in,immersed, implanted, and/or the like in the dental-implant 1007 and/orin the implant-post 1008. In some embodiments, one or moremonitoring-sensor-tags 120 may further comprise astandalone-strain-sensor 1006. In some embodiments,standalone-strain-sensor 1006 may be an external sensor structureattached to a given monitoring-sensor-tag 120. In some embodiments,standalone-strain-sensor 1006 may be a strain-influenced resistor 700 ora spiral-formed-electric-conductor 703. In some embodiments,standalone-strain-sensor 1006 may be capacitive-based sensor 202 or aresistance-based sensor 203. In some embodiments,standalone-strain-sensor 1006 may be in communication with one or moreof: electric circuit 140, processing circuitry 204, capacitancemeasurement circuit 205, and/or resistance measurement circuit 206.

FIG. 10D may be a diagram of a first-sensor-tag 1020 and asecond-sensor-tag 1021 arranged in a material-of-interest with aninitial predetermined spacing 1025 between the first-sensor-tag 1020 andthe second-sensor-tag 1021 in the material-of-interest 1028. Note, insome embodiments, material-of-interest 1028 shown in FIG. 10D may be anymaterial-of-interest noted herein. For example, and without limiting thescope of the present invention, in some embodiments,material-of-interest 1028 may be selected from one or more of:dental-filling 1001, root-canal-cavity 1003, root-canal-post 1004,dental-crown 1005, dental-implant 1007, implant-post 1008, an articleimplantable within a body of an organism (e.g., where the organism ispatient 1328), the article attachable to the body of the organism,specific tissue of the organism, and/or a construction member.

Continuing discussing FIG. 10D, in some embodiments, each offirst-sensor-tag 1020 and/or of second-sensor-tag 1021 may comprise alattice-of-sensors 1023 (e.g., 202, 203, 406, 407, 700, 703, and/or1006); wherein each respective lattice-of-sensors 1023 may be separatedfrom each other lattice-of-sensors 1023 by initial predetermined spacing1025. And in some embodiments, sensors within a given lattice (e.g.,lattice-of-sensors 1023) may be separated by sensor-spacing 1026.Because initial predetermined spacing 1025 may be known, then positionallocations of the other one or more monitoring-sensor-tags 120 may bedetermined. Likewise, because initial predetermined spacing 1026 may beknown, then positional locations of the sensors within a given lattice(e.g., lattice-of-sensors 1023) may be determined. In some embodiments,each lattice-of-sensors 1023 (e.g., of each first-sensor-tag 1020 and/orof second-sensor-tag 1021) may comprise a plurality of sensors (e.g.,202, 203, 406, 407, 700, 703, and/or 1006); wherein this plurality ofsensors may be attached to the given sensor-tag, such asfirst-sensor-tag 1020 and/or second-sensor-tag 1021. In someembodiments, each such sensor-tag (e.g., first-sensor-tag 1020 and/orsecond-sensor-tag 1021) may comprise their own electric circuit 140 (orprocessing circuitry 204). In some embodiments, the plurality of sensors(e.g., 202, 203, 406, 407, 700, 703, and/or 1006) of eachlattice-of-sensors 1023 may be in communication with such an electriccircuit 140 (or processing circuitry 204) but located outside of such anelectric circuit 140. See e.g., FIG. 10D. In some embodiments,first-sensor-tag 1020 and second-sensor-tag 1021 may be types ofmonitoring-sensor-tags 120 with initial predetermined spacing 1025 knownbetween them. Also in some embodiments, there may be a plurality offirst-sensor-tag 1020 and a plurality of second-sensor-tag 1021.

In some embodiments, a given lattice-of-sensors 1023 may be arranged ina one dimensional, two dimensional, or three dimensional configuration.In some embodiments, a given lattice-of-sensors 1023 may be arranged inmesh configuration. In some embodiments, a given lattice-of-sensors 1023may be arranged in lattice configuration.

Note, initial predetermined spacing 1025 may change over time. Forexample, as the given material-of-interest 1028 may cure and/or harden,initial predetermined spacing 1025 may alter. In some embodiments,initial predetermined spacing 1025 may be calibrated before and aftersuch curing and/or hardening of material-of-interest 1028.

Note, FIG. 10D may also depict a known coordinate system and knownorigin 1325 (i.e., origin 1325 of chosen coordinate system). Origin 1325and a chosen coordinate system may be further discussed in the FIG. 13Adiscussion below.

FIG. 11A may be a diagrammatical top view (or a side view in someembodiments) of a reader-and-calibration-member 1109, in accordance withsome embodiments of the present invention. In some embodiments,reader-and-calibration-member 1109 may comprise one or more readers 100.In some embodiments, reader-and-calibration-member 1109 may comprise oneor more reference-sensor-tags 1102. In some embodiments,reader-and-calibration-member 1109 may comprise a reader-housing-member1108. In some embodiments, reader-and-calibration-member 1109 maycomprise a reference-housing-member 1107. In some embodiments,reader-and-calibration-member 1109 may comprise one or more of:reader-housing-member 1108, reader 100, reference-housing-member 1107,and reference-sensor-tags 1102. In some embodiments,reader-and-calibration-member 1109 may house reader-housing-member 1108and reference-housing-member 1107. In some embodiments,reader-housing-member 1108 may house one or more readers 100. In someembodiments, reference-housing-member 1107 may house one or morereference-sensor-tags 1102. In some embodiments,reader-and-calibration-member 1109 may be a structural member. In someembodiments, reader-housing-member 1108 may be a structural member. Insome embodiments, reference-housing-member 1107 may be a structuralmember. In some embodiments, reader-and-calibration-member 1109 may berigid to semi-rigid. In some embodiments, reader-housing-member 1108 maybe rigid to semi-rigid. In some embodiments, reference-housing-member1107 may be rigid to semi-rigid. In some embodimentsreader-housing-member 1108 may be separated fromreference-housing-member 1107 by a member-separation-distance 1110. Insome embodiments, a given reader 100 may be separated from a givenreference-sensor-tag 1102 by a reader-tag-separation-distance 1111. Insome embodiments, member-separation-distance 1110 and/orreader-tag-separation-distance 1111 may be known (predetermined) andfixed distances. In some embodiments, member-separation-distance 1110and/or reader-tag-separation-distance 1111 may be changed to a number ofdifferent known distances.

In some embodiments, a given reference-sensor-tag 1102 may be a wirelesssensor tag. In some embodiments, a given reference-sensor-tag 1102 maybe one or more of: a RFID (radio frequency identification) sensor tag; aNFC (near field communication) sensor tag; a backscatter sensor tag;and/or magnetic inductive activated sensor tag.

Continuing discussing FIG. 11A, in some embodiments, a givenreference-sensor-tag 1102 may be structurally the same or substantiallythe same as a given monitoring-sensor-tag 120, except thatreference-sensor-tags 1102 are not attached to the givenmaterial-of-interest. Rather, in some embodiments, reference-sensor-tags1102 may be attached to reader-and-calibration-member 1109,reference-housing-member 1107, and/or fixed with respect to a given setof at least one antennas 110 of readers 100. Thus, for the structures ofreference-sensor-tags 1102, refer back to disclosed and discussedstructures for monitoring-sensor-tags 120. That is, in some embodiments,each reference-sensor-tag 1102 may comprise at least onesecond-electric-circuit (which may be structurally the same orsubstantially the same to electric circuit 140 or processing circuitry204). In some embodiments, each reference-sensor-tag 1102 may compriseat least one second-sensor (which may be structurally the same orsubstantially the same to various sensors discussed and disclosedherein, such as, but not limited to capacitive-based sensor 202 and/orresistance-based sensor 203). In some embodiments, eachreference-sensor-tag 1102 may comprise at least one fourth-antenna(which may be structurally the same or substantially the same to atleast one antenna 130). In some embodiments, the at least onefourth-antenna may be in communication with the at least onesecond-electric-circuit. In some embodiments, the at least onesecond-electric-circuit may be in communication with the at least onesecond-sensor. In some embodiments, when at least one fourth-antenna mayreceive electromagnetic (EM) signaling (e.g., radio waves from at leastone antenna 110 of a given reader 100), then the at least onesecond-electric-circuit may take (or cause to be taken) one or more“calibration-readings” from the at least one second-sensor and then theat least one second-electric-circuit may cause transmission of such oneor more calibration-readings using the at least one fourth-antenna, backto the at least one antenna 110 of that given reader 100.

Note, in terms of terminology nomenclature, when the term“fourth-antenna” may be used (which may be an antenna of areference-sensor-tags 1102), then antenna 130 may be a “first-antenna,”and antenna 110 may be a “second-antenna,” and a “third-antenna” may bean antenna of position-reference-tag 1203 to be discussed below in aFIG. 12 discussion below.

Continuing discussing FIG. 11A, in some embodiments, each reader 100 (ofreader-and-calibration-member 1109) may comprise at least one antenna110. In some embodiments, each reference-sensor-tag 1102 may be fixed toeach at least one antenna 110 of reader 100. In some embodiments, eachreference-sensor-tag 1102 may be fixed to each at least one antenna 110of reader 100 at predetermined distance(s). In some embodiments, aminimum of such predetermined distance may be substantiallyreader-tag-separation-distance 1111 or approximated byreader-tag-separation-distance 1111. In some embodiments, eachreference-sensor-tag 1102 may comprise the at least one fourth-antenna.In some embodiments, each at least one fourth-antenna may be fixed withrespect to each at least one antenna 110 of each reader of eachreader-and-calibration-member 1109.

FIG. 11B may be a diagrammatical top view of areader-and-calibration-member 1109, in accordance with some embodimentsof the present invention. Reader-and-calibration-member 1109 shown inFIG. 11B, as compared against FIG. 11A discussed above, may depictadditional detail, in that in FIG. 11B the at least one antennas 110 ofeach reader 100 of reader-and-calibration-member 1109 may be shown. InFIG. 11B, reader-antenna-tag-separation-distance 1112 may be depicted.In some embodiments, reader-antenna-tag-separation-distance 1112 may bea predetermined and fixed distance between a given at least one antenna110 and a given reference-sensor-tag 1102. In some embodiments,reader-antenna-tag-separation-distance 1112 may be a predetermined andfixed distance between a given at least one antenna 110 and a given atleast one fourth-antenna of a given reference-sensor-tag 1102. In someembodiments, each at least one antenna 110 of each reader 100 (ofreader-and-calibration-member 1109) may be fixed with respect to eachreference-sensor-tags 1102. In some embodiments,reader-antenna-tag-separation-distance 1112 may be changed to a numberof different known distances.

FIG. 11C may be a diagrammatical top view of areader-and-calibration-member 1109 with an antenna-interface 1115, inaccordance with some embodiments of the present invention.Reader-and-calibration-member 1109 shown in FIG. 11C, as comparedagainst FIG. 11A discussed above, may depict additional detail, in thatin FIG. 11C the at least one antennas 110 of each reader 100 ofreader-and-calibration-member 1109 may be shown. In FIG. 11C,reader-antenna-tag-separation-distance 1113 may be depicted. In someembodiments, reader-antenna-tag-separation-distance 1113 may be apredetermined and fixed distance between a given at least one antenna110 and a given reference-sensor-tag 1102. In some embodiments,reader-antenna-tag-separation-distance 1113 may be a predetermined andfixed distance between a given at least one antenna 110 and a given atleast one fourth-antenna of a given reference-sensor-tag 1102. In someembodiments, each at least one antenna 110 of each reader 100 (ofreader-and-calibration-member 1109) may be fixed with respect to eachreference-sensor-tags 1102.

Reader-and-calibration-member 1109 shown in FIG. 11C, as comparedagainst FIG. 11B discussed above, may depict additional detail, in thatin FIG. 11C antenna-interface 1115 may be shown. In some embodiments, agiven reader 100 may comprise antenna-interface 1115 and at least oneantenna 110. In some embodiments, antenna-interface 1115 may be incommunication with each at least one antenna 110 for that given reader100. In some embodiments, antenna-interface 1115 may be hardware block.In some embodiments, antenna-interface 1115 may facilitatecommunications between at least one antenna 110 and one or more of: acontrol circuit and/or a processor 1801 (or processing module) (seee.g., FIG. 18). Continuing discussing FIG. 11C, in some embodiments,antenna-interface 1115 may function in communication routing and/orfunction as a duplex. In some embodiments, antenna-interface 1115 maytranslate data and/or commands from the control circuit and/or processor1801 (or processing module) into signals for transmission via at leastone antenna 110. In some embodiments, antenna-interface 1115 maytranslate signals received via at least one antenna 110 into data (e.g.,the one or more readings and/or the one or more calibration-readings)and/or commands destined for the control circuit and/or for processor1801 (or processing module).

With respect to FIG. 11A, FIG. 11B, and/or FIG. 11C, in a givenreader-and-calibration-member 1109, locations of all includedreference-sensor-tags 1102 relative to all included readers 100 and allincluded at least one antennas 110, may be known parameters, or may bemathematically determined, thus allowing a calibration process toincrease precision of the one or more readings frommonitoring-sensor-tag 120 attached to a given material-of-interest.

Note in some embodiments, disclosed structures and functions for a givenreader-and-calibration-member 1109 may apply to a given reader 100. Thatis, in some embodiments, a given reader 100 may be the givenreader-and-calibration-member 1109.

FIG. 12 may be a diagrammatical side view (or a top view or a bottomview, in some embodiments) of a position-reference-member 1204, inaccordance with the present invention. In some embodiments,position-reference-member 1204 may be a structural member. In someembodiments, position-reference-member 1204 may be rigid to semi-rigid.In some embodiments, during use, position-reference-member 1204 may befixed with respect to patient 1328. In some embodiments,position-reference-member 1204 may comprise one or moreposition-reference-tags 1203. In some embodiments,position-reference-member 1204 may house one or moreposition-reference-tags 1203. In some embodiments, one or moreposition-reference-tags 1203 located on position-reference-member 1204may be arranged in known and/or predetermined positions (i.e.,configurations and/or patterns). For example, and without limiting thescope of the present invention, as shown in FIG. 12, theposition-reference-tags 1203 may be arranged in a substantially linear(straight) arrangement in (on) position-reference-member 1204. Theposition-reference-tags 1203 may also be arranged in an arbitraryarrangement in (on) position-reference-member 1204.

In some embodiments, a given position-reference-tag 1203 may be awireless sensor tag. In some embodiments, a given position-reference-tag1203 may be one or more of: a RFID (radio frequency identification)sensor tag; a NFC (near field communication) sensor tag; a backscattersensor tag; and/or a magnetic inductive activated sensor tag.

Continuing discussing FIG. 12, in some embodiments, a givenposition-reference-tag 1203 may be structurally the same orsubstantially the same as a given monitoring-sensor-tag 120, except thatposition-reference-tags 1203 are not attached to the givenmaterial-of-interest. And in some embodiments, position-reference-tags1203 may not comprise a sensor. Rather, in some embodiments,position-reference-tags 1203 may be attached toposition-reference-member 1204. Thus for the structures ofposition-reference-tags 1203 refer back to disclosed and discussedstructures for monitoring-sensor-tags 120. That is, in some embodiments,each position-reference-tag 1203 may comprise their own electric-circuit(which may be structurally the same or substantially the same toelectric circuit 140, but without elements to handle processing from asensor). In some embodiments, each position-reference-tag 1203 maycomprise at least one third-antenna (which may be structurally the sameor substantially the same to at least one antenna 130). In someembodiments, the at least one third-antenna may be in communication withits own electric-circuit. In some embodiments, when at least onethird-antenna may receive electromagnetic (EM) signaling (e.g., radiowaves from at least one antenna 110 of a given reader 100), then theelectric-circuit of position-reference-tag 1203 may cause transmissionof “calibration-signals” from the at least one third-antenna to betransmitted back to the at least one antenna 110 of that given reader100.

Note, in terms of terminology nomenclature, when the term“fourth-antenna” may be used (which may be an antenna of areference-sensor-tags 1102), then antenna 130 may be a “first-antenna,”and antenna 110 may be the “second-antenna,” and the “third-antenna” maybe the antenna of position-reference-tag 1203.

Also note, any antenna disclosed herein, in some embodiments, may beselected from one or more of: monostatic, bistatic, or multistatic.Further note, any antenna disclosed herein, in some embodiments, may beselected from one or more of: only for receiving, only for transmitting,or for both receiving and transmitting. And further note, receivingand/or transmitting may comprise signals for communication purposes, butalso signals for energy transmission, harvesting, and usage.

Continuing discussing FIG. 12, in some embodiments, positions(locations) of position-reference-tags 1203 may be known with respect toa given origin (e.g., origin 1325 of FIG. 13A and FIG. 13C) and/or agiven coordinate system (e.g., a three-dimensional coordinate system, aCartesian coordinate system, a radial coordinate system, or otherwell-known coordinate system). Because positions (locations) ofposition-reference-tags 1203 may be known, positions (locations) ofreader(s) 100 may be determined relative to the position-reference-tags1203 associated with the position-reference-member 1204. Becausepositions (locations) of position-reference-tags 1203 may be known,positions (locations) of antennas 110 of reader(s) 100 may be determinedrelative to the position-reference-tags 1203 associated with theposition-reference-member 1204. The positions (locations) of readers 100(or their antennas 110) may then be specified relative to a chosenthree-dimensional coordinate system. See e.g., FIG. 13A and FIG. 13C.

FIG. 13A may depict a system for non-invasive monitoring of amaterial-of-interest with one or more monitoring-sensor-tags 120 thatmay be in and/or on patient 1328; wherein the system comprises atranslating-scan-member 1326 that may translate along a predeterminedpath of motion.

In some embodiments, FIG. 13A may depict a three-dimensional Cartesiancoordinate system chosen to determine three-dimensional coordinates of aplurality of position-reference-tags 1203 affixed toposition-reference-member 1204, relative to which the positions(locations) of readers 100 may then be determined. In some embodiments,three dimensional coordinates of at least some of the plurality ofposition-reference-tags 1203 may be specified relative to the chosenCartesian coordinate system defined by known origin 1325, Imaginaryx-axis 1320, Imaginary y-axis 1321, and Imaginary z-axis 1322. Positions(locations) of reference-sensor-tags 1102 affixed toreader-and-calibration-member 1109 and the positions of themonitoring-sensor-tag 120 may also be specified relative to the chosencoordinate system.

Continuing discussing FIG. 13A, in some embodiments,translating-scan-member 1326 may comprise reader-and-calibration-member1109. In some embodiments, reader-and-calibration-member 1109 may beattached to translating-scan-member 1326. In some embodiments,reader-and-calibration-member 1109 may comprise one or morereference-sensor-tags 1102. In some embodiments,reader-and-calibration-member 1109 may comprise one or more readers 100.In some embodiments, reference-sensor-tags 1102, readers 100, and/orantenna-interface 1115 (where antenna-interface 1115 may be inelectrical communication with the readers 100) may be in electricalcommunication with translating-scan-member 1326. In some embodiments,translating-scan-member 1326 may be in electrical communication with aprocessor 1801.

Continuing discussing FIG. 13A, in some embodiments, the one or moremonitoring-sensor-tags 120 may be located on or in the givenmaterial-of-interest, which may be on or in patient 1328. In someembodiments, the material-of-interest, may be on or in a head of patient1328. In some embodiments, the material-of-interest, may be on or in amouth of patient 1328. In some embodiments, the material-of-interest,may be on or in: tooth 1000, dental-filling 1001, gum 1002,root-canal-cavity 1003, root-canal-post 1004, dental-crown 1005,dental-implant 1007, and/or implant-post 1008 of patient 1328. Note insome embodiments, at least some of the one or moremonitoring-sensor-tags 120 utilized in the system shown in FIG. 13A maycomprise one or more standalone-strain-sensor 1006. See e.g., FIG. 18which may be applied to the system shown in FIG. 13A.

Continuing discussing FIG. 13A, in some embodiments, the system maycomprise patient-fixation-member 1327. In some embodiments,patient-fixation-member 1327 may removably support at least a portion ofpatient 1328. In some embodiments, patient-fixation-member 1327 may be astructural member. In some embodiments, patient-fixation-member 1327 maybe substantially rigid to semi-rigid, not including any portions withpadding. In some embodiments, patient-fixation-member 1327 may besupported structurally by support 1329. In some embodiments, support1329 may attach to patient-fixation-member 1327. In some embodiments,support 1329 may be a structural member. In some embodiments, support1329 may be a rigid to semi-rigid. In some embodiments,patient-fixation-member 1327 may removably support the at least theportion of patient 1328 such that the supported portion of patient 1328may be held relatively (sufficiently) fixed (with respect to origin1325) during scanning, when translating-scan-member 1326 may betranslating and travelling along the predetermined path of motion andthe readers 100 (of reader-and-calibration-member 1109) may be scanning.In some embodiments, patient 1328 may breathe normally and blinknormally, as a scanning frequency may be comparatively faster that suchnormal motions of patient 1328 may not adversely affect processing ofreceived readings and transmissions from monitoring-sensor-tag 120and/or from position-reference-tags 1203. In some embodiments,patient-fixation-member 1327 may comprise a chin rest to removablysupport a chin of patient 1328. In some embodiments,patient-fixation-member 1327 may comprise position-reference-member1204; and position-reference-member 1204 may comprise one or moreposition-reference-tags 1203. In some embodiments,position-reference-member 1204 may be attached topatient-fixation-member 1327. In some embodiments,position-reference-member 1204 may be attached topatient-fixation-member 1327 at the chin rest. During scanning,position-reference-member 1204 may be fixed with respect to origin 1325and the chosen coordinate system. During scanning, the one or moreposition-reference-tags 1203 of position-reference-member 1204 may befixed with respect to origin 1325 and the chosen coordinate system.Recall, in some embodiments, position-reference-member 1204 may housethe one or more position-reference-tags 1203.

Continuing discussing FIG. 13A, in some embodiments, the predeterminedpath of motion of translating-scan-member 1326 may translatesubstantially around patient-fixation-member 1327, which may beremovably supporting the at least the portion of patient 1328. In someembodiments, this predetermined path of motion may be curved, sinuous,arcing, ellipsoidal, circular, semi-circular, and/or the like. In someembodiments, translating-scan-member 1326 may be a rotating-scan-member.

FIG. 13B may depict a system for non-invasive monitoring of amaterial-of-interest with one or more monitoring-sensor-tags 120 thatmay be in and/or on patient 1328; wherein the system comprise areader-housing-member 1108 with one or more readers 100 that maycommunicate with the one or monitoring-sensor-tags 120. The system shownin FIG. 13B may differ fundamentally from the system shown in FIG. 13A,by the system in FIG. 13B not utilizing a translating-scan-member 1326;that is, scanning in the system in FIG. 13B, may be accomplished withouttranslation mechanics; that is, the scanning in the system of FIG. 13Bmay be accomplished statically (fixedly).

Continuing discussing FIG. 13B, in some embodiments, the one or moremonitoring-sensor-tags 120 may be located on or in the givenmaterial-of-interest, which may be on or in patient 1328. In someembodiments, the material-of-interest, may be on or in a head of patient1328. In some embodiments, the material-of-interest, may be on or in amouth of patient 1328. In some embodiments, the material-of-interest,may be on or in: tooth 1000, dental-filling 1001, gum 1002,root-canal-cavity 1003, root-canal-post 1004, dental-crown 1005,dental-implant 1007, and/or implant-post 1008 of patient 1328. Note insome embodiments, at least some of the one or moremonitoring-sensor-tags 120 utilized in the system shown in FIG. 13B maycomprise one or more standalone-strain-sensor 1006. See e.g., FIG. 18which may be applied to the system shown in FIG. 13B.

Continuing discussing FIG. 13B, in some embodiments, the system maycomprise patient-fixation-member 1327. In some embodiments,patient-fixation-member 1327 may removably supports at least a portionof patient 1328. In some embodiments, patient-fixation-member 1327 maybe a structural member. In some embodiments, patient-fixation-member1327 may be substantially rigid to semi-rigid, not including anyportions with padding. In some embodiments, patient-fixation-member 1327may be supported structurally by support 1329 (not shown in FIG. 13B).In some embodiments, support 1329 may attach to patient-fixation-member1327. In some embodiments, support 1329 may be a structural member. Insome embodiments, support 1329 may be a rigid to semi-rigid. In someembodiments, patient-fixation-member 1327 may removably supports the atleast the portion of patient 1328 such that the supported portion ofpatient 1328 may be held relatively (sufficiently) fixed (with respectto origin 1325) during scanning, when readers 100 and/orreference-sensor-tags 1102 may be wirelessly transmitting and/orwirelessly receiving transmissions. In some embodiments, patient 1328may breathe normally and blink normally, as a scanning frequency may becomparatively faster that such normal motions of patient 1328 may notadversely affect processing of received readings and transmissions frommonitoring-sensor-tag 120 and/or from reference-sensor-tags 1102. Insome embodiments, patient-fixation-member 1327 may comprise a chin restto removably support a chin of patient 1328. In some embodiments,patient-fixation-member 1327 may comprise reader-housing-member 1108;and reader-housing-member 1108 may comprise one or more readers 100. Insome embodiments, reader-housing-member 1108 may be attached topatient-fixation-member 1327. In some embodiments, reader-housing-member1108 may be attached to patient-fixation-member 1327 at the chin rest(now shown in FIG. 13B). In some embodiments, reader-housing-member 1108may be at least partially curved so as to arrange readers 100 at leastpartially around target regions to be scanned, i.e., thematerial(s)-of-interest with the one or more monitoring-sensor-tags 120to be scanned. In some embodiments, arrangement of readers 100, viageometry of reader-housing-member 1108 may also locate at least somereaders 100 above and below the material(s)-of-interest with the one ormore monitoring-sensor-tags 120 to be scanned.

Continuing discussing FIG. 13B, in some embodiments,patient-fixation-member 1327 may comprise reference-housing-member 1107;and reference-housing-member 1107 may comprise one or morereference-sensor-tags 1102. In some embodiments,reference-housing-member 1107 may be attached to patient-fixation-member1327. In some embodiments, reference-housing-member 1107 may be attachedto patient-fixation-member 1327 at the chin rest. In some embodiments,reference-housing-member 1107 may be at least partially curved so as toarrange reference-sensor-tags 1102 at least partially around targetregions to be scanned, i.e., the material(s)-of-interest with the one ormore monitoring-sensor-tags 120 to be scanned by readers 100. In someembodiments, arrangement of reference-sensor-tags 1102, via geometry ofreference-housing-member 1107 may also locate at least somereference-sensor-tags 1102 above and/or below thematerial(s)-of-interest with the one or more monitoring-sensor-tags 120to be scanned. In some embodiments, reference-housing-member 1107 may besubstantially parallel with reader-housing-member 1108. In someembodiments, reference-housing-member 1107 may be located below, above,or both below and above reader-housing-member 1108. During scanning,readers 100 and/or reference-sensor-tags 1102 may be fixed with respectto patient-fixation-member 1327. Recall, in some embodiments, positions(locations) of reference-sensor-tags 1102 may be known or mathematicallydetermined (derived).

FIG. 13C may depict a system for non-invasive monitoring of amaterial-of-interest with one or more monitoring-sensor-tags 120 thatmay be in and/or on patient 1328; wherein the system comprises atranslating-scan-member 1326 that may translate along a predeterminedpath of motion. The system shown in FIG. 13C may be more akin to thesystem of FIG. 13A, in that both systems may utilize a type oftranslating-scan-member 1326 but with different predetermined paths ofmotion. In some embodiments, translating-scan-member 1326 of FIG. 13Cmay be a reciprocating translating member, wherein the predeterminedpath may be substantially linear (straight). Also, thepatient-fixation-member 1327 utilized in the system of FIG. 13C may alsobe structurally different from the patient-fixation-member 1327 shown inFIG. 13A. In some embodiments, patient-fixation-member 1327 of FIG. 13Cmay be a platform for supporting up to all of patient 1328 upon such aplatform. In some embodiments, patient 1328 may lay (in variouspositions) upon this platform embodiment of patient-fixation-member1327. In some embodiments, the predetermined path may have a length thatsubstantially matches a length of this platform embodiment ofpatient-fixation-member 1327. In some embodiments, the predeterminedpath may have a width that substantially matches a width of thisplatform embodiment of patient-fixation-member 1327; in which case,translating-scan-member 1326 may also translate in a side to side motionas well as reciprocating along the length of the predetermined path. Orin some embodiments, a width of reader-and-calibration-member 1109 maybe sufficient wide to accommodate scanning the width of this platformembodiment of patient-fixation-member 1327.

Continuing discussing FIG. 13C, the material(s)-of-interest with the oneor more monitoring-sensor-tags 120 may be located on or in patient 1328.In some embodiments, the material(s)-of-interest with the one or moremonitoring-sensor-tag 120 may be located anywhere on or in patient 1328.In some embodiments, the material(s)-of-interest with the one or moremonitoring-sensor-tag 120 need not be constrained to a head region (norto a mouth region) of patient 1328. For example, and without limitingthe scope of the present invention, as shown in FIG. 13C, thematerial-of-interest with the one or more monitoring-sensor-tags 120 maybe located in (or on) a left leg region of patient 1328. Note in someembodiments, at least some of the one or more monitoring-sensor-tags 120utilized in the system shown in FIG. 13C may comprise one or morestandalone-strain-sensor 1006. See e.g., FIG. 18 which may be applied tothe system shown in FIG. 13C.

FIG. 14A may be a schematic view of a single monitoring-sensor-tag 120and a plurality of readers 100 that may communicate (wirelessly) withthe single monitoring-sensor-tag 120. Thus, the arrangement of FIG. 14Amay be applicable to the system of FIG. 13B. Knowing the positions(locations) of the readers 100, then a position (location) of the singlemonitoring-sensor-tag 120 may be determined. Prior to such position(location) determination, the single monitoring-sensor-tag 120 may haveunknown coordinates (e.g., x, y, and z in a Cartesian coordinatesystem). Whereas, in some embodiments, the readers 100 may have known(or determinable) coordinates relative to the chosen coordinate system,which may include a known origin. A process (method) for determining thecoordinates of the single monitoring-sensor-tag 120 may be utilized todetermine position (location) of all such monitoring-sensor-tags 120 inuse in a given system. And thus, positions (locations) corresponding tothe readings from sensors (e.g., 202, 203, 1006, and/or the like) of thegiven monitoring-sensor-tags 120 may be determined and analyzed, withrespect to the given material-of-interest that is associated with themonitoring-sensor-tags 120.

FIG. 14B may be a schematic view of a single monitoring-sensor-tag 120and a single reader 100; wherein the single reader 100 may translate (indirection-of-motion 1400) with respect to the singlemonitoring-sensor-tag 120; and wherein the single reader 100 and thesingle monitoring-sensor-tag 120 may be in wireless communication. Thus,the arrangement of FIG. 14B may be applicable to the system of FIG. 13A(and/or the system of FIG. 13C).

In some embodiments, knowing the positions (locations) of the singlereader 100 as a function of time, a position (location) of the singlemonitoring-sensor-tag 120 (which may be fixed during scanning) may bedetermined. Prior to such position (location) determination, the singlemonitoring-sensor-tag 120 may have unknown coordinates (e.g., x, y, andz in a Cartesian coordinate system). Whereas, in some embodiments, thetranslating single reader 100 may have known (or determinable)coordinates relative to the chosen coordinate system and as a functionof time, which may include a known origin or known starting position ata starting time. A process (method) for determining the coordinates ofthe single monitoring-sensor-tag 120 may be utilized to determineposition (location) of all such monitoring-sensor-tags 120 in use in agiven system. And thus, positions (locations) corresponding to thereadings from sensors (e.g., 202, 203, 1006, and/or the like) of thegiven monitoring-sensor-tags 120 may be determined and analyzed, withrespect to the given material-of-interest that is associated with themonitoring-sensor-tags 120.

Determining positions (locations) of any given monitoring-sensor-tag120, and/or determination of any given reader 100, may involvewell-known local position systems (LPS) techniques; that may utilize oneor more of the following mathematical techniques: triangulation,trilateration, multilateration, combinations thereof, and/or the like.Additionally, such information may be utilized in such positionalcalculations: known reference points (e.g., origin 1325 and/or knownlocations of position-reference-tags 1203); direct paths (line of sightor LoS); angle of incidence (or angle of arrival or AoA); phasedifference of arrival (PDoA); received signal strength indicator (RSSI);time of arrival (ToA); time of flight (ToF); and/or time difference ofarrival (TDoA).

For example, the following discussion presents one method fordetermining position (location) information of a givenmonitoring-sensor-tag 120 according to the configuration of FIG. 14A.Let us stipulate that reader 100 number i has coordinates (x_(i), y_(i),z_(i)). The actual distance (range) between the givenmonitoring-sensor-tag 120 n,m with coordinates x=[x y z] and reader 100number i is r_((m,n),i) The distance measured between the givenmonitoring-sensor-tag 120 n,m and reader 100 number i is h_((m,n),i).The range measurement error is assumed to be a random variablew_((m,n),i) with variance σ_((m,n),i) ² h_((m,n),i) can be expressed asfollows:h _((m,n),i) =r _((m,n),i) +w _((m,n),i)  (5)Let us assume that the number (quantity) of readers 100 used todetermine position (location) of the given monitoring-sensor-tag 120 n,mis s. The distance (range) between the given monitoring-sensor-tag 120n,m and reader 100 number i, denoted as r_((m,n),i) may be expressed as:r _((n,m),i)=√{square root over ((x _(i) −x)²+(y _(i) −y)²+(z _(i)−z)²)}i=1,2, . . . ,s  (6)We can therefore express the measured distance between the givenmonitoring-sensor-tag 120 n,m and reader 100 number i as:h _((m,n),i)=√{square root over ((x _(i) −x)²+(y _(i) −y)²+(z _(i)−z)²)}+w _((m,n),i)  (7)In vector form, the vector r _((n,m))(x) of distances (ranges) betweenthe given monitoring-sensor-tag 120 n,m with coordinates x=[x y z] andthe readers 100 where number i may be 1, 2, 3, . . . , s is:

$\begin{matrix}{{{\overset{\_}{r}}_{({n,m})}\left( \overset{\_}{x} \right)} = \begin{bmatrix}\sqrt{\left( {x_{1} - x} \right)^{2} + \left( {y_{1} - y} \right)^{2} + \left( {z_{1} - z} \right)^{2}} \\\sqrt{\left( {x_{2} - x} \right)^{2} + \left( {y_{2} - y} \right)^{2} + \left( {z_{2} - z} \right)^{2}} \\\vdots \\\sqrt{\left( {x_{s} - x} \right)^{2} + \left( {y_{s} - y} \right)^{2} + \left( {z_{s} - z} \right)^{2}}\end{bmatrix}} & (8)\end{matrix}$In vector form, the vector h _((n,m)) of measured distances between thegiven monitoring-sensor-tag 120 n,m and the readers 100 where number imay be 1, 2, 3, . . . , s is:h _((n,m))=[h _((m,n),1) h _((m,n),2) . . . h _((m,n),s)]^(T)  (9)where T is a symbol for a vector or a matrix transpose.In vector form, the vector w _((n,m)) of measurement errors of thedistances between the given monitoring-sensor-tag 120 n,m and thereaders 100 where number i may be 1, 2, 3, . . . , s is:w _((n,m))=[w _((m,n),1) w _((m,n),2) . . . w _((m,n),s)]^(T)  (10)We may express equation (5) in vector form, expressing the vector ofdistance measurements h _((n,m)) as follows:h _((n,m))( x )= r _((n,m))( x )+ w _((n,m))  (11)

$\begin{matrix}{{{\overset{\_}{h}}_{({n,m})}\left( \overset{\_}{x} \right)} = {\begin{bmatrix}\sqrt{\left( {x_{1} - x} \right)^{2} + \left( {y_{1} - y} \right)^{2} + \left( {z_{1} - z} \right)^{2}} \\\sqrt{\left( {x_{2} - x} \right)^{2} + \left( {y_{2} - y} \right)^{2} + \left( {z_{2} - z} \right)^{2}} \\\vdots \\\sqrt{\left( {x_{s} - x} \right)^{2} + \left( {y_{s} - y} \right)^{2} + \left( {z_{s} - z} \right)^{2}}\end{bmatrix} + {\overset{\_}{w}}_{({n,m})}}} & (12)\end{matrix}$We need to estimate location coordinate x=[x y z]^(T) for eachmonitoring-sensor-tag 120 n,m given the vector of distance measurementsh _((n,m)) between the given monitoring-sensor-tag 120 n,m and thereaders 100 where i may be 1, 2, 3, . . . , s.

Alternatively (or in addition to), in conformity with the arrangementshown in FIG. 14B, a single moving reader 100 number i may be used toobtain a series of coordinates (x_(i), y_(i), z_(i)) of this reader 100number i, assuming the movement of this reader 100 number i may becontrolled and its coordinates known, and as a function of time.

There are numerous well-known methods (techniques and/or algorithms) toestimate x in equation (11). Based on the results of a calibrationprocess described below, one may optionally use Nonlinear Least Squares(NLS) or Maximum Likelihood (ML) estimators among other availableoptimization techniques.

An optional Nonlinear Least Squares (NLS) approach minimizes the leastsquares cost function derived from equation (7). It is a widely used andwell-known method, that is discussed below. Based on equation (7) onemay denote the NLS cost function C(x) of the given monitoring-sensor-tag120 n,m position estimate x=[x y z]^(T) as:

$\begin{matrix}{{C\left( \overset{\_}{x} \right)} = {{\sum\limits_{i = 1}^{s}\left( {h_{{({m,n})},i} - \sqrt{\left( {x_{i} - x} \right)^{2} + \left( {y_{i} - y} \right)^{2} + \left( {z_{i\;} - z} \right)^{2}}} \right)^{2}} = {\left( {\overset{\_}{h} - {\overset{\_}{r}\left( \overset{\_}{x} \right)}} \right)^{T}\left( {\overset{\_}{h} - {r\left( \overset{\_}{x} \right)}} \right)}}} & (13)\end{matrix}$where:

-   -   (x_(i), y_(i), z_(i)) are coordinates of Reader 100 number i,        where i may be 1, 2, . . . , s; and    -   h_((m,n),i) the measured distance between the given        monitoring-sensor-tag 120 n,m and reader 100 number i.        The NLS position estimate {circumflex over (x)} will correspond        to the smallest value of the cost function C(x):        {circumflex over (x)}=arg min _(x) C( x )  (14)        Levenberg-Marquardt Algorithm (LMA), Newton-Raphson Algorithm        (NRA), Gauss-Newton Algorithm (GNA) are some methods widely used        for solving optimization problem in equation (14).

An optional Maximum Likelihood (ML) approach is a widely used andwell-known method for solving non-linear equations by means ofmaximizing the Probability Density Function (PDF) of the function inquestion.

A probability density function ρ(h _((n,m))) for the vector of measureddistances h _((m,n)) from equation (11) may be expressed as:

$\begin{matrix}{{\rho\left( {\overset{\_}{h}}_{({n,m})} \right)} = {\frac{1}{\left( {2\pi} \right)^{\frac{s}{2}}{R}^{\frac{1}{2}}}{\exp\left( {{- \frac{1}{2}}\left( {{\overset{\_}{h}}_{({n,m})} - {\overset{\_}{r}}_{({n,m})}} \right)^{T}{R^{- 1}\left( {{\overset{\_}{h}}_{({n,m})} - {\overset{\_}{r}}_{({n,m})}} \right)}} \right.}}} & (15)\end{matrix}$where R is the covariance matrix of h _((n,m)) wherein R may be definedas:R=E{( h _((n,m)) −r _((n,m)))( h _((n,m)) −r _((n,m)))^(T)}=diag(σ₁ ²,σ₂², . . . ,σ_(s) ²)  (16)where σ_(i) ² of is the variance of the range measurement errorw_((m,n),i) from above equation (6). R⁻¹ is matrix inverse of the matrixR and |R| is determinant of matrix RMaximization of the probability density function ρ(h _((n,m))) of thevector of measured distances h _((n,m)) in equation (12) may beexpressed as the following minimization problem:{circumflex over (x)}=arg min _(x) C( x )  (17)where C(x) is a cost function of the position estimate x=[x y z]^(T) ofthe given monitoring-sensor-tag 120 n,m expressed as:

$\begin{matrix}{{C\left( \overset{\_}{x} \right)} = {{\left( {{\overset{\_}{h}}_{({n,m})} - {\overset{\_}{r}}_{({n,m})}} \right)^{T}{R^{- 1}\left( {{\overset{\_}{h}}_{({n,m})} - {\overset{\_}{r}}_{({n,m})}} \right)}} = {\sum\limits_{i = 1}^{s}\frac{\left( {h_{{({m,n})},i} - \sqrt{\left( {x_{i} - x} \right)^{2} + \left( {y_{i} - y} \right)^{2} + \left( {z_{i} - z} \right)^{2}}} \right)}{\sigma_{i}^{2}}}}} & (18)\end{matrix}$where:

-   -   (x_(i), y_(i), z_(i)) are coordinates of Reader 100 number i,        wherein number i may be 1, 2, . . . , s;    -   h_((m,n),i) is the measured distance between the given        monitoring-sensor-tag 120 n,m and reader 100 number i; and    -   x=[x y z]^(T) is the position estimate of the given        monitoring-sensor-tag 120 n,m.        Levenberg-Marquardt Algorithm (LMA), Newton-Raphson Algorithm        (NRA), Gauss-Newton Algorithm (GNA) are some methods widely used        for solving optimization problem in equation (17).

Linear approaches for initial coordinate estimate. Many approaches havebeen used to convert non-linear equations (12) copied below:

$\begin{matrix}{{{\overset{\_}{h}}_{({n,m})}\left( \overset{\_}{x} \right)} = {\begin{bmatrix}\sqrt{\left( {x_{1} - x} \right)^{2} + \left( {y_{1} - y} \right)^{2} + \left( {z_{1} - z} \right)^{2}} \\\sqrt{\left( {x_{2} - x} \right)^{2} + \left( {y_{2} - y} \right)^{2} + \left( {z_{2} - z} \right)^{2}} \\\vdots \\\sqrt{\left( {x_{s} - x} \right)^{2} + \left( {y_{s} - y} \right)^{2} + \left( {z_{s} - z} \right)^{2}}\end{bmatrix} + {\overset{\_}{w}}_{({n,m})}}} & (12)\end{matrix}$to set of linear equations, direct solution of which may provide a startpoint for an optimization process employed for finding the coordinatesof the given monitoring-sensor-tag 120 n,m in above equations (14) and(17). Some embodiments may employ widely described and well-known LinearLeast Squares (LLS) and Weighted Linear Least Squares (WLLS) approachesin order to convert non-linear equation (12) into a linear forma; andthen to find x=[x y z]^(T) which is used as a start point for subsequentoptimization processes in determining coordinates of the givenmonitoring-sensor-tag 120 n,m.

FIG. 15 may depict a flow diagram illustrating steps in a method 1500for non-invasive monitoring of a material-of-interest with one or moremonitoring-sensor tag 120 using one or more readers 100.

Continuing discussing FIG. 15, in some embodiments method 1500 maycomprise step 1530; wherein step 1530 may be a step of calibratingreaders 100 that are to be used. That is in some embodiments, method1500 may begin with step 1530 of calibrating the readers 100. Reader 100calibration in step 1530 may involve wireless communication betweenreaders 100 and reference-sensor-tags 1102. Recall, in some embodiments,reference-sensor-tags 1102 may have known locations (positions,coordinates). In some embodiments, reference-sensor-tags 1102 maycomprise stress (deformation) sensor resistors (such as 700 and/or 703)with known parameters. In some embodiments, reference-sensor-tags 1102may comprise capacitor-based relative permittivity sensors (such as 402,404, 405, 406, 407, and/or 408) with known parameters. In someembodiments, reference-sensor-tags 1102 may comprise one or more of:stress (deformation) sensor resistors (such as 700 and/or 703); and/orcapacitor-based relative permittivity sensors (such as 402, 404, 405,406, 407, and/or 408) with known parameters. Such sensors ofreference-sensor-tags 1102 may provide the one or more“calibration-readings” back to readers 100; which may then provide forvarious reference (or foundational) qualities to assist in calibratingreaders 100. In some embodiments, reference-sensor-tags 1102 sensors mayalso sense local (ambient) temperature to aid in temperature calibrationwhile the local (ambient) temperature in vicinity of said sensors isknown.

Continuing discussing FIG. 15, in some embodiments, method 1500 maycomprise step 1531. In some embodiments, successful conclusion of step1530 may then transition into step 1531. In some embodiments, step 1531may be a step of determining a location (i.e., position and/orcoordinates) of the one or more readers 100. Step 1531 may beaccomplished by wireless communication between readers 100 andreference-sensor-tags 1102, wherein locations of reference-sensor-tags1102 may be known and thus locations of readers 100 may be determinedrelative to these known locations of reference-sensor-tags 1102.

Continuing discussing FIG. 15, in some embodiments, method 1500 maycomprise step 1532. In some embodiments, successful conclusion of step1531 may then transition into step 1532. In some embodiments, step 1532may be a step of reader 100 interrogation of the one or moremonitoring-sensor-tags 120 that are associated with thematerial-of-interest. In some embodiments, in this interrogation step1532, a number (quantity) of available one or moremonitoring-sensor-tags 120 may be transmitted back to the readers 100and determined. In some embodiments, in this interrogation step 1532,“additional information” of the one or more monitoring-sensor-tags 120may be transmitted back to the readers 100 and determined. In someembodiments, this “additional information” may comprise one or more of:identification information for a given monitoring-sensor-tag 120 that istransmitting (e.g., an ID for each monitoring-sensor-tag 120 that istransmitting); model number for the given monitoring-sensor-tag 120 thatis transmitting; serial number for the given monitoring-sensor-tag 120that is transmitting; manufacturer of the given monitoring-sensor-tag120 that is transmitting; year of manufacture of the givenmonitoring-sensor-tag 120 that is transmitting; or a request for asecurity code associated with that given monitoring-sensor-tag 120 thatis transmitting; a public security key; a cyclic redundancy check codefor the given monitoring-sensor-tag 120 that is transmitting; a paritycheck code for the given monitoring-sensor-tag 120 that is transmitting;and receipt of a disable instruction for the given monitoring-sensor-tag120 that is transmitting; wherein the given monitoring-sensor-tag 120that is transmitting is selected from the one or moremonitoring-sensor-tags 120.

The cyclic redundancy check code and/or the parity check code for thegiven monitoring-sensor-tag 120 that may be transmitting may be knownapproaches to generate additional data based on the transmittedinformation. That additional data, once received by the readers 100 andfurther analyzed by a processor 1801 (see e.g., FIG. 18) may be used tovalidate correct transmission of said transmitted information.

The model number for the given monitoring-sensor-tag 120 that may betransmitting; the serial number for the given monitoring-sensor-tag 120that may be transmitting; and/or the manufacturer of the givenmonitoring-sensor-tag 120 may be information used for identifying thetype of the given monitoring-sensor-tag 120 to be used in subsequentsteps including but not limited to calibration.

Continuing discussing FIG. 15, in some embodiments, step 1532 mayprogress into step 1534 or into step 1533. In some embodiments, method1500 may comprise step 1533. In some embodiments, step 1533 may be anauthentication step, to ensure that only authorized readers 100 (and notsome other RFID type of reading/scanning device) may be accessing theone or more monitoring-sensor-tags 120. For example, and withoutlimiting the scope of the present invention, in some embodiments, theone or more monitoring-sensor-tags 120 may not transmit usefulinformation, such as the one or more readings, unless the givenmonitoring-sensor-tag 120 first receives a proper security code (e.g.,password) from the given reader 100. In some embodiments, the givenmonitoring-sensor-tag 120 may transmit a request for this security codeto the readers 100. In some embodiments, the given monitoring-sensor-tag120 may transmit its public security key in addition for the request forthe said security code to the readers 100. In some embodiments, wherestep 1533 is required in method 1500, successful completion of theauthentication step 1533 may then transition into step 1534.

Some applications of method 1500 may not include step 1533, in whichcase, step 1532 may transition into step 1534.

Continuing discussing FIG. 15, in some embodiments, method 1500 maycomprise step 1534. In some embodiments, step 1534 may follow step 1532or may follow step 1533. In some embodiments, step 1534 may be a step ofdetermining locations (positions and/or coordinates) of the one or moremonitoring-sensor-tags 120. Such location determination may proceed viaLPS (local positioning systems) techniques as discussed above in theFIG. 14A and FIG. 14B discussion.

Continuing discussing FIG. 15, in some embodiments, method 1500 maycomprise step 1535. In some embodiments, step 1535 may follow step 1534.In some embodiments, step 1535 may be a step of the reader 100instructing (i.e., commanding and/or requesting) the one moremonitoring-sensor-tags 120. In some embodiments, such instructions fromthe readers 100 may initiate a process in the one or moremonitoring-sensor-tags 120 such that the given monitoring-sensor-tag 120may generate the one or more readings from their one or more sensors andthen transmit the resulting one or more readings back to the readers 100via the antennas 130 of the given monitoring-sensor-tag 120. Forexample, and without limiting the scope of the present invention, thereaders 100 may request a specific measurement type to provideinformation (one or more readings) that may correlate with specificstate information of the given material-of-interest that may bemonitored and/or tracked by using one or more monitoring-sensor-tags 120attached to (associated with) the given material-of-interest. Recall theone or more readings from the sensors of the one or moremonitoring-sensor-tags 120 may yield state information such as, but notlimited to: structural integrity of a current state of thematerial-of-interest; structural integrity changes of thematerial-of-interest; pressure received at the material-of-interest;force received at the material-of-interest; stress received at thematerial-of-interest; torsion received at the material-of-interest;deformation received at the material-of-interest; temperature at someportion of the material-of-interest; positional changes of a givenmonitoring-sensor-tag 120 attached to the material-of-interest withrespect to position of another monitoring-sensor-tag 120 attached to thematerial-of-interest, wherein the given monitoring-sensor-tag 120 andthe other monitoring-sensor-tag are 120 selected from the one or moremonitoring-sensor-tags 120 attached to the material-of-interest; orpositional changes of at least one monitoring-sensor-tag 120 attached tothe material-of-interest with respect to time, wherein the at least onemonitoring-sensor-tag 120 is selected from the one or moremonitoring-sensor-tags 120. For example, and without limiting the scopeof the present invention, the readers 100 may request a specificmeasurement type from a specific sensor type. For example, and withoutlimiting the scope of the present invention, the readers 100 may requestone or more readings from specific sensors, wherein the specific sensorsmay be identified by a sensor-specific-ID (e.g., a unique sensor numberfor that specific sensor). In some embodiments, the sensor-specific-ID(sensor number) may serve to choose a specific sensor from a number ofsensors of a given monitoring-sensor-tag 120. For example, and withoutlimiting the scope of the present invention, as shown in FIG. 8, anumber of different sensors may exist for a given monitoring-sensor-tag120. For example, and without limiting the scope of the presentinvention, the readers 100 may transmit an oscillator frequency divisionratio to the given monitoring-sensor-tag 120. For example, and withoutlimiting the scope of the present invention, sensors (ofmonitoring-sensor-tags 120) may belong to different ring oscillatorcircuits; and such different ring oscillator circuits may be selectedsequentially or in parallel. That is, any given independent ringoscillators in a given monitoring-sensor-tag 120 may be engaged eithersequentially or in parallel.

Continuing discussing FIG. 15, in some embodiments, method 1500 maycomprise step 1536. In some embodiments, step 1536 may follow step 1535.Alternatively, in some embodiments, step 1536 may be a sub-step of step1535. In some embodiments, step 1536 may be a step of the readers 100transmitting the “restart counting” command to the one or moremonitoring-sensor-tags 120. Recall RESTART_COUNT signal 931 of FIG. 9and the FIG. 9 discussion above. A monitoring-sensor-tag 120 receivingRESTART_COUNT signal 931 may then cause that monitoring-sensor-tag 120to transmit one or more of the following: their current value of theircounter; “maximum count reached” bit; the measurement type (sensortype); the sensor-specific-ID; the sensor's one or more readings; and/orfrequency division rate.

Continuing discussing FIG. 15, in some embodiments, method 1500 maycomprise step 1537. In some embodiments, step 1537 may follow step 1536.In some embodiments, step 1537 may be a step of determining ifadditional measurements to be taken from the sensors of the one or moremonitoring-sensor-tags 120. If yes, then method 1500 may progress backto step 1536. If no, then method 1500 may progress to step 1538. In someembodiments, criteria for evaluating step 1537 may comprise, but may notbe limited to, either achieving the predetermined mathematical varianceof the series of obtained measurements or reaching a pre-defined maximalnumber of measurements.

Continuing discussing FIG. 15, in some embodiments, method 1500 maycomprise step 1538. In some embodiments, step 1538 may follow a “no”outcome of step 1537. In some embodiments, step 1538 may be a step ofdetermining if the reader 100 locations are to be re-determined per step1531. If yes, then method 1500 may progress back to step 1531. If no,then method 1500 may progress to step 1539. In some embodiments,criteria for evaluating step 1538 may be defined by the settingsprovided by the user, matching the type of environment in which thespecific embodiment is used. For example, in the case of a static set ofreaders as related to patient 1328, like the one depicted in FIG. 13B,step 1538 may not be required. In case of a system, like the one shownin FIG. 13C, comprising a translating-scan-member 1326 that maytranslate along a predetermined path of motion, step 1538 may beperformed either each time or at predetermined time intervals to ensurethat the location of the translating-scan-member 1326 is determinedcorrectly.

Continuing discussing FIG. 15, in some embodiments, method 1500 maycomprise step 1539. In some embodiments, step 1539 may follow a “no”outcome of step 1538. In some embodiments, step 1539 may be a step ofdetermining if different measurement types are be taken from the sensorsof the one or more monitoring-sensor-tags 120. If yes, then method 1500may progress back to step 1535. If no, then method 1500 may progress tostep 1540. In some embodiments, criteria for evaluating step 1539 may beprovided by the settings in the specific embodiment. For example, ifmonitoring-sensor-tags 120 of different types are used (e.g., measuringstress, temperature, humidity, liquid penetration, etc.) step 1539 maydetermine that additional measurement types have to be performed.

Continuing discussing FIG. 15, in some embodiments, method 1500 maycomprise step 1540. In some embodiments, step 1540 may follow a “no”outcome of step 1539. In some embodiments, step 1540 may be a step ofreaders 100 transmitting “received monitoring-sensor-tag 120transmissions.” In some embodiments, the received monitoring-sensor-tag120 transmissions may comprise one or more of the following: the one ormore readings; the sensor-specific-ID; the additional information;and/or any other information and/or data transmitted from antennas 130of the one or more monitoring-sensor-tags 120. In some embodiments, thereaders 100 may transmit this “received monitoring-sensor-tag 120transmissions” to processor 1801 (see e.g., FIG. 18) for processing andanalysis. In some embodiments, the readers 100 may transmit this“received monitoring-sensor-tag 120 transmissions” to memory 1803, whereprocessor 1801 (see e.g., FIG. 18) may then access for processing andanalysis. In some embodiments, the readers 100 may transmit this“received monitoring-sensor-tag 120 transmissions” to antenna-interface1115; wherein antenna-interface 1115 may route (transmit) to memory1803, where processor 1801 (see e.g., FIG. 18) may then access forprocessing and analysis. In some embodiments, the readers 100 maytransmit this “received monitoring-sensor-tag 120 transmissions” toantenna-interface 1115; wherein antenna-interface 1115 may route(transmit) to processor 1801 (see e.g., FIG. 18) which may then accessthe said “received monitoring-sensor-tag 120 transmissions” forprocessing and analysis. In some embodiments, the readers 100 maypre-process some of “received monitoring-sensor-tag 120 transmissions”via an electric circuit of the reader 100 prior to transmission to:antenna-interface 1115, memory 1803, or processor 1801.

Overall broadly speaking, calibration may mean adjusting precision basedon known facts (i.e., known data and/or known information). For example,positioning a reference tag at a known distance before start of using adevice may permit fine-tuning of the system. For example, it may beknown what electromagnetic (EM) wave phase delay should be at a distanceof 1 m (i.e., one meter). The extra phase which may be measured may bedue to phase distortion, introduced by tag, antenna, reader 100, cableand; may be filtered out (accounted for) thanks to a calibrationprocess.

It is natural that in the specific system 1800 there may be a need formore than one calibration method based on the type ofmonitoring-sensor-tags 120, readers 100, antennas 110 as well as otherelements of the system 1800. Below, for example, may describe one suchpossible calibration method 1600. In some embodiments, FIG. 16 maydepict a flow diagram illustrating a method 1600 for calibrating thesystem 1800 (see FIG. 18) based on one or more reference-sensor-tags1102. In some embodiments, FIG. 16 may depict a flow diagramillustrating a method 1600 for calibrating one or more readers 100. Insome embodiments, step 1530 of method 1500 shown in FIG. 15 may bemethod 1600. That is, in some embodiments, method 1600 shown in FIG. 16may depict how step 1530 may proceed. In some embodiments, method 1600may comprise steps: step 1680, step 1681, step 1682, and step 1683.

Discussing FIG. 16, in some embodiments, step 1680 may choose a set ofreference-sensor-tags 1102 to match a type and an environmental settingof used (or to be used) monitoring-sensor-tags 120. As noted below, inorder to filter out possible measurement distortions from themeasurements and to fine-tune the system 1800, the type of thereference-sensor-tags 1102 needs to match or to be as close as possibleto the type of monitoring-sensor-tag 120.

Continuing discussing FIG. 16, in some embodiments, step 1681 may be astage at which a calibration method and its settings are chosen based onthe specific system 1800 in place, and based on the user-providedoptions and preferences. For example, and without limiting the scope ofthe present invention, a specific range of the reader 100 frequenciesmay be selected, reader 100 transmitting power may be adjusted, reader100 transmitting mode can be selected, among other settings, during step1681.

Determining range, using one of the techniques above, such as phasedifference of arrival (PDoA), is based on measuring the phase differenceof arrival φ of the electromagnetic (EM) wave emitted by reader 100,wirelessly (e.g., backscattered) by a given monitoring-sensor-tag 120,and received by reader 100, according to the configuration of FIG. 14A,as an example.

Continuing discussing FIG. 16, in some embodiments, step 1682 mayperform phase measurements of monitoring-sensor-tags 120. For eachreader 100 number α_(j) take N measurements of the phase φ(f_(s))_(k)^(α) ^(j) ^(,c) ^(i) (where k=1 . . . N) between α_(j) and eachreference-sensor-tag 1102 number c_(i) allocated to reader 100 numberα_(j) in the software settings. The said phase measurements may be takenat a number of different frequencies f_(s) where s=1 . . . M.

In some embodiments, instead of performing a predefined number N ofphase measurements, a number of phase measurements may be limited by thenumber at which the mathematical variance of φ(f_(s))_(k) ^(α) ^(j)^(,c) ^(i) falls below a predetermined value for each pair α_(j), c_(i)and each frequency f_(s) where s=1 . . . M.

In some embodiments, the phase difference of arrival φ between theelectromagnetic (EM) wave emitted by reader 100, wirelessly (e.g.,backscattered) by a given monitoring-sensor-tag 120, and received byreader 100, according to the configuration of FIG. 14A may be expressedas:φ(f _(s))_(k) ^(α) ^(j) ^(,c) ^(i) =φ_(wave)+φ_(reader)+φ_(tag)Where:φ_(wave) is the phase difference due to the propagation of the emittedelectromagnetic (EM) wave; φ_(reader) is the phase difference introducedby but not limited to reader 100, antenna 110, and cables connectingreader 100 and antenna 110; and φ_(tag) is the phase differenceintroduced by a given monitoring-sensor-tag 120.

Continuing discussing FIG. 16, in some embodiments, step 1683calibration of reference-sensor-tags 1102 measurements may be processedas follows:

-   -   For each reader 100 number α_(j) and each reference-sensor-tag        1102 number c_(i) allocated to the reader 100, calculate:    -   Mean φ(f_(s))_(k) ^(α) ^(j) ^(,c) ^(i) of the phase measurements        φ(f_(s))_(k) ^(α) ^(j) ^(,c) ^(i) between α_(j) and c_(i), k=1 .        . . N for each frequency f_(s) where s=1 . . . M;    -   Difference φ_(delta)(f_(s))_(k) ^(α) ^(j) ^(,c) ^(i) between the        calculated phase φ_(wave)(f_(s))_(k) ^(α) ^(j) ^(,c) ^(i) and        φ(f_(s))_(k) ^(α) ^(j) ^(,c) ^(i)    -   where:        φ_(delta)(f _(s))_(k) ^(α) ^(j) ^(,c) ^(i) =φ_(wave)(f _(s))_(k)        ^(α) ^(j) ^(,c) ^(i) −φ(f _(s))_(k) ^(α) ^(j) ^(,c) ^(i)   (20)        where φ_(wave)(f_(s))_(k) ^(α) ^(j) ^(,c) ^(i) the phase        difference, due to the propagation of the emitted        electromagnetic (EM) wave, mentioned above, is calculated as:

${\varphi_{wave}\left( f_{s} \right)}^{a_{j},c_{i}} = {\left( \frac{4\pi\; r_{j,i}f_{s}}{c} \right){mod}\; 2\pi}$where c is the speed of light constant, mod is modulo (remainder)function, and as r_(j,i) is the known distance (range) from reader 100number α_(j) and reference-sensor-tag 1102 number c_(i).

Thus, the correction φ_(delta)(f_(s))_(k) ^(α) ^(j) ^(,c) ^(i) to beapplied to the reported phase φ(f_(s))_(k) ^(α) ^(j) ^(,c) ^(i) has beencalculated.

FIG. 17 may depict a flow diagram for determining location of one ormore monitoring-sensor-tags 120 associated with (e.g., attached to) thegiven material-of-interest. FIG. 17 may depict method 1700. In someembodiments, method 1700 may be a method for determining location of oneor more monitoring-sensor-tags 120 associated with (e.g., attached to)the given material-of-interest. In some embodiments, method 1700 mayprovide additional details of step 1534 from FIG. 15.

For example, and without limiting the scope of the present invention,method 1700 may be employed to determine locations of one or moremonitoring-sensor-tags 120 located in or on: dental-filling 1001 (FIG.10A); root-canal-cavity 1003 (FIG. 10B); root-canal-post 1004 (FIG.10B); dental-crown 1005 (FIG. 10B); dental-implant 1007 (FIG. 10C);implant-post 1008 (FIG. 10C); and/or the like.

For example, and without limiting the scope of the present invention,method 1700 may be employed to determine locations of one or moremonitoring-sensor-tags 120 located in or on the givenmaterial-of-interest in the systems of FIG. 13A, FIG. 13B, or FIG. 13C.

In some embodiments, method 1700 may comprise method 1600, step 1772,step 1773, and step 1777. See e.g., FIG. 17.

Continuing discussing FIG. 17, in some embodiments, method 1700 maycomprise method 1600 as discussed above, which may be a calibrationmethod. In some embodiments, method 1700 may begin with method 1600.

Continuing discussing FIG. 17, in some embodiments, method 1700 maycomprise step 1772. In some embodiments, successful calibration undermethod 1600 may then transition into step 1772. In some embodiments,step 1772 may be a step of obtaining measurements for determining ranges(distance) of the one or more monitoring-sensor tags 120 between readers100. As mentioned before, one of well-known techniques for location andrange (distance) measurement may include phase difference of arrival(PDoA); received signal strength indicator (RSSI); time of arrival(ToA); time of flight (ToF); and/or time difference of arrival (TDoA).For example, for the phase difference of arrival (PDoA) technique, themeasurements may include phase difference of arrival. In someembodiments, such range measuring may be between each operationalmonitoring-sensor tag 120 selected from the one or moremonitoring-sensor tags 120; and from a predetermined number (quantity)of operational readers 100. In some embodiments, the predeterminednumber (quantity) of operational readers 100 may be selected by a userengaging with software settings; wherein the software may benon-transitorily stored in memory 1803. In some embodiments, thepredetermined number (quantity) of operational readers 100 may be thosereaders 100 closest to the given monitoring-sensor-tag 120. In someembodiments, the predetermined number (quantity) of operational readers100 may be readers 100 determined under method 1600. In some embodimentsof step 1772, measurements for determining of the range (distance)between each monitoring-sensor-tag 120 to each reader 100 from the groupof readers 100 allocated to the given monitoring-sensor-tag 120 may beperformed. In some embodiments, measurements of phase difference ofarrival (PDoA) φ(f_(s))_(k) ^(α) ^(j) ^(,s) ^(u) from eachmonitoring-sensor-tag 120 number s_(u) to each reader 100 number α_(j)in its vicinity may be performed. In some embodiments, “in its vicinity”may be dependent upon a frequency (or a wavelength) of wirelesscommunication utilized by antennas 110 and/or antennas 130 for a givenapplication (for a given use). For example, and without limiting thescope of the present invention, when radio waves may be used by antennas110 and/or antennas 130, then “in its vicinity” may be selected from thegroup of 1 mm (millimeter) to 50 meters or less. In some embodiments,for each reader 100 number α_(j) step 1772 may take M measurements ofphase difference of arrival (PDoA) φ(f_(s))_(k) ^(α) ^(j) ^(,s) ^(u)(where k=1 . . . M) between reader 100 number α_(j) and eachmonitoring-sensor-tag 120 number s_(u) allocated to reader 100 numberα_(j). The said phase measurements may be taken at a number of differentfrequencies f_(s) where s=1 . . . L. In some embodiments, as notedabove, allocation of readers 100 to monitoring-sensor-tags 120 may bepredetermined and/or set by a user engaging with the software setting ofthe software.

Continuing discussing FIG. 17 and step 1772 in particular, in someembodiments, the above range phase difference of arrival (PDoA)φ(f_(s))_(k) ^(α) ^(j) ^(,s) ^(u) measurements may be processed bycalculating a mean and a variance for each of the frequencies f_(s)where s=1 . . . L. For example, and without limiting the scope of thepresent invention, for each reader 100 number α_(j) and eachmonitoring-sensor-tag 120 number s_(u) allocated to that reader 100,calculate for each of the frequencies f_(s) where s=1 . . . L:

-   -   Mean φ(f_(s))_(k) ^(α) ^(j) ^(,s) ^(u) of the phase measurements        φ(f_(s))_(k) ^(α) ^(j) ^(,s) ^(u) between α_(j) and s_(u), k=1 .        . . M; and    -   Variance σ²(φ(f)_(k) ^(α) ^(j) ^(,s) ^(u) ) of the phase        measurements φ(f_(s))_(k) ^(α) ^(j) ^(,s) ^(u) between α_(j) and        s_(u), k=1 . . . M.

Continuing discussing FIG. 17, in some embodiments, method 1700 maycomprise step 1773. In some embodiments, step 1773 may follow step 1772.In some embodiments, step 1773 may be a step of applyingcalibration-based corrections (adjustments) to the measurements and/orcalculations of step 1772. For example, and without limiting the scopeof the present invention, if monitoring-sensor-tags 120 locations havenot been determined (calculated), then step 1773 may apply correctionφ_(delta)(f_(s))_(k) ^(α) ^(j) ^(,c) ^(i) calculated in equation (20)during described calibration process of method 1600, to the phaseφ(f_(s))_(k) ^(α) ^(j) ^(,s) ^(u) calculated above, such a correctedphase may be:φ_(corrected)(f _(s))_(k) ^(α) ^(j) ^(,s) ^(u) =φ(f _(s))_(k) ^(α) ^(j)^(,s) ^(u) +φ_(delta)(f _(s))_(k) ^(α) ^(j) ^(,c) ^(i)   (21)wherein the reference-sensor-tags 1102 number c_(i) in equation (21) maybe the one closest to reader 100 number α_(j). In some embodiments, thereference-sensor-tags 1102 number c_(i) in equation (21) may be the oneclosest in type to monitoring-sensor-tag 120 number s_(u)

In some embodiments, reader 100 may emit electromagnetic (EM) waves at anumber of pre-set frequencies f_(s). It is well known and shown that itis possible to range estimate (distance) h_(k) ^(α) ^(j) ^(,s) ^(u)between each reader 100 number α_(j) and each monitoring-sensor-tag 120number s_(u) by:

$\begin{matrix}{h^{a_{j},s_{u}} = {\frac{c}{4\pi}\frac{{\Delta\varphi}^{a_{j},s_{u}}}{\Delta\; f^{a_{j},s_{u}}}}} & (22)\end{matrix}$

where Δö_(k) ^(α) ^(j) ^(,s) ^(u) is a phase difference between twovalues of phase φ_(corrected)(f_(s))_(k) ^(α) ^(j) ^(,s) ^(u)corresponding to two different frequencies from the set of frequenciesf_(s), and Δf_(k) ^(α) ^(j) ^(,s) ^(u) is the difference between thesaid two different frequencies. In some embodiments, equation (22) isused to calculate the range estimate (distance) h_(k) ^(α) ^(j) ^(,s)^(u) between each reader 100 number α_(j) and each monitoring-sensor-tag120 number s_(u). Continuing discussing FIG. 17, in some embodiments,method 1700 may comprise step 1777. In some embodiments, step 1777 mayfollow step 1773. In some embodiments, step 1777 may be a step of(non-transitory) saving determined (calculated) locations for the one ormore monitoring-sensor-tags 120 to memory 1803.

Note, in some embodiments, calculations carried out in methods 1500,1600, and/or 1700 may be carried out by processor 1801 (see e.g., FIG.18).

FIG. 18 may depict a block diagram of reader 100 (or ofreader-and-calibration-member 1109), processor 1801, memory 1803, adisplay 1805, a position-reference-member 1204, and amaterial-of-interest 1828 with one or more monitoring-sensor-tags 120.In some embodiments, FIG. 18 may depict a system 1800 for non-invasivemonitoring of material-of-interest 1828 with one or moremonitoring-sensor tag 120 using one or more readers 100 (or using atleast one reader-and-calibration-member 1109 with one or more readers100).

Continuing discussing FIG. 18, in some embodiments, system 1800 maycomprise one or more monitoring-sensor-tags 120 and one or more readers100. In some embodiments, the one or more readers 100 and the one ormore monitoring-sensor-tags 120 may be in wireless communications witheach other.

Continuing discussing FIG. 18, the one or more monitoring-sensor-tags120 may be as discussed previously above for monitoring-sensor-tags 120.For example, and without limiting the scope of the present invention,the one or more monitoring-sensor-tags 120 may be “attached to”material-of-interest 1828, wherein “attached to” has been describedabove.

Continuing discussing FIG. 18, the one or more readers 100 may be asdiscussed previously above for readers 100. In some embodiments, each ofthe one or more readers 100 may comprise one or more second-antennas110; whereas a term of “first-antennas 130” may be antennas of the oneor more monitoring-sensor-tags 120. In some embodiments, the one or morereaders 100 using their one or more second-antennas 110 may transmitselectromagnetic (EM) radiation (e.g., radio waves) of a predeterminedcharacteristic. Such a transmission may be directed to the one or moremonitoring-sensor-tags 120, specifically to their first-antennas 130.Such that first-antennas 130 (of the one or more monitoring-sensor-tags120) may receive this electromagnetic (EM) radiation of thepredetermined characteristic as an input. In some embodiments, thisinput may cause the at least one electric circuit 140 (of the one ormore monitoring-sensor-tags 120) to take the one or more readings fromthe at least one sensor (e.g., 202 and/or 203); and to then transmit theone or more readings using the first-antennas 130 back to the one ormore second-antennas 110 of the one or more readers 100. In someembodiments, at least one of the second-antennas 110 selected from theone or more second-antennas 110 then receives the one or more readings;and the one or more readers 100 or a device 1807 in communication withthe one or more readers 100 may then use the one or more readings todetermine a “current state” (as them term has been discussed previously)of material-of-interest 1828.

In some embodiments, material-of-interest 1828 shown in FIG. 18 may berepresentative of any materials-of-interest discussed previously herein,such as, but not limited to: dental-filling 1001; root-canal-post 1004;dental-crown 1005; an article implantable within a body of an organism;the article attachable to the body of the organism; specific tissue ofthe organism; and/or the construction member. As noted, in someembodiments, the article may be selected from: a medical device; atissue graft; a bone graft; an artificial tissue; a bolus withtime-release medication; and/or a medication. As noted, in someembodiments, the medical device may be dental-implant 1007 and/orimplant-post 1008. As noted, in some embodiments, the organism may be ahuman, such as patient 1328. As noted, in some embodiments, the tissuemay be tooth 1000, gum 1002, and/or root-canal-cavity 1003 and/or anyother tissue of the organism.

Continuing discussing FIG. 18, in some embodiments, system 1800 mayfurther comprise device 1807 that may be in communication with the oneor more readers 100 and that may then use the one or more readings todetermine a current state of material-of-interest 1828. In someembodiments, this device 1807 may comprise processor 1801 and memory1803. In some embodiments, device 1807 may be a computing device and/ora computer. In some embodiments, processor 1801 may be in communicationwith the one or more second-antennas 110. In some embodiments, disposedbetween processor 1801 and the one or more second-antennas 110 may beantenna-interface 1115, as that component has been discussed previously.In some embodiments, antenna-interface 1115 may be in communication withboth the one or more second-antennas 110 and processor 1801. In someembodiments, memory 1803 may be in communication with processor 1801. Insome embodiments, memory 1803 may be in communication with processor1801 as well as with antenna-interface 1115 and/or the one or moresecond-antennas 110. In some embodiments, non-transitorily stored inmemory 1803 may be code (i.e., the software) for instructing processor1801 how to interpret the current state by processing the one or morereadings received at the at least one of the second-antennas 110selected from the one or more second-antennas 110. In some embodiments,data; information, the one or more readings; measurement results;calculation results; the “additional information”; and/or the like maybe non-transitorily stored in memory 1803.

Note, in some embodiments, instead of a separate device 1807 as notedabove, each reader 100 may itself comprise antenna-interface 1115,processor 1801, and memory 1803. Whereas, in other embodiments, device1807 may be integrated with the one more readers 100.

In some embodiments, memory 1803 may store (hold) information on avolatile or non-volatile medium, and may be fixed and/or removable. Insome embodiments, memory 1803 may include a tangible computer readableand computer writable non-volatile recording medium, on which signalsare stored that define a computer program (i.e., the code or thesoftware) or information to be used by the computer program. Therecording medium may, for example, be hard drive, disk memory, flashmemory, and/or any other article(s) of manufacture usable to record andstore information (in a non-transitory fashion). In some embodiments, inoperation, processor 1801 may cause(s) data (such as, but not limitedto, information, the one or more readings; measurement results;calculation results; the “additional information”; and/or the like) tobe read from the nonvolatile recording medium into a volatile memory(e.g., a random access memory, or RAM) that may allow for more efficient(i.e., faster) access to the information by processor 1801 as comparedagainst the nonvolatile recording medium. Memory 1803 may be located indevice 1807 and in communication with processor 1801. See e.g., FIG. 18.In some embodiments, processor 1801 may manipulate(s) the data and/orinformation within integrated circuit memory (e.g., RAM) and may thencopy the data to the nonvolatile recording medium (e.g., memory 1803)after processing may be completed. A variety of mechanisms are known formanaging data movement between the nonvolatile recording medium and theintegrated circuit memory element, and the invention is not limited toany mechanism, whether now known or later developed. The invention isalso not limited to a particular processing unit (e.g., processor 1801)or storage unit (e.g., memory 1803).

Continuing discussing FIG. 18, in some embodiments of system 1800 theone or more second-antennas 110 may have known (or determinable)positional locations. As previously discussed, locations of the one ormore readers 100 (or locations of the second-antennas 110) may bedetermined via wireless communications between the one or more readers100 (via their one or more second-antennas 110) and one or morereference-sensor-tags 1102 (via their at least one fourth-antennas).And/or as previously discussed, locations of the one or more readers 100(or locations of the second-antennas 110) may be determined via wirelesscommunications between the one or more readers 100 (via their one ormore second-antennas 110) and one or more position-reference-tag 1203(via their at least one third-antennas). That is in some embodiments,system 1800 may further comprise one or more reference-sensor-tags 1102and/or system 1800 may further comprise one or moreposition-reference-tag 1203. See e.g., FIG. 18. As discussed previously,reference-sensor-tags 1102 may be housed in reference-housing-member1107. As discussed previously, reference-sensor-tags 1102 may be fixedwith respect to second-antennas 110; even in embodiments where thesecond-antennas 110 may be translating with respect to origin 1325(e.g., the systems of FIG. 13A and of FIG. 13C) (because thereader-and-calibration-member 1109 housing the second-antennas 110 maybe translating together as a unit). As previously discussed, in someembodiments, position-reference-tags 1203 may be housed inposition-reference-member 1204. As previously discussed, in someembodiments, position-reference-tags 1203 and position-reference-member1204 may be stationary; i.e., fixed with respect to an origin 1325; evenwhen second-antennas 110 may be translating as shown in FIG. 13A and inFIG. 13C (because the reader-and-calibration-member 1109 housing thesecond-antennas 110 may be translating while position-reference-member1204 remains stationary). Note, in some embodiments of system 1800,position-reference-member 1204 (with position-reference-tags 1203) maybe optional or not included. In any event, because locations (positions)of second-antennas 110 (or readers 100) may be determinable and thusknown; then processor 1801 running the code (i.e., the software or thecomputer program) non-transitorily stored in memory 1803 may beinstructed by that code, using these known positional locations of theone or more second-antennas 110 and using communications from thefirst-antennas 130, may then determine (calculate) positional locationsof the one or more monitoring-sensor-tags 120.

Continuing discussing FIG. 18, in some embodiments, reader 100 maycomprise the one or more second-antennas 110; one or morereference-sensor-tags 1102; and antenna-interface 1115. In someembodiments, the one or more reference-sensor-tags 1102 may be fixedrelative to the one or more second-antennas 110. In some embodiments,reader 100 may comprise one or more reference-housing-member 1107;wherein each reference-housing-member 1107 may comprise the one or morereference-sensor-tags 1102. Thus, reader 100 may function asreader-and-calibration-member 1109; which is why reader 100 in FIG. 18is also noted as reader-and-calibration-member 1109. In someembodiments, one or more second-antennas 110 may have known (ordeterminable) positional locations relative to: a known origin (e.g.,origin 1325), known reference-sensor-tags 1102 locations, and/or knownposition-reference-tag 1203 locations.

In some embodiments, one or more readers 100 may be disposed withinreader-and-calibration-member 1109 and the one or more second-antennas110 may have known positional locations relative to: a known origin(e.g., origin 1325), known reference-sensor-tags 1102 locations, and/orknown position-reference-tag 1203 locations. See e.g., FIG. 11A, FIG.11B, and FIG. 18.

FIG. 19A may show, in general, how complex permittivity of a givenmaterial (including biologic materials) may vary according to changes infrequency. FIG. 19A may show two graphs depicting real and imaginaryparts ε_(r)′ and ε_(r)″, respectively, of complex permittivity ε _(r) asa function of alternating current (AC) frequency. In FIG. 19A, real andimaginary parts ε_(r)′ and ε_(r)″, respectively, of complex permittivityε _(r) may be denoted on the vertical axis; while the frequency may bedenoted on the horizontal axis. In FIG. 19A, the real part, ε_(r)′, mayalso be denoted by reference numeral 1901. In FIG. 19A, the imaginarypart, ε_(r)″, may also be denoted by reference numeral 1902.

The complex permittivity ε _(r), which may be referred to as a complexdielectric constant, may be expressed as:ε _(r)=ε_(r)′−ε_(r)″  (23)where ε_(r)′ is a “real” permittivity, ε_(r)″ is an imaginarypermittivity, and j is an imaginary unit.

FIG. 19A demonstrates that in some embodiments, to measure complexpermittivity of a given material, then frequency may need to be varied.

It should be noted that the “real” permittivity ε_(r)′, a real part ofcomplex permittivity ε _(r), may be referred to as the relativepermittivity of the dielectric material ε_(r).

FIG. 19B may be a perspective view of a capacitor 1905 connected to analternating current (AC) voltage source 1906. Current 1910 may thus flowvia capacitor 1905. In some embodiments, this capacitor 1905 maycomprise two substantially parallel plates 400 that may be separated bydielectric material 401. In some embodiments, such plates 400 may beseparated from each other by a distance of d. In some embodiments,plates 400 may be constructed from substantially conductive materials.

It should be appreciated by those of ordinary skill in the relevant artthat one may find current 1910 flowing via capacitor 1905 by:

$\begin{matrix}{I_{s} = \frac{V_{s}}{Z}} & (24)\end{matrix}$where V_(s) is a complex representation of the voltage of thealternating current (AC) voltage source 1906, I_(s) is a complexrepresentation of current 1910 flowing via capacitor 1905, and Z iscomplex impedance of capacitor 1905.

It should be appreciated by those of ordinary skill in the relevant artthat capacitor 1905 may be represented by a number of representativecircuits. FIG. 19C may depict a schematic view of a possible capacitorrepresentative circuit 1909 of capacitor 1905 from FIG. 19B. Capacitorrepresentative circuit 1909 may comprise of an ideal resistor 1907 andan ideal capacitor 1908, connected in parallel, see e.g., FIG. 19C.

FIG. 19D may depict a schematic view of capacitor representative circuit1909, connected to the alternating current (AC) voltage source 1906.

Complex admittance Y of the capacitor 1905 may be expressed as:

$\begin{matrix}{Y = {\frac{1}{Z} = {\frac{j\;\omega\; A\; ɛ_{0}{\overset{\_}{ɛ}}_{r}}{d} = {\frac{j\;\omega\; A\;{ɛ_{0}\left( {ɛ_{r}^{\prime} - {j\; ɛ_{r}^{''}}} \right)}}{d} = {\frac{j\;\omega\; A\; ɛ_{0}ɛ_{r}^{\prime}}{d} + \frac{\omega\; A\; ɛ_{0}ɛ_{r}^{''}}{d}}}}}} & (25) \\{\mspace{79mu}{Y = {\frac{1}{Z} = {{G + {jB}} = {{j\;\omega\; C} + \frac{1}{R}}}}}} & (26)\end{matrix}$where Z is complex impedance of capacitor 1905, G and B are conductanceand susceptance, respectively of capacitor 1905, ω is the angularfrequency of the alternating current (AC) voltage source 1906, A is anarea of each of the conductive plates 400, d is a width of thedielectric material 401 between the conductive plates 400, ε₀≅8.85·10⁻¹²F/m is vacuum permittivity constant, C is the capacitance of the idealcapacitor 1908 and R is the resistance of the ideal resistor 1907.

Based on equations (25) and (26) one may express real and imaginaryparts ε_(r)′ and ε_(r)″, respectively, via real and imaginary componentsG and B, respectively, of the complex admittance Y:

$\begin{matrix}{ɛ_{r}^{\prime} = \frac{Bd}{\omega\; A\; ɛ_{0}}} & (27) \\{ɛ_{r}^{''} = \frac{Gd}{\omega\; A\; ɛ_{0}}} & (28)\end{matrix}$

Based on equations (25) and (26) one may express real and imaginaryparts ε_(r)′ and ε_(r)″, respectively, via components C and R,respectively, of the possible representative circuit 1909 of capacitor1905:

$\begin{matrix}{ɛ_{r}^{\prime} = \frac{Cd}{A\; ɛ_{0}}} & (29) \\{ɛ_{r}^{''} = \frac{d}{\omega\; A\; ɛ_{0}R}} & (30)\end{matrix}$

Thus, FIG. 19B, FIG. 19C, and FIG. 19D may show how relatively simplecircuits may be employed so that complex permittivity of a givenmaterial may be measured. FIG. 19B, FIG. 19C, and FIG. 19D maydemonstrate relationships between complex permittivity of a givenmaterial and the parameters of the electric elements, such as capacitorscomprising the given material. FIG. 19B, FIG. 19C, and FIG. 19D may alsodemonstrate how complex permittivity of a given material may beexpressed via measuring parameters of the electric circuits comprisingsaid capacitor.

FIG. 19E may show, in general, how complex permittivity of a givenmaterial (including biologic materials) may vary according to changes inexcitation source as well as changes in frequency. Excitation sources(inputs) may be selected from one or more of: visible light, infrared(IR) light, ultraviolet (UV) light, electromagnetic (EM) radiation,ultrasonic sound, temperature, pH, and/or the like—of predeterminedcharacteristics (e.g., predetermined frequency, wavelength, temperature,etc.). The pairs of complex permittivity values [ε′_(r1), ε″_(r1)],[ε′_(r1), ε″_(r1)], [ε′_(r1), ε″_(r1)] shown in FIG. 19E may depictchanges in complex permittivity of the same material under differentexcitation conditions. For example the graphs 1911, 1912 in FIG. 19Ecorrespond to the pairs [E′_(r1), ε″_(r1)] may be obtained withoutexcitation sources. The graphs 1913, 1914 in FIG. 19E correspond to thepairs [ε₂, ε″_(r2)] may be obtained when exposing a given material undertest with infrared (IR) light of predetermined frequency. While, thegraphs 1915, 1916 in FIG. 19E correspond to the pairs [ε′_(r3), ε″_(r3)]may be obtained when applying infrared (IR) light of yet anotherfrequency to that same given material. A significance of using variouspredetermined excitation sources, of predetermined characteristics, maybe in obtaining a more specific response or a more complete response,which could be then used to identify various conditions of the givenmaterial under test better rather than without using excitation sources.

FIG. 19F may be a view of a capacitor 1905 connected to an alternatingcurrent (AC) voltage source 1906, wherein dielectric material 401,disposed between opposing capacitor plates 400 of capacitor 1905, may beexposed to one or more types of excitation sources, of predeterminedcharacteristics. Current 1910 may flow via capacitor 1905. In someembodiments, this capacitor 1905 may comprise two substantially parallelplates 400 that may be separated by dielectric material 401. In someembodiments, plates 400 may be constructed from substantially conductivematerials. In some embodiments dielectric material 401 may be subjectedto external excitation sources including, but not limited to, infrared(IR) light source 1917, LED light source 1918, ultraviolet (UV) lightsource 1919, and/or sonic or ultrasonic sound source 1920—all ofpredetermined characteristics. As is conventional, LED may be one ormore light emitting diodes. LED light source 1919 may emit visiblelight, IR light, UV light, and/or the like. And 1921 in FIG. 19F may bearray-of-excitation-sources 1921 which may house one or more of: IRlight source 1917, LED light source 1918, UV light source 1919, and/orsonic or ultrasonic sound source 1920. In some embodiments, inapplication, dielectric material 401 may be material-of-interest 2201and/or implant 2431.

FIG. 20A may depict a schematic block diagram ofcomplex-monitoring-sensor-tag 2020 comprising a complex-impedance-sensor2010. In some embodiments, any given monitoring-sensor-tag 120 may bereplaced with a given complex-monitoring-sensor-tag 2020. In someembodiments, a given complex-monitoring-sensor-tag 2020 may comprisewireless-receiver-and-transmitter 207, processing circuitry 204,complex-impedance-measurement-circuit 2011, and complex-impedance-sensor2010. In some embodiments, processing circuitry 204 may be incommunication with complex-impedance-measurement-circuit 2011. In someembodiments, processing circuitry 204 may be in communication withwireless-receiver-and-transmitter 207. In some embodiments,complex-impedance-measurement-circuit 2011 may be in communication withcomplex-impedance-sensor 2010.

In some embodiments, complex-impedance-measurement-circuit 2011 maymeasure the complex impedance of complex-impedance-sensor 2010 toquantify a current state reading of material-of-interest (such asmaterial-of-interest 2201 or of implant 2431) thatcomplex-monitoring-sensor-tag 2020 may be attached to. In someembodiments, complex-impedance-measurement-circuit 2011 may interpret,calculate, and/or measure inputs received at the complex impedance ofcomplex-impedance-sensor 2010 to quantify a current state reading ofmaterial-of-interest (such as material-of-interest 2201 or of implant2431) that complex-monitoring-sensor-tag 2020 may be attached to. Insome embodiments, processing circuitry 204 may controlcomplex-impedance-measurement-circuit 2011 and process the one or morereadings (the obtained results) received by complex-impedance-sensor2010, for radio-frequency transmission (or for other electromagnetictransmission); e.g., via wireless-receiver-and-transmitter 207. In someembodiments, wireless-receiver-and-transmitter 207 may transmit the oneor more readings (the obtained results) to reader 100. In someembodiments, wireless-receiver-and-transmitter 207 may receiveinstructions from reader 100 using electromagnetic (EM) waves; such as,but not limited to radio wavelength electromagnetic (EM) waves. Seee.g., FIG. 20A.

In some embodiments, monitoring-sensor-tag 120 shown in FIG. 1B may becomplex-monitoring-sensor-tag 2020. In such embodiments,complex-monitoring-sensor-tag 2020 may comprise at least one antenna 130and at least one electric circuit 140; which may be in communicationwith each other. In some such embodiments, at least one antenna 130 (ofcomplex-monitoring-sensor-tag 2020) may comprisewireless-receiver-and-transmitter 207. In some embodiments, at least oneelectric circuit 140 (of complex-monitoring-sensor-tag 2020) maycomprise processing circuitry 204. In some embodiments, at least oneelectric circuit 140 (of complex-monitoring-sensor-tag 2020) maycomprise processing circuitry 204 andcomplex-impedance-measurement-circuit 2011. In some embodiments, atleast one electric circuit 140 (of complex-monitoring-sensor-tag 2020)may comprise processing circuitry 204,complex-impedance-measurement-circuit 2011, and complex-impedance-sensor2010. See e.g., FIG. 20A, FIG. 20B, FIG. 25A, FIG. 25B, FIG. 25C, FIG.25D, and FIG. 1B.

FIG. 20B may depict a schematic block diagram ofcomplex-monitoring-sensor-tag 2020 comprising a complex-impedance-sensor2010, similar to that as shown in FIG. 20A, but wherein in FIG. 20B,complex-monitoring-sensor-tag 2020 may further comprisearray-of-excitation-sources 1921. In some embodimentsarray-of-excitation-sources 1921 may comprise and/or house one or more:IR light source 1917, LED light source 1918, UV light source 1919,and/or a sonic or ultrasonic sound source 1920; wherein such sources ofexternal excitation emit of a predetermined characteristic (e.g.,predetermined frequency/wavelength). In some embodiments, the one ormore external excitation sources of array-of-excitation-sources 1921 maybe in electrical communication with one or more ofcomplex-impedance-measurement-circuit 2011 and/or processing circuitry204. In some embodiments, the one or more external excitation sources ofarray-of-excitation-sources 1921 may be controlled by one or more ofcomplex-impedance-measurement-circuit 2011 and/or processing circuitry204. See e.g., FIG. 20B.

In some embodiments, wireless-receiver-and-transmitter 207 may be knownas the “at least one antenna” and/or as the “at least one differentantenna.” In some embodiments, the at least one antenna may be a givenwireless-receiver-and-transmitter 207. In some embodiments, the at leastone different antenna may be a given wireless-receiver-and-transmitter207. In some embodiments, the at least one antenna, the at least onedifferent antenna, and/or wireless-receiver-and-transmitter 207 may be atype of excitation source, emitting electromagnetic (EM) radiation(e.g., radio waves) of a predetermined frequency.

In some embodiments, the at least one electric circuit may be processingcircuitry 204 and/or complex-impedance-measurement-circuit 2011. In someembodiments, the at least one different electric circuit may beprocessing circuitry 204 and/or complex-impedance-measurement-circuit2011.

In some embodiments, the at least one sensor may be a givencomplex-impedance-sensor 2010. In some embodiments, the at least onedifferent sensor may be a given complex-impedance-sensor 2010.

FIG. 21A may depict a schematic block diagram of a resistor 2103 withresistance R_(L) and a load 2101 with complex impedance Z connectedserially to the alternating current (AC) voltage source 1906. It shouldbe appreciated by those of ordinary skill in the relevant art that onemay find the value of the complex impedance Z by:

$\begin{matrix}{Z = {R_{L}\frac{V_{2}}{V_{1} - V_{2}}}} & (31)\end{matrix}$where V₁ is a complex representation of the voltage of the alternatingcurrent (AC) voltage source 1906 measured at point 2104 and V₂ is acomplex representation of the voltage across the load 2101 measured atpoint 2105. In some embodiments, point 2104 and point 2105 may bedisposed at opposite sides of resistor 2103. Thus, FIG. 21A may depict acircuit where complex impedance may be determined.

FIG. 21B may depict a schematic block diagram of resistor 2103 withresistance R_(L) and with load 2101 with complex impedance Z connectedserially to an alternating current (AC) current source 2106. The valueof the complex impedance Z may be determined using equation (31) notedabove. Thus, FIG. 21B may depict a circuit where complex impedance maybe determined.

Basic techniques for measuring complex impedance or complex permittivitymay be understood in the relevant art. See e.g., J. Walworth, “Measuringcomplex impedances at actual operating levels,” Electronics, 47(15), pp.117-118, 1974; and see also R. H. Johnson, N. M. Pothecary, M. P.Robinson, A. W. Preece and C. J. Railton, “Simple non-invasivemeasurement of complex permittivity,” in Electronics Letters, vol. 29,no. 15, pp. 1360-1361, 22 Jul. 1993.

FIG. 22A may depict a schematic view of an example of a two electrodeelectrochemical impedance spectroscopy (EIS) application. FIG. 22A maydepict a schematic block diagram of a two-electrode complex impedancemeasuring technique using alternating current (AC) current source 2106and two electrodes 2203 attached to material-of-interest 2201. Voltagemeter 2205 measures complex voltage across the two electrodes 2203. Insome embodiments, material-of-interest 2201 may be at least a portion oftissue (e.g., skin) or a cell of patient 1328.

FIG. 22B may depict a schematic view of an example of a four electrodeelectrochemical impedance spectroscopy (EIS) application. FIG. 22B maydepict a schematic block diagram of a four-electrode complex impedancemeasuring technique using alternating current (AC) current source 2106,two electrodes 2203 attached to the material-of-interest 2201, andanother two electrodes 2204 attached to the material-of-interest 2201.Voltage meter 2205 measures complex voltage across the two electrodes2204.

Basic techniques for measuring impedance using two or four electrodesmay be understood in the relevant art. See e.g., Millard, S. G.“Reinforced concrete resistivity measurement techniques,” In:Proceedings of Institution of Civil Engineers, Part 2: Research andTheory, pp. 91:71-88, 1991.

FIG. 23A may be a top view of a four-terminal probe; with substantiallyparallel regions of a conductive surface of type “G” 2309 and 2310. Insome embodiments, conductive surface of type “G” 2309 and 2310 may bemounted to the substrate 403. In some embodiments, substrate 403 may bea dielectric material. In some embodiments, conductive surface of type“G” 2309 and 2310 may be constructed from electrically conductivematerials of construction. In some embodiments, conductive surface oftype “G” 2309 and 2310 may be arranged in pairs of substantiallyparallel rows in a spiral fashion with substrate 403 disposed betweenor/and under such substantially parallel rows; for example, and withoutlimiting the scope of the present invention, arranged as conductivewires in concentric circles on a dielectric substrate.

In some embodiments, FIG. 23A may depict at least a portion of a fourterminal complex impedance measuring sensor. In some embodiments, FIG.23A may be at least a portion of complex-impedance-sensor 2010.

FIG. 23B may be a top view of a four-terminal probe; with substantiallyparallel regions of a conductive surface of type “H” 2311 and 2312. Insome embodiments, conductive surface of type “H” 2311 and 2312 may bemounted to the substrate 403. In some embodiments, substrate 403 may bea dielectric material. In some embodiments, conductive surface of type“H” 2311 and 2312 may be constructed from electrically conductivematerials of construction. In some embodiments, conductive surface oftype “H” 2311 and 2312 may be arranged in pairs of substantiallyparallel rows in a spiral fashion with substrate 403 disposed betweenor/and under such substantially parallel rows; for example, and withoutlimiting the scope of the present invention, arranged as conductivewires in concentric circles on a dielectric substrate.

In some embodiments, FIG. 23B may depict at least a portion of a fourterminal complex impedance measuring sensor. In some embodiments, FIG.23B may be at least a portion of complex-impedance-sensor 2010.

FIG. 23C may be a top view of two four-terminal probes; with regions ofa conductive surface of type “I” 2313 and 2314; and with regions of aconductive surface of type “J” 2315 and 2316. In some embodiments,conductive surface of type “I” 2313 and 2314 and conductive surface oftype “J” 2315 and 2316 may each be mounted to a same substrate 403. Insome embodiments, substrate 403 may be a dielectric material. In someembodiments, conductive surface of type “I” 2313 and 2314 and conductivesurface of type “J” 2315 and 2316 may be constructed from electricallyconductive materials of construction. In some embodiments, conductivesurface of type “I” 2313 and 2314 may be arranged in concentric circles(e.g., in a bull's eye fashion) with substrate 403 disposed between suchconcentric circles. In some embodiments, conductive surface of type “J”2315 and 2316 may be arranged in concentric squares with substrate 403disposed between or/and under such concentric squares.

In some embodiments, FIG. 23C may depict at least a portion of a fourterminal complex impedance measuring sensor. In some embodiments, FIG.23C may be at least a portion of complex-impedance-sensor 2010.

FIG. 23D may be a view of two different opposed terminal probes; ofregions of a conductive surface of type “K” 2317 mounted tomaterial-of-interest 2201. In some embodiments, conductive surface oftype “K” 2317 may be constructed from electrically conductive materialsof construction. In some embodiments a plurality of infrared (IR) lightsources of type “A” 2318 and/or a plurality of infrared (IR) lightsources of type “B” 2319 may be affixed in the vicinity (e.g., within apredetermined distance in some embodiments) of the two different opposedterminal probes; of regions of a conductive surface of type “K” 2317 inorder to expose material-of-interest 2201 to external excitation source,such as, but not limited to, infrared (IR) light. In some embodimentsthe plurality of infrared (IR) light sources of type “A” 2318 or theplurality of infrared (IR) light sources of type “B” 2319 may be of apredetermined frequency (e.g., monochromatic). In some embodiments, theplurality of infrared (IR) light sources of type “A” 2318 or theplurality of infrared (IR) light sources of type “B” 2319 may be ofcoherent emission type. In some embodiments, a plurality of infrared(IR) light source of type “B” 2319 may be present to exposematerial-of-interest 2201 to external excitation source of a differenttype or characteristic from infrared (IR) light source of type “A” 2318.For example, and without limiting the scope of the present invention,such as an IR light source of a different frequency than the IR lightsource of type “A” 2318. In some embodiments, the plurality of infrared(IR) light source of type “B” 2319 may be visible light sources,ultraviolet (UV) light sources, and/or ultrasonic (or sonic) soundsources.

In some embodiments, the plurality of infrared (IR) light sources oftype “A” 2318 or/and the plurality of infrared (IR) light sources oftype “B” 2319 may be part of the array-of-excitation-sources 1921.

It can be appreciated by one skilled in the art that the plurality ofinfrared (IR) light sources of type “A” 2318, the plurality of infrared(IR) light sources of type “B” 2319, visible light sources, ultravioletlight sources, or ultrasonic sound sources should be powered by anelectric energy source.

FIG. 24A may depict a system for non-invasive monitoring of amaterial-of-interest (e.g., material-of-interest 2201, not shown in FIG.24A) with lattice-of-sensors 2423 that may be in and/or on patient 1328.In some embodiments, reader-and-calibration-member 1109 may be used tointerrogate lattice-of-sensors 2423. In some embodiments,lattice-of-sensors 2423 may comprise a plurality ofcomplex-monitoring-sensor-tags 2020 (e.g., first-sensor-tag 2420 and/orsecond-sensor-tag 2421) and/or a plurality of sensors (e.g.,first-sensor-type 2406 and/or second-sensor-type 2407), see FIG. 24B fordetails of lattice-of-sensors 2423. In some embodiments,material-of-interest 2201 may be on or in patient 1328. In someembodiments, material-of-interest 2201 may be at least a portion oftissue (e.g., skin) or a cell of patient 1328. In some embodiments,lattice-of-sensors 2423 may be located under cast-or-bandage 2401. Insome embodiments, lattice-of-sensors 2423 may be on an interior-surface2402 of cast-or-bandage 2401 (see FIG. 24D for interior-surface 2402 ofcast-or-bandage 2401).

In some embodiments, cast-or-bandage 2401 may be: a cast, a bandage, adressing, gauze, a compression bandage, an elastic bandage, tape,kinesiology tape, KT tape, elastic therapeutic tape, strapping, webbing,a patch, a sling, a splint, or the like.

In some embodiments, lattice-of-sensors 2423 may be in physical contactwith at least portions of material-of-interest 2201, and thuslattice-of-sensors 2423 may be used to monitor material-of-interest 2201for various states of material-of-interest 2201. For example, andwithout limiting the scope of the present invention, the system and/orconfiguration shown in FIG. 24A may be used and useful for monitoringhealing of wounds and/or of skin of patient 1328; whereinmaterial-of-interest 2201 may a portion of the wound and/or the skin.

For example, and without limiting the scope of the present invention,the system and/or configuration shown in FIG. 24A may be used and usefulfor monitoring status (state) (e.g., healing or recovery progression) oftissue of interest (e.g., a region of skin) in a burn victim.

For example, and without limiting the scope of the present invention,the system and/or configuration shown in FIG. 24A may be used and usefulfor monitoring status (state) (e.g., healing or recovery progression) oftissue of interest (e.g., a region of skin) of various skin cancers.

For example, and without limiting the scope of the present invention,the system and/or configuration shown in FIG. 24A may be used and usefulfor monitoring status (state) (e.g., healing or recovery progression) oftissue of interest (e.g., a region of skin) of various dermatologicalissues, such as, but not limited to, rashes.

Changes in measured complex impedance of material-of-interest 2201(e.g., tissue, cells, or a cell), may also indicate problems in patient1328, such as, but not limited to, infection, decay, dying tissue,and/or the like.

And recall such monitoring and/or tacking via the system and/orconfiguration of FIG. 24A may be done non-invasively and with minimal tono ionizing radiation.

Continuing discussing FIG. 24A, in some embodiments,reader-and-calibration-member 1109 may be handheld. In some embodiments,reader-and-calibration-member 1109 may be mobile. In some embodiments,reader-and-calibration-member 1109 may be used to interrogatelattice-of-sensors 2423. In some embodiments,reader-and-calibration-member 1109 may provide the necessary electricalpower lattice-of-sensors 2423 needs to operate; and this may only occurwhen reader-and-calibration-member 1109 and lattice-of-sensors 2423 aresufficiently close to each other.

Continuing discussing FIG. 24A, in some embodiments, device 1807 may beselected from: a computer, a personal computer, a desktop computer, ahandheld computer, a laptop computer, a tablet computer, a smartphone, amobile computing device, a computing device, or the like.

Continuing discussing FIG. 24A, in some embodiments,reader-and-calibration-member 1109 and device 1807 may be incommunication with each other. In some embodiments,reader-and-calibration-member 1109 and device 1807 may be in wiredcommunication with each other. In some embodiments,reader-and-calibration-member 1109 and device 1807 may be in wirelesscommunication with each other. In some embodiments,reader-and-calibration-member 1109 and device 1807 may be attached toeach other. In some embodiments, reader-and-calibration-member 1109 anddevice 1807 may be flexibly attached to each other. In some embodiments,reader-and-calibration-member 1109 and device 1807 may be in removableconnection with each other.

In some embodiments, FIG. 24A may depict a system for non-invasivemonitoring of a material-of-interest (e.g., material-of-interest 2201,not shown in FIG. 24A) with one or more complex-monitoring-sensor-tags2020 that may be in and/or on patient 1328.

In some embodiments, lattice-of-sensors 2423 shown in FIG. 24A may bereplaced with lattice-of-sensors 1023 or with monitoring-sensor-tag 120.Compare FIG. 24A against FIG. 13C.

FIG. 24B may depict structural details of a given lattice-of-sensors2423. In some embodiments, lattice-of-sensors 2423 may be a latticeframework of a plurality of sensor-tags, such ascomplex-monitoring-sensor-tag 2020 and/or of monitoring-sensor-tag 120.In some embodiments, this plurality of sensor-tags may comprisesensor-spacing 2426; wherein sensor-spacing 2426 may be spacing betweentwo adjacent sensor-tags of lattice-of-sensors 2423. In someembodiments, sensor-spacing 2426 may be predetermined and fixed. In someembodiments, sensor-spacing 2426 may be predetermined, fixed, andsubstantially equal between various adjacent sensor-tags. In someembodiments, sensor-spacing 2426 may be predetermined, fixed, and may bedifferent distances, but known, between various adjacent sensor-tags.

Continuing discussing FIG. 24B, in some embodiments, lattice-of-sensors2423 may comprise a first-sensor-tag 2420, a lattice framework of aplurality of sensors, and a second-sensor-tag 2421. In some embodiments,first-sensor-tag 2420 may be a complex-monitoring-sensor-tag 2020 (seee.g., FIG. 20A, FIG. 20, FIG. 25A, FIG. 25B, FIG. 25C, and/or FIG. 25D).Continuing discussing FIG. 24B, in some embodiments, second-sensor-tag2421 may be another complex-monitoring-sensor-tag 2020 (see e.g., FIG.20A, FIG. 20, FIG. 25A, FIG. 25B, FIG. 25C, and/or FIG. 25D). Continuingdiscussing FIG. 24B, in some embodiments, this plurality of sensors maycomprise first-sensor-type(s) 2406 and/or second-sensor-type(s) 2407. Insome embodiments, first-sensor-type 2406 may be acomplex-impedance-sensor 2010. In some embodiments, a givenfirst-sensor-type 2406 may be a complex-impedance-sensor 2010; such asshown in FIG. 22A, FIG. 22B, FIG. 23A, FIG. 23B, FIG. 23C, or FIG. 23D.In some embodiments, second-sensor-type 2407 may be anothercomplex-impedance-sensor 2010. In some embodiments, a givensecond-sensor-type 2407 may be another complex-impedance-sensor 2010;such as shown in FIG. 22A, FIG. 22B, FIG. 23A, FIG. 23B, FIG. 23C, orFIG. 23D. Continuing discussing FIG. 24B, in some embodiments,first-sensor-type 2406 and second-sensor-type 2407 may be of differenttypes of complex-impedance-sensors 2010 with respect to each other. Insome embodiments, first-sensor-type 2406 and/or second-sensor-type 2407may in communication with first-sensor-tag 2420. In some embodiments,first-sensor-type 2406 and/or second-sensor-type 2407 may in electricalcommunication with first-sensor-tag 2420. In some embodiments,first-sensor-type 2406 and/or second-sensor-type 2407 may incommunication with second-sensor-tag 2421. In some embodiments,first-sensor-type 2406 and/or second-sensor-type 2407 may in electricalcommunication with second-sensor-tag 2421. In some embodiments,sensor-spacing 2426 may be spacing between adjacent sensors. In someembodiments, sensor-spacing 2426 may be spacing betweenfirst-sensor-type 2406 and an adjacent second-sensor-type 2407. In someembodiments, within a given lattice-of-sensors 2423 positions ofsensor-tags (e.g., first-sensor-tag 2420 and/or second-sensor-tag 2421)and positions of the plurality of sensors (e.g., first-sensor-type 2406and/or second-sensor-type 2407) may be fixed with respect to each other.In some embodiments, within a given lattice-of-sensors 2423 positions ofsensor-tags (e.g., first-sensor-tag 2420 and/or second-sensor-tag 2421)and positions of the plurality of sensors (e.g., first-sensor-type 2406and/or second-sensor-type 2407) may be known with respect to each other.See e.g., FIG. 24B. Compare FIG. 24B against FIG. 10D. Comparelattice-of-sensors 2423 against lattice-of-sensors 1023.

Continuing discussing FIG. 24B, in some embodiments, lattice-of-sensors2423 may comprise first-sensor-tag 2420, and the lattice framework ofthe plurality of sensors.

Continuing discussing FIG. 24B, in some embodiments, first-sensor-type2406 may be a complex-monitoring-sensor-tag 2020. In some embodiments,second-sensor-type 2407 may be a complex-monitoring-sensor-tag 2020.

In some embodiments, a given lattice-of-sensors 2423 may be arranged ina one dimensional, two dimensional, or three dimensional configuration.In some embodiments, a given lattice-of-sensors 2423 may be arranged inmesh configuration. In some embodiments, a given lattice-of-sensors 2423may be arranged in lattice configuration.

In some embodiments, at least a portion of a given lattice-of-sensors2423 may be substantially covered in a protective covering (e.g., aprotective film).

In some embodiments, a system for non-invasive monitoring of tissue(e.g., tissue-of-interest), may comprise at least one lattice-of-sensors(such as lattice-of-sensors 2423 and/or lattice-of-sensors 1023).

In some embodiments, material-of-interest 2201 may be atissue-of-interest. In some embodiments, material-of-interest 1028 maybe a tissue-of-interest. In some embodiments, material-of-interest 1828may be a tissue-of-interest. In some embodiments, the tissue-of-interestmay be tissue from an organism, such as, but not limited to, an organ, aportion of an organ, a bone, a joint, skin, a region of skin, a bodypart, a portion of a body part, portions thereof, combinations thereof,and/or the like.

In some embodiments, at least a portion of the at least onelattice-of-sensors 2423 may be proximate to the tissue-of-interest. Seee.g., FIG. 24A, wherein the tissue-of-interest may be skin or tissuebeneath cast-or-bandage 2401. In some embodiments, this proximatedistance may be predetermined. In some embodiments, at least a portionof the at least one lattice-of-sensors 2423, with or without aprotective covering (layer or film), may be in direct physical contactto the tissue-of-interest; e.g., when the tissue-of-interest may beskin.

In some embodiments, upon the at least one antenna (e.g., a givenwireless-receiver-and-transmitter 207) of a given lattice-of-sensors2423, receiving electromagnetic (EM) radiation of a predeterminedcharacteristic (e.g., from a reader-and-calibration-member 1109 or froma reader 100) as an input, this input may cause the at least one circuit(e.g., processing circuitry 204 and/orcomplex-impedance-measurement-circuit 2011) to take one or more readingsfrom the at least one sensor of the first-sensor-tag(complex-monitoring-sensor-tag 2020 and/or monitoring-sensor-tag 120) orfrom at least one sensor (first-sensor-type 2406 and/or 2407) selectedfrom the plurality of sensors; and to then transmit the one or morereadings using the at least one antenna; wherein this transmitted one ormore readings may be received back at reader-and-calibration-member 1109or at reader 100.

In some embodiments, the system for non-invasive monitoring of tissue,the at least one lattice-of-sensors 2423 may further comprisesecond-sensor-tag 2421. In some embodiments, second-sensor-tag 2421 maycomprise at least one different electric circuit (e.g., processingcircuitry 204 and/or complex-impedance-measurement-circuit 2011)comprising at least one different sensor (e.g., complex-impedance-sensor2010). In some embodiments, second-sensor-tag 2421 may comprise the atleast one different antenna (e.g., which may be a givenwireless-receiver-and-transmitter 207) which may be in communicationwith the at least one different electric circuit. In some embodiments,the plurality of sensors (of lattice-of-sensors 2423) may be incommunication with second-sensor-tag 2421; wherein at least a differentportion of the plurality of sensors may be physically connected tosecond-sensor-tag 2421. In some embodiments, upon the at least onedifferent antenna receiving the electromagnetic (EM) radiation of thepredetermined characteristic as the input, this input may cause the atleast one different circuit to take one or more different readings fromthe at least one different sensor of the second-sensor-tag 2421 or fromat least one sensor selected from the plurality of sensors (such as,first-sensor-type 2406 and/or second-sensor-type 2407); and to thentransmit the one or more different readings using the at least onedifferent antenna; back to a reader-and-calibration-member 1109 and/or areader 100. See e.g., FIG. 24B, FIG. 24A, and FIG. 24C.

In some embodiments, the system for non-invasive monitoring of tissue,the plurality of sensors of lattice-of-sensors 2423 may be disposedbetween first-sensor-tag 2420 and second-sensor-tag 2421. See e.g., FIG.24B.

In some embodiments, the system for non-invasive monitoring of tissue,the at least one sensor of the first-sensor-tag 2420, the at least onedifferent sensor of the second-sensor-tag 2421, or the plurality ofsensors may be selected from one or more of: a capacitive-based sensor,a resistance-based sensor, an inductance-based sensor, a permittivitybased sensor, a complex permittivity based sensor, and/or a compleximpedance based sensor.

In some embodiments, the system for non-invasive monitoring of tissue,the one or more readings (e.g., from the at least one sensor offirst-sensor-tag 2420 and/or from the plurality of sensors); and/or theone or more different readings (e.g., from the at least one differentsensor of second-sensor-tag 2421 and/or from the plurality of sensors)may convey information of one or more of: inductance, capacitance,resistance, permittivity, complex permittivity, or complex impedance.Such information received at a given reader-and-calibration-member 1109and/or a given reader 100, wherein this received information may then bestored and/or interpreted.

In some embodiments, the system for non-invasive monitoring of tissue,the at least one different circuit of first-sensor-tag 2420 may be givena complex-impedance-measurement-circuit 2011 and/or a given processingcircuitry 204.

In some embodiments, the system for non-invasive monitoring of tissue,the at least one different circuit of second-sensor-tag 2421 may begiven a complex-impedance-measurement-circuit 2011 and/or a givenprocessing circuitry 204.

Continuing discussing FIG. 24B, in some embodiments, the system fornon-invasive monitoring of tissue, each sensor selected from theplurality of sensors (e.g., first-sensor-type 2406 and/orsecond-sensor-type 2407) of lattice-of-sensors 2423 may comprises itsown measurement circuit and its own antenna; which may communicate withreader-and-calibration-member 1109 and/or with reader 100.

In some embodiments, the system for non-invasive monitoring of tissue,the at least one lattice-of-sensors 2423 may further comprisearray-of-excitation-sources 1921. In some embodiments,array-of-excitation-sources 1921 may house and/or may comprise one ormore excitation sources that may emit energy of a predeterminedfrequency. In some embodiments, the one or more excitation sources maybe IR light source 1917, LED light source 1918, UV light source 1919,and/or sonic or ultrasonic sound source 1920. In some embodiments, theone or more excitation sources of the array-of-excitation-sources 1921may be in electrical communication with the at least one electriccircuit (e.g., processing circuitry 204 and/orcomplex-impedance-measurement-circuit 2011 ofcomplex-monitoring-sensor-tag 2020 which may be first-sensor-tag 2420).In some embodiments, the one or more excitation sources of thearray-of-excitation-sources 1921 may be in electrical communication withthe at least one different electric circuit (e.g., processing circuitry204 and/or complex-impedance-measurement-circuit 2011 ofcomplex-monitoring-sensor-tag 2020 which may be second-sensor-tag 2421).Recall, in some embodiments, lattice-of-sensor 2423 (e.g., FIG. 24B) maycomprise first-sensor-tag 2420 and/or second-sensor-tag 2421; and thatfirst-sensor-tag 2420 and/or second-sensor-tag 2421 may be a givencomplex-monitoring-sensor-tag 2020 as shown in FIG. 20B and/or as shownFIG. 25D, both with a given array-of-excitation-sources 1921.

In some embodiments, the system for non-invasive monitoring of tissue,the input (e.g., from reader-and-calibration-member 1109 and/or fromreader 100) may further cause the at least one circuit (e.g., offirst-sensor-tag 2420) to cause the one or more excitation sources toemit the energy of the predetermined frequency. In some embodiments, theinput (e.g., from reader-and-calibration-member 1109 and/or from reader100) may further cause the at least one different circuit (e.g., ofsecond-sensor-tag 2421) to cause the one or more excitation sources toemit the energy of the predetermined frequency. In some embodiments, theinput (e.g., from reader-and-calibration-member 1109 and/or from reader100) may power the one or more excitation sources to emit the energy ofthe predetermined frequency.

FIG. 24C may depict another system for non-invasive monitoring ofmaterial-of-interest (e.g., material-of-interest 2201, not shown in FIG.24C) with lattice-of-sensors 2423 that may be in and/or on patient 1328.In FIG. 24C, reader-and-calibration-member 1109 and device 1807 may beas noted in the above FIG. 24A discussion; and in the earlierdiscussions of reader-and-calibration-member 1109 and of device 1807. Insome embodiments, reader-and-calibration-member 1109 may be used tointerrogate lattice-of-sensors 2423. As noted above (see e.g., FIG.24B), in some embodiments, lattice-of-sensors 2423 may comprise aplurality of complex-monitoring-sensor-tags 2020 (e.g., first-sensor-tag2420 and/or second-sensor-tag 2421) and/or a plurality of sensors (e.g.,first-sensor-type 2406 and/or second-sensor-type 2407). In someembodiments, material-of-interest 2201 may be on or in patient 1328. Insome embodiments, material-of-interest 2201 may be at least a portion oftissue (e.g., skin) or a cell of patient 1328. In some embodiments,lattice-of-sensors 2423 may be located under article-in-lattice-contact2430. In some embodiments, lattice-of-sensors 2423 may be on aninterior-surface 2402 of article-in-lattice-contact 2430 (see FIG. 24Dfor interior-surface 2402 of article-in-lattice-contact 2430).

In some embodiments, article-in-lattice-contact 2430 may be: a bra, asports bra, a brazier, an undergarment, underwear, an article ofclothing, a cast, a bandage, cast-or-bandage 2401, a dressing, gauze, acompression bandage, an elastic bandage, tape, kinesiology tape, elastictherapeutic tape, strapping, webbing, a patch, a sling, a splint,sutures, a medical device, an implant 2431, a breast implant, and/or thelike. As a category, article-in-lattice-contact 2430 may be broader andencompass cast-or-bandage 2401. As shown in FIG. 24C,article-in-lattice-contact 2430 may be bra.

Specifically as shown in FIG. 24C, article-in-lattice-contact 2430 maybe a bra, wherein lattice-of-sensors 2423 may be disposed on an insidesurface of the bra (e.g., interior-surface 2402), such that at leastportions of lattice-of-sensors 2423 may be in physical contact with skinof the breasts of patient 1328; wherein complex impedance of thecontacted skin may then may be monitored and provide state (status)information of not only such contacted skin, but also of breast tissuebeneath such skin; wherein such monitoring may be facilitated byreader-and-calibration-member 1109 interrogating lattice-of-sensors2423, with results and/or data displayed and/or stored on device 1807.By using such a system and/or configuration breast health may bemonitored and/or tracked, non-invasively and with minimal to no ionizingradiation, in real time or near real time. By using such a system and/orconfiguration breast cancers and/or breast tumors may be monitoredand/or tracked, non-invasively and with minimal to no ionizingradiation, in real time or near real.

Similarly, the system and/or configuration shown in FIG. 24C may beadapted such that article-in-lattice-contact 2430 is underwear withlattice-of-sensors 2423 in physical contact with skin of testicles, suchthat testicle health, testicular tumors, and/or testicular cancers maybe monitored and/or tracked, non-invasively and with minimal to noionizing radiation, in real time or near real time.

In some embodiments, FIG. 24C may depict a system for non-invasivemonitoring of a material-of-interest (e.g., material-of-interest 2201,not shown in FIG. 24C) with one or more complex-monitoring-sensor-tags2020 that may be in and/or on patient 1328.

In some embodiments, FIG. 24C may depict the system for non-invasivemonitoring of tissue with one or more complex-monitoring-sensor-tags2020 that may be in and/or on patient 1328.

In some embodiments, the system for non-invasive monitoring of tissue,the system further may comprise at least onereader-and-calibration-member 1109, see e.g., FIG. 24A and FIG. 24C. Insome embodiments, at least one reader-and-calibration-member 1109 mayhave its own antenna (e.g., antenna 110, see e.g., FIG. 11A, FIG. 11B,and/or FIG. 11C). In some embodiments, the at least onereader-and-calibration-member 1109 may provide the electromagnetic (EM)radiation of the predetermined characteristic as the input. In someembodiments, the at least one reader-and-calibration-member 1109 may bein radio communication with the at least one lattice-of-sensors 2423.See e.g., FIG. 24A and FIG. 24C. In some embodiments, the at least onereader-and-calibration-member 1109 may receive the one or more readingsand/or the one or more different readings.

In some embodiments, the system for non-invasive monitoring of tissue,the at least one reader-and-calibration-member 1109 may comprises one ormore reference-sensor-tags 1102. See e.g., FIG. 11A, FIG. 11B, and/orFIG. 11C.

In some embodiments, the system for non-invasive monitoring of tissue,the at least one reader-and-calibration-member 1109 may be incommunication (wireless or wired communication) with a computing device1807. In some embodiments, this computing device 1807 may perform one ormore of the following with the one or more readings (and/or with the oneor more different readings): interprets, displays, and/or stores (e.g.,in memory 1803 of device 1807). See e.g., FIG. 24A, FIG. 24C, and FIG.18.

In some embodiments, the system for non-invasive monitoring of tissue,the system may further comprise computing device 1807. See e.g., FIG.24A and FIG. 24C. In some embodiments, computing device 1807 may bemobile, as in a smartphone, tablet, laptop, and/or the like.

In some embodiments, FIG. 24D may depict a portion of cast-or-bandage2401. In some embodiments, FIG. 24D may depict an interior-surface 2402side of cast-or-bandage 2401. In some embodiments, FIG. 24D may showlattice-of-sensors 2423 against interior-surface 2402 of cast-or-bandage2401. In some embodiments, at least portions of lattice-of-sensors 2423may in physical contact with portions of interior-surface 2402. In someembodiments, at least portions of lattice-of-sensors 2423 may physicallyattached to portions of interior-surface 2402. In some embodiments, atleast portions of lattice-of-sensors 2423 and portions ofinterior-surface 2402 may be integral with each other. See e.g., FIG.24D.

In some embodiments, FIG. 24D may depict a portion ofarticle-in-lattice-contact 2430. In some embodiments, FIG. 24D maydepict an interior-surface 2402 side of article-in-lattice-contact 2430.In some embodiments, FIG. 24D may show lattice-of-sensors 2423 againstinterior-surface 2402 of article-in-lattice-contact 2430. In someembodiments, at least portions of lattice-of-sensors 2423 may inphysical contact with portions of interior-surface 2402. In someembodiments, at least portions of lattice-of-sensors 2423 may physicallyattached to portions of interior-surface 2402. In some embodiments, atleast portions of lattice-of-sensors 2423 and portions ofinterior-surface 2402 may be integral with each other. See e.g., FIG.24D.

In some embodiments, article-in-lattice-contact 2430 may be a medicaldevice and/or an implant, such as in implant 2431. See e.g., FIG. 24E.FIG. 24E may depict a diagram showing at least one lattice-of-sensors2423 that may be imbedded within a given implant 2431. For example, andwithout limiting the scope of the present invention, implant 2431 maybe: a breast implant, a medical device, a pump, a medication releasebolus, an artificial organ, an artificial bone, an artificial limb, anartificial joint, mesh (e.g., hernia repair mesh), combinations thereof,and/or the like.

FIG. 24F may depict a diagram showing at least one lattice-of-sensors2423 that may be mounted on (attached to) an external surface of a givenimplant 2431.

In some embodiments, at least one lattice-of-sensors 2423 may bepartially located on an external surface of implant 2431 and may also bepartially located within the implant 2431, i.e., a combination of FIG.24E and FIG. 24F.

In some embodiments, the system for non-invasive monitoring of tissue,this system may further comprise at least one article-in-lattice-contact2430. In some embodiments, the at least one lattice-of-sensors 2423 maybe attached to the article-in-lattice-contact 2430 such that the atleast the portion of the at least one lattice-of-sensors 2423 may beproximate to the tissue-of-interest, when the article-in-lattice-contact2430 may be removably affixed to a portion of a body. See e.g., FIG.24A, FIG. 24C, FIG. 24D, FIG. 24E, and FIG. 24F. In some embodiments,implant 2431 may be a type of article-in-lattice-contact 2430.

In some embodiments, the at least one lattice-of-sensors 2423 may beattached to an interior-surface of the article-in-lattice-contact 2430such that the at least a portion of the at least one lattice-of-sensors2423 may be proximate to the tissue-of-interest, when thearticle-in-lattice-contact 2430 may be removably affixed to a portion ofa body. See e.g., FIG. 24A, FIG. 24C, and FIG. 24D.

In some embodiments, the system for non-invasive monitoring of tissue,the at least one lattice-of-sensors 2423 may be located within thearticle-in-lattice-contact 2430 such that the at least a portion of theat least one lattice-of-sensors 2423 may be proximate to thearticle-in-lattice-contact 2430, when the article-in-lattice-contact2430 may be removably affixed to a portion of a body. See e.g., FIG. 24Ewhere implant 2431 may be a type of article-in-lattice-contact 2430.

In some embodiments, the system for non-invasive monitoring of tissue,the at least one lattice-of-sensors 2423 may be located on an exteriorsurface of the article-in-lattice-contact 2430 such that the at least aportion of the at least one lattice-of-sensors 2423 may be proximate tothe article-in-lattice-contact 2430 and/or proximate to thetissue-of-interest, when the article-in-lattice-contact 2430 may beremovably affixed to a portion of a body. See e.g., FIG. 24F whereimplant 2431 may be a type of article-in-lattice-contact 2430.

In some embodiments, the system for non-invasive monitoring of tissue,the one or more readings (e.g., from first-sensor-tag 2420 and/or fromthe plurality of sensors); and/or the one or more different readings(e.g., from second-sensor-tag 2421 and/or from the plurality of sensors)may be transmitted through the at least one article-in-lattice-contact2430 while the article-in-lattice-contact 2430 may be removably affixedto the portion of the body.

FIG. 25A may depict additional details of a givencomplex-monitoring-sensor-tag 2020, in a schematic block diagram. Insome embodiments, complex-monitoring-sensor-tag 2020 may comprisewireless-receiver-and-transmitter 207, processing circuitry 204,complex-impedance-measurement-circuit 2011, and complex-impedance-sensor2010, see e.g., FIG. 20A. In some embodiments, complex-impedance-sensor2010 may comprise at least two electrodes 2203, that may be in physicalcontact with material-of-interest 2201, as shown in FIG. 25A.

Here in FIG. 25A, additional details ofcomplex-impedance-measurement-circuit 2011 may be shown. In someembodiments, complex-impedance-measurement-circuit 2011 may compriseresistor 2103, point 2104, point 2105, analyzer 2511, andvariable-frequency-AC-source 2512. In some embodiments, resistor 2103may be disposed between point 2104 and point 2105. In some embodiments,analyzer 2511 may be in communication with processing circuitry 204,point 2104, and point 2105. In some embodiments,variable-frequency-AC-source 2512 may be in communication withprocessing circuitry 204, wireless-receiver-and-transmitter 207, point2104, and an electrode 2203 of complex-impedance-sensor 2010.

In some embodiments, variable-frequency-AC-source 2512 may perform afunction of an alternating current (AC) voltage source (e.g., 1906) orof an alternating current (AC) current source (e.g., 2106). In someembodiments, variable-frequency-AC-source 2512 may change its frequency.Therefore, determination of the complex impedance or complexpermittivity of material-of-interest 2201 may be done at differentfrequencies, as may be desirable. In some embodiments, processingcircuitry 204 may control variable-frequency-AC-source 2512. In someembodiments, wireless-receiver-and-transmitter 207 may controlvariable-frequency-AC-source 2512. In some embodiments, both processingcircuitry 204 and wireless-receiver-and-transmitter 207 may controlvariable-frequency-AC-source 2512. In some embodiments, the carrierfrequency of wireless-receiver-and-transmitter 207 may be supplied tovariable-frequency-AC-source 2512. Techniques for designing and buildingvariable frequency alternating current (AC) sources are well understoodin the relevant art and should be appreciated by those of ordinary skillin the relevant art.

Continuing discussing FIG. 24A, in some embodiments, analyzer 2511 maybe used to determine the value of the complex impedance or complexpermittivity of material-of-interest 2201.

It should be appreciated by those of ordinary skill in the relevant artthat one of the ways that one may find the value of the compleximpedance Z of material-of-interest 2201 may be in using equation (31)which will be copied below for convenience:

$\begin{matrix}{Z = {R_{L}\frac{V_{2}}{V_{1} - V_{2}}}} & (31)\end{matrix}$where V₁ is a complex representation of the voltage at point 2104 and V₂is a complex representation of the voltage at point 2105, and R_(L) isthe known impedance of resistor 2103.

The analyzer 2511 may be connected to point 2104 and point 2105. Theknown impedance of resistor 2103 may be available in digital or analogueform to analyzer 2511 as well in order to obtain the value of thecomplex impedance Z of material-of-interest 2201.

Basic techniques for realizing a variant of analyzer 2511 may beunderstood in the relevant art. See e.g., J. Walworth, “Measuringcomplex impedances at actual operating levels,” Electronics, 47(15), pp.117-118, 1974.

FIG. 25B may depict additional details of a givencomplex-monitoring-sensor-tag 2020, in a schematic block diagram. Insome embodiments, complex-monitoring-sensor-tag 2020 may comprisewireless-receiver-and-transmitter 207, processing circuitry 204,complex-impedance-measurement-circuit 2011, and complex-impedance-sensor2010, see e.g., FIG. 20A. In some embodiments, complex-impedance-sensor2010 may comprise at least two electrodes 2203, that may be in physicalcontact with material-of-interest 2201, as shown in FIG. 25B.

Here in FIG. 25B, additional details ofcomplex-impedance-measurement-circuit 2011 may be shown. In someembodiments, complex-impedance-measurement-circuit 2011 may compriseresistor 2103, point 2104, point 2105, analyzer 2511, andfrequency-divider 2513. In some embodiments, resistor 2103 may bedisposed between point 2104 and point 2105. In some embodiments,analyzer 2511 may be in communication with processing circuitry 204,point 2104, and point 2105. In some embodiments, frequency-divider 2513may be in communication with processing circuitry 204,wireless-receiver-and-transmitter 207, point 2104, and an electrode 2203of complex-impedance-sensor 2010.

Continuing discussing FIG. 25B, in some embodiments, frequency-divider2513 may be programmable. In some embodiments, frequency-divider 2513may perform a function of controllably reducing the carrier frequency ofwireless-receiver-and-transmitter 207, supplied to frequency-divider2513. Therefore, determination of the complex impedance or complexpermittivity of material-of-interest 2201 may be done at differentfrequencies, as may be desired. In some embodiments, processingcircuitry 204 may control frequency-divider 2513. In some embodiments,wireless-receiver-and-transmitter 207 may control frequency-divider2513. In some embodiments, both processing circuitry 204 andwireless-receiver-and-transmitter 207 may control frequency-divider2513. As a result, frequency range from zero up to the carrier frequencyof wireless-receiver-and-transmitter 207, may be produced byfrequency-divider 2513 in order to determine the complex impedance orcomplex permittivity of material-of-interest 2201 at differentfrequencies. Techniques for designing programmable frequency dividersare well understood in the relevant art and should be appreciated bythose of ordinary skill in the relevant art.

In some embodiments, variable-frequency-AC-source 2512 and/orfrequency-divider 2513 may be examples ofmeans-to-supply-variable-frequencies to material-of-interest 2201.

In some embodiments, the system for non-invasive monitoring of tissue,the complex-impedance-measurement-circuit 2011 (which may be a componentof the at least one electric circuit of first-sensor-tag 2420) maycomprise a variable-frequency-AC-source 2512 that may use a frequencysupplied by the at least one antenna (e.g., awireless-receiver-and-transmitter 207), so that complex impedance may bemeasured within a predetermined ranges of frequencies. See e.g., FIG.25A. That is, the complex-monitoring-sensor-tag 2020 shown in FIG. 25Amay be first-sensor-tag 2420 of lattice-of-sensors 2423 shown in FIG.24B.

In some embodiments, the system for non-invasive monitoring of tissue,the complex-impedance-measurement-circuit 2011 (which may be a componentof the at least one electric circuit of first-sensor-tag 2420) maycomprise a frequency-divider 2513 that may use a frequency supplied bythe at least one antenna (e.g., a wireless-receiver-and-transmitter207), to measure complex impedance within a range of frequencies. Seee.g., FIG. 25B. That is, the complex-monitoring-sensor-tag 2020 shown inFIG. 25B may be first-sensor-tag 2420 of lattice-of-sensors 2423 shownin FIG. 24B.

See e.g., complex-monitoring-sensor-tag 2020 of FIG. 25A, FIG. 25B, FIG.25C, and/or FIG. 25D. In some embodiments, first-sensor-tag 2420 (seee.g., FIG. 24B) may be a complex-monitoring-sensor-tag 2020 (see e.g.,FIG. 20A, FIG. 20B, FIG. 25A, FIG. 25B, FIG. 25C, and FIG. 25D). In someembodiments, the at least one antenna of first-sensor-tag 2420 may bewireless-receiver-and-transmitter 207 of complex-monitoring-sensor-tag2020.

In some embodiments, the system for non-invasive monitoring of tissue,the complex-impedance-measurement-circuit 2011 (which may be a componentof the at least one different electric circuit of second-sensor-tag2421) may comprise a variable-frequency-AC-source 2512 that may use afrequency supplied by the at least one different antenna (e.g., awireless-receiver-and-transmitter 207), so that complex impedance may bemeasured within a predetermined ranges of frequencies. See e.g., FIG.25A. That is, the complex-monitoring-sensor-tag 2020 shown in FIG. 25Amay be second-sensor-tag 2421 of lattice-of-sensors 2423 shown in FIG.24B.

In some embodiments, the system for non-invasive monitoring of tissue,the complex-impedance-measurement-circuit 2011 (which may be a componentof the at least one different electric circuit of second-sensor-tag2421) may comprise frequency-divider 2513 that may use a frequencysupplied by the at least one different antenna (e.g., awireless-receiver-and-transmitter 207), to measure complex impedancewithin a range of frequencies. See e.g., FIG. 25B. That is, thecomplex-monitoring-sensor-tag 2020 shown in FIG. 25B may besecond-sensor-tag 2421 of lattice-of-sensors 2423 shown in FIG. 24B.

See e.g., complex-monitoring-sensor-tag 2020 of FIG. 25A, FIG. 25B, FIG.25C, and/or FIG. 25D. In some embodiments, second-sensor-tag 2421 (seee.g., FIG. 24B) may be a complex-monitoring-sensor-tag 2020 (see e.g.,FIG. 20A, FIG. 20B, FIG. 25A, FIG. 25B, FIG. 25C, and FIG. 25D). In someembodiments, the at least one different antenna of second-sensor-tag2421 may be wireless-receiver-and-transmitter 207 ofcomplex-monitoring-sensor-tag 2020.

FIG. 25C may depict additional details of a givencomplex-monitoring-sensor-tag 2020, in a schematic block diagram. Insome embodiments, complex-monitoring-sensor-tag 2020 may comprisewireless-receiver-and-transmitter 207, processing circuitry 204,complex-impedance-measurement-circuit 2011, and complex-impedance-sensor2010, see e.g., FIG. 20A. In some embodiments, complex-impedance-sensor2010 may comprise at least two electrodes 2203, that may be in physicalcontact with material-of-interest 2201, as shown in FIG. 25C.

Here in FIG. 25C, additional details ofcomplex-impedance-measurement-circuit 2011 may be shown. In someembodiments, complex-impedance-measurement-circuit 2011 may comprisevariable resistor 2514, point 2104, point 2105, analyzer 2511, andvariable-frequency-AC-source 2512. In some embodiments, variableresistor 2514 may be disposed between point 2104 and point 2105. In someembodiments, analyzer 2511 may be in communication with processingcircuitry 204, point 2104, point 2105, and variable resistor 2514. Insome embodiments, variable-frequency-AC-source 2512 may be incommunication with processing circuitry 204,wireless-receiver-and-transmitter 207, point 2104, and an electrode 2203of complex-impedance-sensor 2010.

Continuing discussing FIG. 25C, in some embodiments, variable resistor2514 may be programmable. In some embodiments, analyzer 2511 may performa function of controlling the impedance of variable resistor 2514.Therefore, determination of the complex impedance or complexpermittivity of material-of-interest 2201 may be done at differentimpedance levels of variable resistor 2514, as may be desired. In someembodiments, processing circuitry 204 may control variable resistor2514. In some embodiments, analyzer 2511 may control variable resistor2514. In some embodiments, both processing circuitry 204 and analyzer2511 may control variable resistor 2514. Techniques for designingvariable resistors are well understood in the relevant art and should beappreciated by those of ordinary skill in the relevant art.

FIG. 25D may depict additional details of thecomplex-monitoring-sensor-tag 2020 of FIG. 20B, in a schematic blockdiagram. In some embodiments, complex-monitoring-sensor-tag 2020 shownin FIG. 25D may be substantially similar to thecomplex-monitoring-sensor-tag 2020 shown in FIG. 25C, except in FIG.25D, complex-monitoring-sensor-tag 2020 may further comprisearray-of-excitation-sources 1921. As noted, in some embodiments,array-of-excitation-sources 1921 may house and/or may comprise one ormore excitation sources, such as, but not limited to, IR light source1917, LED light source 1918, UV light source 1919, and/or sonic soundsource 1920, as shown in FIG. 20B. Continuing discussing FIG. 25D, insome embodiments, the one or more excitation sources ofarray-of-excitation-sources 1921 may be in electrical communication withprocessing circuitry 204. In some embodiments, the one or moreexcitation sources of array-of-excitation-sources 1921 may be controlledby processing circuitry 204. In some embodiments, processing circuitrymay control the one or more excitation sources ofarray-of-excitation-sources 1921. In some embodiments, processingcircuitry 204 may also be known as the “at least one electric circuit”and/or as the “at least one different electric circuit.”

Continuing discussing FIG. 25D, in some embodiments, the one or moreexcitation sources of array-of-excitation-sources 1921 may be proximate(e.g., within a predetermined distance) to material-of-interest 2201;such that at least some of the emitted energy from the one or moreexcitation sources of array-of-excitation-sources 1921 may be receivedat material-of-interest 2201, such as at a surface ofmaterial-of-interest 2201.

Continuing discussing FIG. 25D, in some embodiments,array-of-excitation-sources 1921 may be attached to, next to, adjacentto, and/or part of complex-impedance-sensor 2010.

In some embodiments, a given array-of-excitation-sources 1921, with theone or more excitation sources, may be incorporated into a givencomplex-monitoring-sensor-tag 2020 of FIG. 25A, FIG. 25B, and/or FIG.25C; specifically at least attached to (and/or adjacent to) a givencomplex-impedance-sensor 2010, in some embodiments.

In some embodiments, the system for non-invasive monitoring of tissue,may be further characterized as a system for non-invasive detection ofproblems, conditions, and/or substances of interest withintissue-of-interest (e.g., material-of-interest 2201); wherein theseproblems, conditions, and/or substances may be selected from one or moreof: biological cells (e.g., foreign cells, abnormal cells, cancerouscells, etc.), infection, fever, inflammation, antigens, antibodies,foreign substances, tissue conditions, ailments, disease state, and/orthe like. Such detection may be a subset of monitoring.

FIG. 32 may depict a flow diagram illustrating steps in a method 1535 afor monitoring material-of-interest 2201. In some embodiments, one ormore complex-monitoring-sensor-tag 2020 may be employing electrochemicalimpedance spectroscopy (EIS). In some embodiments, method 1500 maycomprise step 1535 a. In some embodiments, step 1535 a may follow step1534. In some embodiments, step 1535 a may be a step of the reader 100(or the reader-and-calibration-member 1109 or the computing device 1807)instructing (i.e., commanding and/or requesting) the one morecomplex-monitoring-sensor-tag 2020.

Continuing discussing FIG. 32, in some embodiments, method 1535 a maycomprise step 3201; wherein step 3201 may be a step of selecting another(or a first) frequency point for which complex impedance may be measuredat. In some embodiments, selecting the next frequency point in step 3201may involve selecting a value of frequency at which a complex impedanceof material-of-interest 2201 has not yet been measured. In someembodiments, selecting the next frequency point in step 3201 may involveselecting a value of frequency at which a complex impedance ofmaterial-of-interest 2201 has already been measured but under differentoptions; which may include, but may not be limited to, enabling or notenabling excitation sources or enabling different types or combinationsof excitation sources among other options. For such different types ofexcitation sources, see e.g., array-of-excitation-sources 1921 of FIG.20B.

As depicted in FIG. 19A, real and imaginary parts ε_(r)′ and ε_(r)″,respectively, of complex permittivity ε_(r) may be a function ofalternating current (AC) frequency and may be determined atpredetermined quantity of frequency values f=[f₁, f₂, . . . , f_(N),]where f is a vector of N frequencies [f₁, f₂, . . . , f_(N),], at whichreal and imaginary parts ε_(r)′ and ε_(r)″, respectively, of complexpermittivity ε _(r) may be determined.

Using equations (27) and (28) which are copied below for convenience,

$\begin{matrix}{ɛ_{r}^{\prime} = \frac{Bd}{\omega\; A\; ɛ_{0}}} & (27) \\{ɛ_{r}^{''} = \frac{Gd}{\omega\; A\; ɛ_{0}}} & (28)\end{matrix}$one may express real and imaginary parts ε_(r)′ and ε_(r)″ respectively,of complex permittivity ε _(r), via real and imaginary components G andB, respectively, of the complex admittance,

$Y = {{G + {jB}} = \frac{1}{Z}}$where Z is the complex impedance. The values of complex impedance Z,from which complex permittivity ε _(r) may be determined, may bemeasured at N pre-defined frequencies [f₁, f₂, . . . , f_(N),].

Therefore, in step 3201 another value of frequency from the vector [f₁,f₂, . . . , f_(N),] may be selected for which complex impedance has notyet been measured (or previously measured, but under different options[conditions]).

Continuing discussing FIG. 32, in some embodiments method 1535 a mayutilize array-of-excitation-sources 1921, with one or moreexcitation-sources, as described in the discussion of FIG. 19F and inFIG. 20B.

Continuing discussing FIG. 32, in some embodiments, method 1535 a maycomprise step 3202. In some embodiments, step 3202 may follow step 3201.In some embodiments, step 3202 may be a step of determining if the oneor more excitation-sources which may be included in thearray-of-excitation-sources 1921 are to be enabled. If yes, then method1535 a may progress to step 3203. If no, then method 1535 a may progressto step 3204. In some embodiments, criteria for evaluating step 3202 maycomprise, but may not be limited to, predetermined settings.

Continuing discussing FIG. 32, in some embodiments, method 1535 a maycomprise step 3203. In some embodiments, step 3203 may follow a “yes”outcome of step 3202. In some embodiments, step 3203 may be a step ofchoosing and enabling one or more excitation-sources which may beincluded in array-of-excitation-sources 1921.

Note, different materials-of-interest (such as differentmaterial-of-interest 2201) may exhibit different complex impedance orcomplex permittivity values at the same frequencies when subjected toexposure of external excitation-sources.

As noted in the discussion of FIG. 19F and FIG. 20B,array-of-excitation-sources 1921 may comprise one or more of: IR lightsource 1917, LED light source 1918, UV light source 1919, and/or sonicor ultrasonic sound source 1920. As noted in the discussion of FIG. 23D,array-of-excitation-sources 1921 may comprise the plurality of IR lightsources of type “A” 2318 or/and the plurality of infrared (IR) lightsources of type “B”.

In some embodiments, the plurality of infrared IR light sources of type“A” 2318 and/or the plurality of IR light sources of type “B” 2319 maybe of a predetermined frequency (e.g., monochromatic). In someembodiments, the plurality of IR light sources of type “A” 2318 and/orthe plurality of IR light sources of type “B” 2319 may be of coherentemission type.

Continuing discussing FIG. 32, in some embodiments, method 1535 a maycomprise step 3204. In some embodiments, step 3204 may follow a “no”outcome of step 3202. In some embodiments, step 3203 may be a step ofobtain measurement of complex impedance of material-of-interest 2201when optionally present excitation-sources, such asarray-of-excitation-sources 1921 are not activated and/or not enabled,therefore not influencing characteristics of material-of-interest 2201.

Continuing discussing FIG. 32, in some embodiments, method 1535 a maycomprise step 3205. In some embodiments, step 3205 may follow step 3204.In some embodiments, step 3205 may be a step of determining if moremeasurements of material-of-interest 2201 are required and/or desired(according to predetermined criteria). If yes, then method 1535 mayprogress back to step 3201. If no, then method 1535 may progress tocompletion of method 1535 a.

In some embodiments, criteria for evaluating step 3205 may comprise, butmay not be limited to, enabling or not enabling excitation-sources,using different types or combinations of excitation-sources, performingEIS measurements at different frequency ranges, performing EISmeasurements at different values of an alternating current (AC) currentsource 2106 or different values of an alternating current (AC) voltagesource 1906, among other predetermined options.

Continuing discussing method 1535 a of FIG. 32, in some embodiments theanalysis of the material-of-interest 2201 based on the performedmeasurements

may include comparing the obtained measurements of complex impedance orcomplex permittivity to the previous measurements performed under thesame or sufficiently similar conditions such as the choice of type andcombination of excitation-sources, frequency range among, other options.Changes in the material-of-interest 2201 that had occurred since theprevious measurements may provide a basis for qualitative orquantitative assessment of such changes.

Continuing discussing method 1535 a of FIG. 32, in some embodiments theanalysis of the material-of-interest 2201 based on the performedmeasurements may include comparing the obtained measurements of compleximpedance or complex permittivity to the available referencemeasurements of the material-of-interest 2201 performed under the sameor sufficiently similar conditions such as the choice of type andcombination of excitation-sources, frequency range, among other options.

For example, and without limiting the scope of the present invention, insome embodiments, subjecting the material-of-interest 2201 toexcitation-source of predefined characteristic, such as IR light of acertain frequency, may yield a characteristic change in the obtainedmeasurements of complex impedance or complex permittivity as compared tothe absence of the said excitation-source.

In some embodiments, subjecting the material-of-interest 2201 toexcitation-source of predefined characteristic, such as IR light ofcertain frequency may yield a characteristic measurements of compleximpedance or complex permittivity as compared to the reference data.

And such principles are not limited to IR light sources, but may beapplied to visible light, UV light, LED light, and/or sound ofpredetermined characteristics.

Therefore, some embodiments, of the present invention may be used todetect specific problems, conditions, and/or substances ofmaterial-of-interest (e.g., 2201, 1028, and/or 1828), such as, but notlimited to, biological cells (e.g., foreign cells, abnormal cells,cancerous cells, etc.), infection, fever, inflammation, antigens,antibodies, foreign substances, tissue conditions, ailments, and/or thelike. Detection may be a subset of monitoring. For example, and withoutlimiting the scope of the present invention, by virtue of detecting acharacteristic measurement(s) of complex impedance or complexpermittivity, with or without excitation source or sources, or by virtueof detecting a characteristic change in the obtained measurements ofcomplex impedance or complex permittivity as compared to themeasurements of complex impedance or complex permittivity in the absenceof the said excitation-source or sources.

Some embodiments of the present invention may also be used to detectspecific problems, conditions, and/or substances of material-of-interest(e.g., 2201, 1028, and/or 1828), such as, but not limited to, biologicalcells (e.g., foreign cells, abnormal cells, cancerous cells, etc.),infection, fever, inflammation, antigens, antibodies, foreignsubstances, tissue conditions, ailments, and/or the like; by virtue ofdetecting a characteristic change in the obtained measurement(s) ofcomplex impedance or complex permittivity under influence of excitationsource or sources as compared to the measurements of complex impedanceor complex permittivity when subjected to the excitation-source orsources of a different nature (including but not limited to thefrequency of the IR excitation source for example).

To demonstrate application of the points above, let us assume that thegraphs 1911, 1912 of FIG. 19E correspond to vectors of complexpermittivity of the material-of-interest 2201 [ε′_(r1), ε″_(r1)]measured at a pre-defined frequency range [f₁,f₂] and obtained withoutexcitation sources.

Let us assume that the graphs 1913, 1914 of FIG. 19E correspond to thevectors of complex permittivity of the material-of-interest 2201[ε′_(r2), ε″_(r2)] measured at the pre-defined frequency range [f₁,f₂]and obtained when exposing a given material under test (or undermonitoring or under observation) with infrared (IR) light ofpredetermined frequency.

Let us assume that the graphs 1915, 1916 of FIG. 19E correspond to thevectors of complex permittivity of the material-of-interest 2201[ε′_(r3), ε″_(r3)] measured at the pre-defined frequency range [f₁, f₂]and obtained when applying IR light of yet another frequency to thatsame given material-of-interest 2201.

The following vectors may be used to identify or detect specificproblems, conditions, and/or substances, such as, but not limited to,biological cells (e.g., foreign cells, abnormal cells, cancerous cells,etc.), infection, fever, inflammation, antigens, antibodies, foreignsubstances, tissue conditions, ailments, and/or the like. The vectors(32), (33), (34), values of which over the frequency range [f₁,f₂] orits sub-ranges will serve to identify or detect specific problems,conditions, and/or substances:[ε_(r1),ε″_(r1)]  (32)[ε′_(r2),ε″_(r2)]  (33)[ε′_(r3),ε″_(r3)]  (34)

The vectors (35) and (36), values of which over the frequency range[f₁,f₂] or its sub-ranges may serve to identify or detect specificproblems, conditions, and/or substances. The vectors (35) and (36) mayrepresent the difference in the vectors of complex permittivity of thematerial-of-interest 2201 introduced by excitation source(s).[ε_(r2)−ε′_(r1),ε″_(r2)−ε′_(r1)]  (35)[ε′_(r3)−ε′_(r1))ε″_(r3)−ε′_(r1)]  (36)

The vectors (37), (38), and (39) values of which over the frequencyrange [f₁,f₂] or its sub-ranges will serve to identify or detectspecific problems, conditions, and/or substances.[ε′_(r1)−ε′_(r1_ref),ε″_(r1)−ε′_(r1_ref)]  (37)[ε′_(r2)−ε′_(r2_ref),ε″_(r2)−ε′_(r2_ref)]  (38)[ε′_(r3)−ε′_(r3_ref),ε″_(r3)−ε′_(r3_ref)]  (39)where [ε′_(r1_ref)], [ε″_(r1_ref)], [ε′_(r2_ref), ε″_(r2_ref)],[ε′_(r3_ref), ε″_(r3_ref)] are reference values of vectors of complexpermittivity of the material-of-interest 2201 measured at thepre-defined frequency range [f₁,f₂] at the same or materially(substantially) similar conditions and under the influence of the sameexcitation sources as the vectors of complex permittivity of thematerial-of-interest 2201 [ε′_(r1), ε″_(r1)], [ε′_(r2), ε″_(r2)],[ε′_(r3), ε″_(r3)] respectively.

The vectors (37), (38), and (39) may represent the measure of closenessof the measured values of vectors of complex permittivity [ε′_(r1),ε″_(r1)], [ε′_(r2),ε″_(r2)], [ε′_(r3),ε″_(r3)] to the reference valuesof vectors of complex permittivity [ε′_(r1_ref)], [ε″_(r1_ref)],[ε′_(r2_ref), ε″_(r2_ref)], [ε′_(r3_ref), ε″_(r3_ref)], respectively, ofthe known specific problems, conditions, and/or substances, under thesame excitation sources or the lack thereof.

FIG. 26 may depict a portion of a material-of-interest 2687, with aplurality of monitoring-sensor-tags 120; wherein the plurality ofmonitoring-sensor-tags 120 may be on and/or within material-of-interest2687. In some embodiments, material-of-interest 2687 may be a structuralmember, an engineering member, and/or a construction member. Forexample, and without limiting the scope of the present invention, insome embodiments, material-of-interest 2687 may be a portion ofconcrete, cement, masonry, and/or the like. FIG. 26 may also showsections 2688, which may be sections of material-of-interest 2687. Insome embodiments, a given section 2688 may comprise one or moremonitoring-sensor-tags 120 distributed within that given section 2688.

FIG. 27A may depict an imaging-device 2712 for interrogating (reading)at least some of the plurality of monitoring-sensor-tags 120 that may beon and/or within material-of-interest 2687. In FIG. 27A, a portion ofmaterial-of-interest 2687 may be shown with at least some of theplurality of monitoring-sensor-tags 120. In some embodiments,imaging-device 2712 may comprise a frame-member 2711 and one or morereader-assemblys 2709. In some embodiments, the one or morereader-assemblys 2709 may be attached to the frame-member 2711. In someembodiments, the frame-member 2711 may be a structural member. In someembodiments, each given reader-assembly 2709 may comprise necessaryelectronics for reading (interrogating) monitoring-sensor-tags 120.

FIG. 27B may show a top view of a given reader-assembly 2709 shown inFIG. 27A. FIG. 27C may be an orthogonal view (e.g., a side view) of thereader-assembly 2709 shown in FIG. 27B. FIG. 27B may show a givenreader-assembly 2709 that may be used to image (e.g., read) radiationemitted from at least some of the monitoring-sensor-tags 120, that maybe located on and/or within material-of-interest 2687. In someembodiments, reference-sensor-tags 1102 may be mounted onreference-housing-member 1107. In some embodiments,reference-housing-member 1107 may be attached to a portion of frame 2724of the given reader-assembly 2709. In some embodiments, readers 100 maybe mounted on reader-housing-member 1108. In some embodiments,reader-housing-member 1108 may be attached to another portion of frame2724. In some embodiments, both readers 100 and reference-sensor-tags1102 may be fixedly mounted on the frame 2724 (e.g., at differentlocations), and thus may be fixed in position relative to each other. Itcan be appreciated by one skilled in the art that the locations ofreference-sensor-tags 1102 relative to readers 100 are known parameters,or can be mathematically determined, thus allowing a calibration processto increase precision of reading monitoring-sensor-tags 120 associatedwith material-of-interest 2687. See e.g., FIG. 27B and FIG. 27C.

Continuing discussing FIG. 27A, in some embodiments, a wheel 2720 ofreader-assembly 2709 may facilitate movement of the frame 2724 across asurface of material-of-interest 2687 as portions of thismaterial-of-interest 2687 may be irradiated by readers 100. In someembodiments, an axle 2722 of wheel 2720 may be in communication withframe 2724, such that wheel 2720 may rotate about axle 2722 and wheel2720 may translate with frame 2724. In some embodiments, frame 2724 maybe attached to handle 2726. In some embodiments, handle 2726 may betelescopic. In some embodiments, handle 2726 may be attached to base2730. In some embodiments, base 2730 may be attached to frame-member2711. In some embodiments, handle 2726 may be substantially disposedwithin a hollow portion of a spring 2728. In some embodiments, wheel2720 along with handle 2726 (which may be telescopic) with spring 2728may function to retain reader-assembly 2709 on the surface ofmaterial-of-interest 2687, as the given reader-assembly 2709 (or asimage-device 2712) translates along the surface of material-of-interest2687, obtaining readings from the interrogated monitoring-sensor-tags120 associated with material-of-interest 2687. See e.g., FIG. 27B andFIG. 27C.

Continuing discussing FIG. 27B, in some embodiments, structuralcomponents of reader-assembly 2709 may comprise at least one of:reference-housing-member 1107, reader-housing-member 1108, wheel 2720,axle 2722, frame 2724, handle 2726, and/or base 2730. In someembodiments, electronics components of reader-assembly 2709 may compriseat least one of: readers 100, reference-sensor-tags 1102, and/or a powersource for readers 100. See e.g., FIG. 27B and FIG. 27C.

FIG. 28 may depict a three-dimensional Cartesian coordinate systemchosen to determine three-dimensional coordinates ofposition-reference-tag 1203, relative to which the positions of readers100 may be determined. Recall, in some embodiments, readers 100 may belocated on each reader-assembly 2709; wherein the reader-assemblies 2709may be components of imaging-device 2712. And recall, imaging-device2712 may translate along the surface of material-of-interest 2687.

Continuing discussing FIG. 28, in some embodiments, coordinates ofposition-reference-tag 1203 are specified relative to a chosen (e.g.,predetermined) Cartesian coordinate system defined by: an origin 2825,an x-axis 2820, a y-axis 2821, and a z-axis 2822. Locations ofreference-sensor-tags 1102 and locations of at least somemonitoring-sensor-tags 120 associated with material-of-interest 2687 maybe also specified relative to the chosen coordinate system. Recall, insome embodiments, reference-sensor-tags 1102 may be located on eachreader-assembly 2709; wherein the reader-assemblies 2709 may becomponents of imaging-device 2712.

Also note, any such predetermined Cartesian coordinate system as notedherein may be replaced with other coordinate systems, such as but notlimited to, radial, cylindrical, or spherical coordinate systems.

FIG. 29A may depict an embodiment of a position-reference-member 2904.In some embodiments, a given position-reference-member 2904 may besubstantially similar to a given position-reference-member 1204; exceptthe given position-reference-member 2904 may comprise a transmitter2926. In some embodiments, position-reference-member 2904 may be ahousing, an enclosure, and/or a structural member. In some embodiments,one or more position-reference-tag 1203 may be mounted or attached toposition-reference-member 2904. In some embodiments, a plurality ofposition-reference-tag 1203 may be mounted or attached toposition-reference-member 2904. In some embodiments, a relationshipbetween position-reference-tags 1203 and position-reference-member 2904may be fixed.

Continuing discussing FIG. 29A, in some embodiments, transmitter 2926may be attached to or mounted to position-reference-member 2904. In someembodiments, transmitter 2926 may communicate wirelessly, using variouswell known wireless communication protocols, such as, but not limitedto, cellular communications, radio-based communications, WiFi, RFID,NFC, magnetic inductive communication, and/or the like. In someembodiments, transmitter 2926 may be in wireless communication withreaders 100 of reader-assembly 2709 of imaging-device 2712. In someembodiments, transmitter 2926 may be in wireless communication with oneor more of: devices 1807, reader-and-calibration-member 1109, servers3103, remote-computing-devices 3105, WANs 3101 (wide area networks),LANs 3103 (local area networks), and/or the internet 3103. In someembodiments, remote-computing-devices 3105, servers 3103, WANs 3101,LANs 3101, and/or the internet 3101 may be remotely located with respectto transmitter 2926, see e.g., FIG. 31. In some embodiments, transmitter2926 may be used to wirelessly transmit readings from readers 100. Suchreadings could denote and/or convey abnormalities and/or structuralproblems with material-of-interest 2687. Inclusion of transmitter 2926may facilitate automated, automatic, and/or remote monitoring and/ortracking of material-of-interest 2687.

In some embodiments, a quantity (predetermined) ofreader-and-calibration-member 1109 may be affixed tomaterial-of-interest 2687 (see e.g., FIG. 30), in order to providebetter precision of location information of readers 100 relative to theposition-reference-tags 1203 mounted on or attached toposition-reference-member 2904. See e.g., FIG. 29A and FIG. 30.

FIG. 29B may depict that transmitter 2926 may be connected to a device1807, such as a computer. In some embodiments, such a device 1807 maycomprise at least processor 1801 and memory 1803. Note, whileposition-reference-member 2904 may not be shown in FIG. 29B, transmitter2926 may be associated with position-reference-member 2904 as discussedabove in the FIG. 29A discussion.

FIG. 30 may be substantially similar to FIG. 28, except in FIG. 30: (a)one or more reader-and-calibration-member 1109 may be fixedly attachedto or mounted to material-of-interest 2687; (b)position-reference-member 2904 (e.g., with transmitter 2926) may beutilized instead of position-reference-member 1204; and/or (c)position-reference-member 2904 may be associated withmaterial-of-interest 2687 instead of a fixed distance frommaterial-of-interest 2687 as shown in FIG. 28. As noted above, fixedlyattaching or mounting the one or more reader-and-calibration-member 1109to material-of-interest 2687 may increase precision of various locationsmeasurements (e.g., determining positions of readers 100, which may thenbe used to determine positions of monitoring-sensor-tags 120).

FIG. 31 may depict possible remote wireless communications oftransmitter 2926. Remote-computing-device 3105 may be structurallysimilar to device 1807, but remotely located with respect to thelocation of transmitter 2926. In some embodiments,remote-computing-device 3105 may be selected from: a computer, apersonal computer, a desktop computer, a handheld computer, a laptopcomputer, a tablet computer, a smartphone, a mobile computing device, acomputing device, or the like. Note, while position-reference-member2904 may not be shown in FIG. 31, transmitter 2926 may be associatedwith position-reference-member 2904 as discussed above.

Note, any of the antennas, receives, transmitters, discussed hereinand/or shown in the associated drawing figures, as well as, IR lightsource 1917, LED light source 1918, and/or ultraviolet UV light source1919, may emit and/or may receive electromagnetic (EM) radiation (e.g.,of a predetermined frequency, including a predetermined ranges offrequency), such as, but not limited to: radio waves, UHF, microwaves,magnetic fields, visible light, UV light, IR light. Note, any of theantennas, receives, transmitters, discussed herein and/or shown in theassociated drawing figures, may communicate wirelessly, such as, but notlimited to, via: NFC (near field communication), RFID (radio frequencyID) communication, backscatter communication, magnetic inductioncommunication, and/or the like.

Monitoring-sensor-tags, systems for utilizing such, and methods of usehave been described. The foregoing description of the various exemplaryembodiments of the invention has been presented for the purposes ofillustration and disclosure. It is not intended to be exhaustive or tolimit the invention to the precise form disclosed. Many modificationsand variations are possible in light of the above teaching withoutdeparting from the spirit of the invention.

While the invention has been described in connection with what ispresently considered to be the most practical and preferred embodiments,it is to be understood that the invention is not to be limited to thedisclosed embodiments, but on the contrary, is intended to cover variousmodifications and equivalent arrangements included within the spirit andscope of the appended claims.

What is claimed is:
 1. A system for non-invasive monitoring of tissue,the system comprising: at least one lattice-of-sensors; wherein the atleast one lattice-of-sensors comprises: a first-sensor-tag; wherein thefirst-sensor-tag comprises, at least one electric circuit comprising atleast one sensor; at least one antenna in communication with the atleast one electric circuit; a plurality of sensors, not of the at leastone sensor of the first-sensor-tag, with an initial predeterminedspacing between any two adjacent sensors selected from the plurality ofsensors such that the plurality of sensors is arranged in a latticeframework; wherein the plurality of sensors are in electricalcommunication with the first-sensor-tag; wherein at least a portion ofthe plurality of sensors are physically connected to thefirst-sensor-tag; wherein a positional location according to acoordinate system of each sensor selected from the plurality of sensorsis fixed and known by the system; wherein at least a portion of the atleast one lattice-of-sensors is proximate to the tissue; wherein uponthe at least one antenna receiving electromagnetic radiation of apredetermined characteristic as an input, this input causes the at leastone circuit to take one or more readings from the at least one sensor ofthe first-sensor-tag or from at least one sensor selected from theplurality of sensors; and to then transmit the one or more readingsusing the at least one antenna; wherein the system further comprises atleast one reader-and-calibration-member; wherein the at least onereader-and-calibration-member has its own antenna; wherein the at leastone reader-and-calibration-member provides the electromagnetic radiationof the predetermined characteristic as the input; wherein the at leastone reader-and-calibration-member is in radio communication with the atleast one lattice-of-sensors; wherein the at least onereader-and-calibration-member receives the one or more readings; whereinthe at least one reader-and-calibration-member comprises two or morereference-sensor-tags that have a location known by the at least onereader-and-calibration-member.
 2. The system according to claim 1,wherein the at least one lattice-of-sensors further comprises asecond-sensor-tag; wherein the second-sensor-tag comprises: at least onedifferent electric circuit comprising at least one different sensor; atleast one different antenna in communication with the at least onedifferent electric circuit; wherein the plurality of sensors are incommunication with the second-sensor-tag; wherein at least a differentportion of the plurality of sensors are physically connected to thesecond-sensor-tag; wherein upon the at least one different antennareceiving the electromagnetic radiation of the predeterminedcharacteristic as the input, this input causes the at least onedifferent circuit to take one or more different readings from the atleast one different sensor of the second-sensor-tag or from at least onesensor selected from the plurality of sensors; and to then transmit theone or more different readings using the at least one different antenna.3. The system according to claim 2, wherein the plurality of sensors isdisposed between the first-sensor-tag and the second-sensor-tag.
 4. Thesystem according to claim 2, wherein the at least one sensor of thefirst-sensor-tag, the at least one different sensor of thesecond-sensor-tag, or the plurality of sensors are selected from one ormore of: a capacitive-based sensor, a resistance-based sensor, aninductance-based sensor, a permittivity based sensor, a complexpermittivity based sensor, or a complex impedance based sensor.
 5. Thesystem according to claim 2, wherein the one or more different readingsconvey information of one or more of: inductance, capacitance,resistance, permittivity, complex permittivity, or complex impedance. 6.The system according to claim 2, wherein the at least one differentcircuit is a complex-impedance-measurement-circuit.
 7. The systemaccording to claim 6, wherein the complex-impedance-measurement-circuitcomprises a variable frequency alternating current source that uses afrequency supplied by the at least one different antenna or comprises afrequency divider that uses the frequency supplied by the at least onedifferent antenna.
 8. The system according to claim 1, wherein the oneor more readings convey information of one or more of: inductance,capacitance, resistance, permittivity, complex permittivity, or compleximpedance.
 9. The system according to claim 1, wherein the at least onecircuit is a complex-impedance-measurement-circuit.
 10. The systemaccording to claim 9, wherein the complex-impedance-measurement-circuitcomprises a variable frequency alternating current source that uses afrequency supplied by the at least one antenna or comprises a frequencydivider that uses the frequency supplied by the at least one antenna.11. The system according to claim 1, wherein the one or more readingsare transmitted through at least a portion of the brazier at least onearticle-in-lattice-contact; wherein the at least onearticle-in-lattice-contact is configured to be removably attached to aportion of a body of a person; wherein the at least onelattice-of-sensors is attached to the at least onearticle-in-lattice-contact.
 12. The system according to claim 1, whereinthe at least one reader-and-calibration-member is in communication witha computing device; wherein the computing device performs one or more ofthe following with the one or more readings: interprets, displays, orstores.
 13. The system according to claim 12, wherein the system furthercomprises the computing device.
 14. The system according to claim 12,wherein the computing device is configured to be mobile for a user. 15.The system according to claim 1, wherein each sensor selected from theplurality of sensors comprises its own measurement circuit and its ownantenna.
 16. The system according to claim 1, wherein the at least onereader-and-calibration-member calibrates the positional location of eachsensor selected from the plurality of sensors.
 17. The system accordingto claim 1, wherein each reference-sensor-tag selected from the two ormore reference-sensor-tags is positionally fixed with a known locationrelative to the at least one reader-and-calibration-member.
 18. Thesystem according to claim 1, wherein the plurality of sensors rely onexternal communications via the at least one antenna of thefirst-sensor-tag.
 19. The system according to claim 1, wherein thesystem further comprises a second lattice-of-sensors; wherein a distancebetween the at least one lattice-of-sensors and the secondlattice-of-sensors is initially predetermined and known by the system;wherein the at least one lattice-of-sensors and the secondlattice-of-sensors are arranged in a three dimensional configurationwith respect to each other.